EN 62878-1-1:2015
(Main)Device embedded substrate - Part 1-1: Generic specification - Test methods
Device embedded substrate - Part 1-1: Generic specification - Test methods
IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
Trägermaterial mit eingebetteten Bauteilen - Teil 1-1: Fachgrundspezifikation - Prüfverfahren
Substrat avec appareil(s) intégré(s) - Partie 1-1: Spécification générique - Méthodes d'essai
L'IEC 62878-1-1:2015 spécifie les méthodes d'essai pour les substrats avec appareils actifs et passifs intégrés. Les méthodes d'essai fondamentales pour les matériaux de substrats de câblage imprimé et pour les substrats eux-mêmes sont spécifiées dans l'IEC 61189-3. La présente partie de l'IEC 62878 est applicable aux substrats avec appareil(s) intégré(s) fabriqués à partir de matériaux de base organiques, y compris par exemple les appareils actifs ou passifs, les composants discrets formés lors du processus de fabrication d'une carte de câblage électronique, ainsi que les composants de feuilles minces.
Element z ugnezdenim substratom - Rodovna specifikacija - Preskusna metoda
Ta del standarda IEC 62878 določa preskusne metode za pasivne in aktivne elemente z ugnezdenimi substrati. Osnovna preskusna metoda materialov substratov tiskanih vezij in samih substratov je določena s standardom IEC 61189-3.
Ta del standarda IEC 62878 velja za elemente z ugnezdenimi substrati, proizvedene z uporabo bioloških materialov, ki vključujejo npr. aktivne in pasivne elemente, diskretne komponente, oblikovane v postopku proizvodnje elektronske plošče s tiskanim vezjem, in pločevinaste komponente.
Skupina standardov IEC 62878 ne velja niti za plast RDL niti za elektronske module, določene kot poslovni model tipa M v standardu IEC 62421.
General Information
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Element z ugnezdenim substratom - Rodovna specifikacija - Preskusna metodaTrägermaterial mit eingebetteten Bauteilen - Teil 1-1: Fachgrundspezifikation - PrüfverfahrenSubstrat avec appareil(s) intégré(s) - Partie 1-1: Spécification générique - Méthodes d'essaiDevice embedded substrate - Generic specification - Test method31.190Sestavljeni elektronski elementiElectronic component assemblies31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:EN 62878-1-1:2015SIST EN 62878-1-1:2015en01-september-2015SIST EN 62878-1-1:2015SLOVENSKI
STANDARD
EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN 62878-1-1
July 2015 ICS 31.180; 31.190
English Version
Device embedded substrate -
Part 1-1: Generic specification - Test methods (IEC 62878-1-1:2015)
Substrat avec appareil(s) intégré(s) -
Partie 1-1: Spécification générique - Méthodes d'essai (IEC 62878-1-1:2015)
Trägermaterial mit eingebetteten Bauteilen -
Teil 1-1: Fachgrundspezifikation - Prüfverfahren (IEC 62878-1-1:2015) This European Standard was approved by CENELEC on 2015-06-24. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17,
B-1000 Brussels © 2015 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62878-1-1:2015 E SIST EN 62878-1-1:2015
The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2016-03-24 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2018-06-24
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent rights.
