Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung Tf: Prüfung der Lötbarkeit von Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage unter Verwendung von Lotpaste

Essais d'environnement - Partie 2-83: Essais - Essais Tf: Essai de brasabilité des composants électroniques pour les composants pour montage en surface (CMS) par la méthode de la balance de mouillage utilisant de la pâte à braser

La CEI 60068-2-83:2011 fournit des méthodes d'enquêtes comparatives sur la mouillabilité des sorties métalliques ou métallisées des composants pour montage en surface (CMS) avec des pâtes à braser. Ces méthodes ne servent pas à fournir des données quantitatives absolues utilisées dans le cadre d'acceptions ou de rejets. NOTE: Différentes méthodes d'essai de brasabilité des composants pour montage en surface (CMS) sont décrites dans la CEI 60068-2-58 et dans la CEI 60068-2-69. La CEI 60068-2-58 prescrit une évaluation visuelle utilisant un bain de brasage et la méthode de refusion, la CEI 60068-2-69 prescrit une évaluation de balance de mouillage utilisant la méthode du bain de brasage et des gouttelettes de brasure.

Okoljsko preskušanje - 2-83. del: Preskusi - Preskus Tf: preskus spajkanja elektronskih komponent za površinsko montažo (SMD) z metodo za ugotavljanje omočljivosti z uporabo spajkalne paste

Ta del IEC 60068 podaja metode za primerjalno preučevanje omočljivosti kovinskih končnikov ali metaliziranih končnikov komponent za površinsko montažo (SMD) z uporabo spajkalnih past. Podatki, dobljeni s temi metodami, se ne uporabljajo kot absolutni kvantitativni podatki za namene preskusa uspešno - neuspešno.

General Information

Status
Published
Publication Date
13-Oct-2011
Drafting Committee
Parallel Committee
Current Stage
6060 - Document made available
Completion Date
14-Oct-2011

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SLOVENSKI STANDARD
SIST EN 60068-2-83:2012
01-januar-2012
2NROMVNRSUHVNXãDQMHGHO3UHVNXVL3UHVNXV7ISUHVNXVVSDMNDQMD
HOHNWURQVNLKNRPSRQHQW]DSRYUãLQVNRPRQWDåR 60' ]PHWRGR]DXJRWDYOMDQMH
RPRþOMLYRVWL]XSRUDERVSDMNDOQHSDVWH

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic

components for surface mounting devices (SMD) by the wetting balance method using

solder paste
Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung Tf: Prüfung der Lötbarkeit von
Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage
unter Verwendung von Lotpaste

Essais d'environnement - Partie 2-83: Essais - Essais Tf: Essai de brasabilité des

composants électroniques pour les composants pour montage en surface (CMS) par la

méthode de la balance de mouillage utilisant de la pâte à braser
Ta slovenski standard je istoveten z: EN 60068-2-83:2011
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.020 Elektronske komponente na Electronic components in
splošno general
SIST EN 60068-2-83:2012 en,fr,de

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN 60068-2-83:2012
---------------------- Page: 2 ----------------------
SIST EN 60068-2-83:2012
EUROPEAN STANDARD
EN 60068-2-83
NORME EUROPÉENNE
October 2011
EUROPÄISCHE NORM
ICS 19.040; 31.190
English version
Environmental testing -
Part 2-83: Tests -
Test Tf: Solderability testing of electronic components for surface
mounting devices (SMD) by the wetting balance method using solder
paste
(IEC 60068-2-83:2011)
Essais d'environnement - Umweltprüfungen -
Partie 2-83: Essais - Teil 2-83: Prüfungen -
Essais Tf: Essai de brasabilité des Prüfung Tf: Prüfung der Lötbarkeit von
composants électroniques pour les Bauelementen der Elektronik für
composants pour montage en surface Oberflächenmontage (SMD) mit der
(CMS) par la méthode de la balance de Benetzungswaage unter Verwendung von
mouillage utilisant de la pâte à braser Lotpaste
(CEI 60068-2-83:2011) (IEC 60068-2-83:2011)

This European Standard was approved by CENELEC on 2011-10-12. CENELEC members are bound to comply

with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard

the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and notified

to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,

the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,

Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,

Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60068-2-83:2011 E
---------------------- Page: 3 ----------------------
SIST EN 60068-2-83:2012
EN 60068-2-83:2011 - 2 -
Foreword

The text of document 91/975/FDIS, future edition 1 of IEC 60068-2-83, prepared by IEC/TC 91

"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by

CENELEC as EN 60068-2-83:2011.
The following dates are fixed:
(dop) 2012-07-12
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2014-10-12
• latest date by which the national
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent

rights.
Endorsement notice

The text of the International Standard IEC 60068-2-83:2011 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60068-2-69 NOTE Harmonized as EN 60068-2-69.
IEC 61189-5 NOTE Harmonized as EN 61189-5.
---------------------- Page: 4 ----------------------
SIST EN 60068-2-83:2012
- 3 - EN 60068-2-83:2011
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated

references, only the edition cited applies. For undated references, the latest edition of the referenced

document (including any amendments) applies.

NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD

applies.
Publication Year Title EN/HD Year
IEC 60068-1 - Environmental testing - EN 60068-1 -
Part 1: General and guidance
IEC 60068-2-20 2008 Environmental testing - EN 60068-2-20 2008
Part 2-20: Tests - Test T: Test methods for
solderability and resistance to soldering heat
of devices with leads
IEC 60068-2-58 - Environmental testing - EN 60068-2-58 -
Part 2-58: Tests - Test Td: Test methods for
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60194 - Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions
IEC 61190-1-3 - Attachment materials for electronic assembly -EN 61190-1-3 -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications
---------------------- Page: 5 ----------------------
SIST EN 60068-2-83:2012
---------------------- Page: 6 ----------------------
SIST EN 60068-2-83:2012
IEC 60068-2-83
Edition 1.0 2011-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-83: Tests – Test Tf: Solderability testing of electronic components for
surface mounting devices (SMD) by the wetting balance method using solder
paste
Essais d’environnement –
Partie 2-83: Essais – Essai Tf: Essai de brasabilité des composants
électroniques pour les composants pour montage en surface (CMS) par la
méthode de la balance de mouillage utilisant de la pâte à braser
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX W
ICS 19.040; 31.190 ISBN 978-2-88912-665-1
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN 60068-2-83:2012
– 2 – 60068-2-83  IEC:2011
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope ............................................................................................................................... 8

2 Normative references ....................................................................................................... 8

3 Terms and definitions ....................................................................................................... 8

4 Test .................................................................................................................................. 9

4.1 General description ................................................................................................. 9

4.2 Test methods .......................................................................................................... 9

5 Preconditioning ................................................................................................................ 9

6 Preparation .................................................................................................................... 10

6.1 Solder paste .......................................................................................................... 10

6.2 Test jig plate ......................................................................................................... 10

6.3 Specimen holder ................................................................................................... 10

7 Quick heating method ..................................................................................................... 10

7.1 Equipment ............................................................................................................. 10

7.2 Test jig plate ......................................................................................................... 11

7.3 Preparation ........................................................................................................... 12

7.4 Test condition ........................................................................................................ 12

7.4.1 Test temperature ....................................................................................... 12

7.4.2 Feed of solder paste and immersion condition ........................................... 13

7.4.3 Immersion and withdrawal conditions for test specimen ............................. 14

7.5 Test procedure ...................................................................................................... 14

7.6 Presentation of the result ...................................................................................... 15

7.7 Characterisation parameter examples ................................................................... 15

8 Synchronous method ...................................................................................................... 16

8.1 Equipment ............................................................................................................. 16

8.2 Test jig plate ......................................................................................................... 17

8.3 Synchronous fixture ............................................................................................... 17

8.4 Preparation ........................................................................................................... 17

8.5 Test condition ........................................................................................................ 17

8.5.1 Test temperature ....................................................................................... 17

8.5.2 Feed of solder paste and immersion condition ........................................... 17

8.5.3 Immersion and withdrawal conditions for the test specimen ....................... 17

8.6 Test procedure ...................................................................................................... 17

8.7 Presentation of the results ..................................................................................... 18

8.8 Characterisation parameter examples ................................................................... 19

9 Temperature profile method ............................................................................................ 19

9.1 Equipment ............................................................................................................. 19

9.2 Test jig plate ......................................................................................................... 19

9.3 Preparation ........................................................................................................... 20

9.4 Test condition ........................................................................................................ 20

9.4.1 Test temperature ....................................................................................... 20

9.4.2 Feed of solder paste and immersion condition ........................................... 21

9.4.3 Immersion and withdrawal conditions for test specimen ............................. 21

9.5 Test procedure ...................................................................................................... 21

---------------------- Page: 8 ----------------------
SIST EN 60068-2-83:2012
60068-2-83  IEC:2011 – 3 –

9.6 Presentation of the result ...................................................................................... 22

9.7 Characterisation parameter examples ................................................................... 23

Annex A (normative) Equipment for the quick heating and synchronous method .................. 24

Annex B (informative) Reading of the output data and correction of the result in the

quick heating test.................................................................................................................. 25

Annex C (normative) Test equipment for the temperature profile method ............................. 28

Annex D (informative) Reading of the output data and correction of the result in the

temperature profile test ......................................................................................................... 29

