EN 60749-20:2003
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 20: Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme
Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20 : résistance des CMS à boîtier plastique à l'effet combiné de l'humidité et de la chaleur de soudage
Applicable aux dispositifs à semiconducteurs (dispo-sitifs discrets et circuits intégrés), cette méthode d'essai fournit des moyens d'évaluer la résistance à la chaleur de soudage des composants plastiques à montage en surface.
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic- encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2002)
General Information
Relations
Standards Content (Sample)
SLOVENSKI SIST EN 60749-20:2004
STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 20:
Resistance of plastic- encapsulated SMDs to the combined effect of moisture and
soldering heat (IEC 60749-20:2002)
ICS 31.080.01 Referenčna številka
© Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno
EUROPEAN STANDARD EN 60749-20
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2003
ICS 31.080.01
English version
Semiconductor devices -
Mechanical and climatic test methods
Part 20: Resistance of plastic-encapsulated SMDs to the combined effect
of moisture and soldering heat
(IEC 60749-20:2002)
Dispositifs à semiconducteurs - Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische Prüfverfahren
et climatiques Teil 20: Beständigkeit kunststoffverkappter
Partie 20: Résistance des CMS à boîtier oberflächenmontierbarer Bauelemente
plastique à l'effet combiné de l'humidité (SMD) gegenüber der kombinierten
et de la chaleur de soudage Beanspruchung von Feuchte und Lötwärme
(CEI 60749-20:2002) (IEC 60749-20:2002)
This European Standard was approved by CENELEC on 2002-09-24. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-20:2003 E
Foreword
The text of the International Standard IEC 60749-20:2002 was approved by CENELEC as
EN 60749-20 on 2002-09-24.
The text of this International Standard was reproduced from IEC 60749:1996, chapter 2, subclause 2.3
without change. Therefore, it has not been submitted to vote a second time and is still based on
document 47/1574/FDIS.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-01-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-10-01
Each test method governed by this standard and which is part of the series is a stand-alone
document, numbered EN 60749-2, EN 60749-3, etc. The numbering of these test methods is
sequential, and there is no relationship between the number and the test method (i.e. no grouping of
test methods). The list of these tests will be available in the CENELEC internet site and in the
catalogue.
Updating of any of the individual test methods is independent of any other part.
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-20:2002 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 60749-20:2003
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60068-2-20 1979 Basic environmental testing procedures HD 323.2.20 S3 1988
Part 2: Tests - Test T: Soldering
2) 3)
IEC 60749-3 - Semiconductor devices - Mechanical EN 60749-3 2002
and climatic test methods
Part 3: External visual examination
1)
HD 323.2.20 S3 includes A2:1987 to IEC 60068-2-20:1979.
2)
Undated reference.
3)
Valid edition at date of issue.
NORME CEI
INTERNATIONALE IEC
60749-20
INTERNATIONAL
Première édition
STANDARD
First edition
2002-09
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques et climatiques –
Partie 20:
Résistance des CMS à boîtier plastique
à l'effet combiné de l'humidité et de la
chaleur de soudage
Semiconductor devices –
Mechanical and climatic test methods –
Part 20:
Resistance of plastic-encapsulated SMDs
to the combined effect of moisture
and soldering heat
© IEC 2002 Droits de reproduction réservés ⎯ Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
CODE PRIX
T
Commission Electrotechnique Internationale PRICE CODE
International Electrotechnical Commission
ɆɟɠɞɭɧɚɪɨɞɧɚɹɗɥɟɤɬɪɨɬɟɯɧɢɱɟɫɤɚɹɄɨɦɢɫɫɢɹ
Pour prix, voir catalogue en vigueur
For price, see current catalogue
60749-20 © IEC:2002 – 3 –
CONTENTS
FOREWORD . 5
INTRODUCTION .9
1 Scope and object .11
2 Normative references.11
3 General description.11
4 Test apparatus and materials.11
5 Procedure.13
6 Information to be given in the relevant specification.25
Annex A (normative) Methods of inspection by acoustic tomography.27
Annex B (informative) Details and descriptions of test method on resistance of
plastic-encapsulated SMDs to the combined effect of moisture and soldering heat.31
60749-20 © IEC:2002 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 20: Resistance of plastic-encapsulated SMDs to
the combined effect of moisture and soldering heat
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-20 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this test method is reproduced from IEC 60749 Ed.2, chapter 2, subclause 2.3
without change. It has therefore not been submitted to vote a second time and is still based
on the following documents:
FDIS Report on voting
47/1574/FDIS 47/1576/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
Each test method governed by IEC 60749-1 and which is part of the series is a stand-alone
document, numbered IEC 60749-2, IEC 60749-3, etc. The numbering of these test methods is
sequential, and there is no relationship between the number and the test method (i.e. no
grouping of test methods). The list of these tests will be available in the IEC Internet site and
in the catalogue.
60749-20 © IEC:2002 – 7 –
Updating of any of the individual test methods is independent of any other part.
The committee has decided that the contents of this publication will remain unchanged until
2007. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
The contents of the corrigendum of August 2003 have been included in this copy.
60749-20 © IEC:2002 – 9 –
INTRODUCTION
Activity within IEC technical committee 47, working group 2, includes the generation,
coordination and review of climatic, electrical (of which only ESD, latch-up and electrical
conditions for life tests are considered), mechanical test methods, and associated inspection
techniques needed to assess the quality and reliability of the design and manufacture of
semiconductor productors and processes.
60749-20 © IEC:2002 – 11 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 20: Resistance of plastic-encapsulated SMDs to
the combined effect of moisture and soldering heat
1 Scope and object
This part of IEC 60749 applies to semiconductor devices (discrete devices and integrated
circuits).
This test method provides a means of assessing the resistance to soldering heat of plastic-
encapsulated surface mount devices (SMDs). This test is destructive.
NOTE This test is identical to the test method contained in 2.3 of chapter 2 of IEC 60749 (1996), amendment 2,
apart from the addition of this clause and clause 2 and the subsequent renumbering.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-2-20:1979, Environmental testing – Part 2: Tests – Test T: Soldering
IEC 60749-3, Semiconductor devices − Mechanical and climatic test methods − Part 3:
External visual inspection
3 General description
Package cracking and electrical failure in plastic-encapsulated SMDs can result when
soldering heat raises the vapour pressure of moisture which has been absorbed into SMDs
during storage. These problems are assessed. In this test method, SMDs are evaluated for
heat resistance after being soaked in an environment which simulates moisture being
absorbed while under storage in a warehouse or dry pack.
4 Test apparatus and materials
a) Humidity chamber
The humidity chamber shall provide an environment complying with the temperature and
relative humidity defined in item c) of clause 5.
b) Reflow soldering apparatus
The infra-red convection, the convection and the vapour-phase reflow soldering apparatus
shall provide temperature profiles complying with the conditions of soldering heat defined
in items d)1) and d)2) of clause 5. The settings of the reflow soldering apparatus shall be
adjusted by temperature profiling of the top surface of the specimen while it is undergoing
the soldering heat process, measured as shown
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.