Endorsement notice The text of the International Standard IEC 62878-1-1:2015 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-1 NOTE Harmonized as EN 60068-1. IEC 60068-2-6 NOTE Harmonized as EN 60068-2-6. IEC 60068-2-14 NOTE Harmonized as EN 60068-2-14. IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. IEC 60068-2-21 NOTE Harmonized as EN 60068-2-21. IEC 60068-2-30 NOTE Harmonized as EN 60068-2-30. IEC 60068-2-38 NOTE Harmonized as EN 60068-2-38. IEC 60068-2-53 NOTE Harmonized as EN 60068-2-53. IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58. IEC 60068-2-64 NOTE Harmonized as EN 60068-2-64. IEC 60068-2-66 NOTE Harmonized as EN 60068-2-66. IEC 60068-2-78 NOTE Harmonized as EN 60068-2-78. IEC 60068-2-80 NOTE Harmonized as EN 60068-2-80. IEC 61189-1 NOTE Harmonized as EN 61189-1. IEC 61189-2 NOTE Harmonized as EN 61189-2. IEC 61189-11 NOTE Harmonized as EN 61189-11. IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2. IEC 61190-1-3 NOTE Harmonized as EN 61190-1-3. IEC 62137-1-2 NOTE Harmonized as EN 62137-1-2. IEC 62137-1-3 NOTE Harmonized as EN 62137-1-3. IEC 62421 NOTE Harmonized as EN 62421. ISO 291 NOTE Harmonized as EN ISO 291. SIST EN 62878-1-1:2015
Normative references to international publications with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu
Publication Year Title EN/HD Year
IEC 60068-2-1 -
Environmental testing -
Part 2-1: Tests - Test A: Cold EN 60068-2-1 -
IEC 60068-2-2 -
Environmental testing -
Part 2-2: Tests - Test B: Dry heat EN 60068-2-2 -
IEC 60194 -
Printed board design, manufacture
and assembly - Terms and definitions EN 60194 -
IEC 61189-3 -
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -
Part 3: Test methods for interconnection structures (printed boards) EN 61189-3 -
IEC/TS 62878-2-4 2015
Device embedded substrate -
Part 2-4: Guidelines - Test element groups (TEG) - -
IEC 62878-1-1 Edition 1.0 2015-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Device embedded substrate –
Part 1-1: Generic specification – Test methods
Substrat avec appareil(s) intégré(s) –
Partie 1-1: Spécification générique – Méthodes d'essai
INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE
ICS 31.180; 31.190
ISBN 978-2-8322-2674-2
– 2 – IEC 62878-1-1:2015 © IEC 2015 CONTENTS FOREWORD . 5 1 Scope . 7 2 Normative references . 7 3 Terms, definitions and abbreviations . 7 3.1 Terms and definitions . 7 3.2 Abbreviations . 7 4 Test methods . 8 4.1 General . 8 4.2 Visual inspection and micro-sectioning. 8 4.2.1 General . 8 4.2.2 Visual inspection . 8 4.2.3 Micro-sectioning . 8 4.2.4 Lack of conductor and residue of conductor . 10 4.2.5 Land dimension and land width (annular ring) . 10 4.3 Electrical tests . 13 4.3.1 Conductor resistance . 13 4.3.2 Through hole and build-up via . 14 4.3.3 Withstanding current of embedded device connection . 15 4.3.4 Withstanding voltage in embedded boards . 17 4.3.5 Insulation resistance . 19 4.3.6 Conduction and insulation of circuit . 20 4.4 Mechanical tests . 20 4.4.1 Pulling strength of conductor . 20 4.4.2 Pulling strength of un-plated through hole . 21 4.4.3 Pulling strength of plated through hole . 22 4.4.4 Pulling strength of pad of land pattern . 22 4.4.5 Adhesivity of plated foil . 23 4.4.6 Adhesivity of solder resist and symbol mark. 24 4.4.7 Hardness of painted film (solder resist and symbol mark) . 28 4.5 Environmental tests . 29 4.5.1 General . 29 4.5.2 Vapour phase thermal shock . 30 4.5.3 High temperature immersion tests . 30 4.5.4 Resistance to humidity . 31 4.6 Mechanical environmental test – Resistance to migration . 34 4.6.1 General . 34 4.6.2 Equipment . 34 4.6.3 Specimen . 35 4.6.4 Test condition . 35 5 Shipping inspection . 36 5.1 General . 36 5.2 Electrical test . 37 5.2.1 General . 37 5.2.2 Test of conductor pattern not connected to an embedded component . 38 5.2.3 Test on the pattern having a passive component and a conductor pattern . 40 SIST EN 62878-1-1:2015
IEC 62878-1-1:2015 © IEC 2015 – 3 – 5.2.4 Test of a circuit having both active component(s) and a conductor pattern . 43 5.2.5 Test of a circuit having connections of both individual passive component(s) and conductor pattern . 46 5.2.6 Test of a circuit having an embedded component which cannot be checked from the surface and a conductor pattern . 47 5.3 Internal transparent test . 47 5.4 Visual test . 47 Annex A (informative)
Related test methods . 49 Bibliography . 52
Figure 1 – Measuring items of the micro-sectioned through hole structure . 9 Figure 2 – Measuring items of the micro-sectioned device
embedded board with build-up structure . 9 Figure 3 – Measurement of land dimension . 11 Figure 4 – Build-up land measurement . 12 Figure 5 – Conductor resistance measurement . 14 Figure 6 – Relationship between current, conductor width and thickness and temperature rise . 17 Figure 7 – Adhesivity of plated film . 24 Figure 8 – Single cutting tool . 25 Figure 9 – Cutter knife . 25 Figure 10 – Multiple blade cu
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