Annex E (informative) Caveats / Notes................................................................................. 32

Bibliography .......................................................................................................................... 36

Figure 1 – Examples of the quick heating method test equipment ......................................... 11

Figure 2 – Example of test jig plate for quick heating and synchronous method .................... 12

Figure 3 – Example of the temperature profile....................................................................... 13

Figure 4 – Example of applying solder paste to a test jig plate .............................................. 14

Figure 5 – Typical output shape of signal in the quick heating method .................................. 15

Figure 6 – Example of synchronous method test equipment .................................................. 16

Figure 7 – Example of synchronous fixture ........................................................................... 17

Figure 8 – Typical output shape of signal in the synchronous method ................................... 18

Figure 9 – Example of the system for temperature profile method test equipment ................. 19

Figure 10 – Example of the temperature profile ..................................................................... 20

Figure 11 – Example of applying solder paste to a test jig plate ............................................ 22

Figure 12 – Typical output shape of signal in the temperature profile method ....................... 23

Figure B.1 – Typical wetting force changes in quick heating method ..................................... 26

Figure B.2 – Example of correction of the initial time of wetting (F is larger than

0,5F ) ............................................................................................................................. 27

1,max
Figure B.3 – Example of correction of the initial time of wetting (F is 0,5F or
a 1,max

less) ..................................................................................................................................... 27

Figure D.1 – Typical output forms for profile temperature test ............................................... 30

Figure D.2 – The case when an extruding force (1,1F or larger) is generated
max

immediately after the beginning of wetting ............................................................................ 31

Figure E.1 – Explanation diagram of test procedure for the quick heating method ................. 33

Figure E.2 – Explanation diagram of test procedure for synchronous method ........................ 34

Figure E.3 – Showing the wetting force (pull) of some solder pastes ..................................... 34

Figure E.4 – Explanation diagram of the test procedure for the temperature profile

method ................................................................................................................................. 35

Table 1 – Specification of the test jig plate for quick heating and synchronous method ......... 11

Table 2 – Recommended test conditions of the quick heating and synchronous method

for rectangular SMD .............................................................................................................. 14

Table 3 – Specification of the test jig plate of the temperature profile method ....................... 20

Table 4 – Recommended test conditions of the temperature profile method for

rectangular SMD ................................................................................................................... 21

---------------------- Page: 9 ----------------------
SIST EN 60068-2-83:2012
– 4 – 60068-2-83  IEC:2011
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENVIRONMENTAL TESTING –
Part 2-83: Tests – Test Tf: Solderability testing
of electronic components for surface mounting devices (SMD)
by the wetting balance method using solder paste
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

International Standard IEC 60068-2-83 has been prepared by IEC technical committee 91:

Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/975/FDIS 91/992/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

---------------------- Page: 10 ----------------------
SIST EN 60068-2-83:2012
60068-2-83  IEC:2011 – 5 –

The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 11 ----------------------
SIST EN 60068-2-83:2012
– 6 – 60068-2-83  IEC:2011
INTRODUCTION

The International Electrotechnical Commission (IEC) draws attention to the fact that it is

claimed that compliance with this document may involve the use of patents as indicated below.

IEC takes no position concerning the evidence, validity and scope of patent rights.

The holders of the patent rights have assured the IEC that they are willing to negotiate

licences either free of charge or under reasonable and non-discriminatory terms and

conditions with applicants throughout the world. In this respect, the statement of the holders

of these patent rights are registered with IEC. Information may be obtained as indicated below.

a) EU patent 0920488.4 “Synchronous test method for assessing soldering pastes”
Gen3 Systems LTD
Unit B2
Armstrong Mall
Farnborough GU14 0NR
United Kingdom
b) JP Patent 2630712 “Testing method of characteristics of solder paste and the
equipment for the test”
Malcom Co., Ltd
4-15-10 Honmachi, Shibuya-ku
Tokyo, 151-0071
Japan
c) Patent JP 3789041 “Solderability measuring apparatus”
Patent JP 3552061 “Solderability tester and solderability test method”

Patent JP 3498100 “Method and device for testing solderability and microcrucible for

testing”
Patent JP 3153884 “Measuring device for soldering performance of cream solder”
Tarutin Kester Co., Ltd.
2-20-11 Yokokawa,
Sumida-ku
Tokyo, 130-0003
Japan
d) Sony Corporation
1-7-1 Konan Minato-ku
Tokyo 108-0075
Japan

Attention is drawn to the possibility that some of the elements of this standard may be the

subject of patent rights other than those identified above. IEC shall not be held responsible for

identifying any or all such patent rights.
—————————
Status of patent: Pending.
---------------------- Page: 12 ----------------------
SIST EN 60068-2-83:2012
60068-2-83  IEC:2011 – 7 –

ISO (www.iso.org/patents) and IEC (http://patents.iec.ch) maintain on-line data bases of

patents relevant to their standards. Users are encouraged to consult the data bases for the

most up to date information concerning patents.
---------------------- Page: 13 ----------------------
SIST EN 60068-2-83:2012
– 8 – 60068-2-83  IEC:2011
ENVIRONMENTAL TESTING –
Part 2-83: Tests – Test Tf: Solderability testing
of electronic components for surface mounting devices (SMD)
by the wetting balance method using solder paste
1 Scope

This part of IEC 60068 provides methods for comparative investigation of the wettability of the

metallic terminations or metallized terminations of SMDs with solder pastes.

Data obtained by these methods are not intended to be used as absolute quantitative data for

pass – fail purposes.

NOTE Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69.

IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes

wetting balance evaluation using solder bath and solder globule method.
2 Normative references

The following referenced documents are indispensable for the application of this document.

For dated references, only the edition cited applies. For undated references, the latest edition

of the referenced document (including any amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance

IEC 60068-2-20:2008, Environmental testing – Part 2-20: Tests – Test T: Test methods for

solderability and resistance to soldering heat of devices with leads

IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for

solderability, resistance to dissolution of metallization and to soldering heat of surface

mounting devices (SMD)

IEC 60194, Printed board design, manufacture and assembly – Terms and definitions

IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for

electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering

applications
3 Terms and definitions

For the purposes of this document, the terms and definitions given in IEC 60068-1,

IEC 60068-2-20:2008, IEC 60068-2-58, IEC 60194, and IEC 61190-1-3 and the following

apply.
3.1
wettability
ease with which a metal or metal alloy can be wetted by molten solder
---------------------- Page: 14 ----------------------
SIST EN 60068-2-83:2012
60068-2-83  IEC:2011 – 9 –
3.2
wetting balance method

method to measure wetting performance and solderability by measuring vertical force

(difference with surface tension and buoyancy) to the specimen and recording as a function of

time, when the specimen is immersed into molten solder
3.3
starting point of heating

time of the start of temperature rise by heating the solder paste applied to a testing jig

3.4
zero line

line extended to the time axis of the force experienced by the specimen as indicated by the

test equipment (force sensor) when the specimen is taken out from the molten solder after the

end of the measurement
4 Test
4.1 General description

The specimen is held on a holder suitable to the specimen and is suspended from sensitive

balance. The specimen is immersed into solder paste applied onto the test jig plate, then

solder paste is heated to melt. The resultant of the vertical forces of buoyancy and surface

tension (hereafter, referred to as “acting force”) acting upon the immersed specimen by force

sensor and converted into a signal which is continuously recorded or monitored as a function

of time on recorder.

NOTE The wetting force can be evaluated only for components of the same shape and size. The absolute

evaluation is not achieved by this method.
4.2 Test methods

There are three methods as described below. The choice of the method shall be specified in

the relevant specification.

a) Quick heating method: The wettability of electrodes of a component is evaluated while the

solder paste is melted in a rapid temperature rise. The specimen is immersed in the solder

paste before the temperature rise starts.

b) Synchronous method: The wettability of electrodes of a component is evaluated while the

solder paste is melted due to a rapid temperature rise. The specimen is immersed in the

solder paste when the temperature rise starts.

c) Temperature profile method: Solder paste is melted using a similar temperature profile

used in production and the wettability of the electrodes of a component is evaluated.

NOTE 1 This test (Tf) may be applicable to leaded SMD packages. In order to achieve comparable and

repeatable results, test Tf should be done on straight leads.
NOTE 2 Solder paste to be used is not specified in this standard.
5 Preconditioning

Unless otherwise specified in the detailed specification of the component, the test shall be

made on the specimens as received and care shall be taken not to contaminate the

specimens by fingers and other items. The specimen may be immersed in organic solvent at

room temperature to remove possible contamination such as grease attached to the surface if

the preconditioning is specified in the specification. No other method shall be used to clean

the specimen. The specimen thus cleaned may be dried in air.
---------------------- Page: 15 ----------------------
SIST EN 60068-2-83:2012
– 10 – 60068-2-83  IEC:2011

When accelerated ageing is prescribed by the relevant specification, one of the methods of

4.1.4 (Ageing 1) of IEC 60068-2-20:2008 shall be used. The aging condition shall be specified

in the relevant specification.
6 Preparation
6.1 Solder paste

Use solder paste that has been stored in a sealed container and stored in a dark environment

and below 10 °C, avoiding exposure to direct sunlight. Before conducting this test, it is

important to prepare the solder paste properly.
a) The solder paste shall be allow
...

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