EN 60068-2-83:2011

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes. NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung Tf: Prüfung der Lötbarkeit von Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage unter Verwendung von Lotpaste

Essais d'environnement - Partie 2-83: Essais - Essais Tf: Essai de brasabilité des composants électroniques pour les composants pour montage en surface (CMS) par la méthode de la balance de mouillage utilisant de la pâte à braser

La CEI 60068-2-83:2011 fournit des méthodes d'enquêtes comparatives sur la mouillabilité des sorties métalliques ou métallisées des composants pour montage en surface (CMS) avec des pâtes à braser. Ces méthodes ne servent pas à fournir des données quantitatives absolues utilisées dans le cadre d'acceptions ou de rejets. NOTE: Différentes méthodes d'essai de brasabilité des composants pour montage en surface (CMS) sont décrites dans la CEI 60068-2-58 et dans la CEI 60068-2-69. La CEI 60068-2-58 prescrit une évaluation visuelle utilisant un bain de brasage et la méthode de refusion, la CEI 60068-2-69 prescrit une évaluation de balance de mouillage utilisant la méthode du bain de brasage et des gouttelettes de brasure.

Okoljsko preskušanje - 2-83. del: Preskusi - Preskus Tf: preskus spajkanja elektronskih komponent za površinsko montažo (SMD) z metodo za ugotavljanje omočljivosti z uporabo spajkalne paste

Ta del IEC 60068 podaja metode za primerjalno preučevanje omočljivosti kovinskih končnikov ali metaliziranih končnikov komponent za površinsko montažo (SMD) z uporabo spajkalnih past. Podatki, dobljeni s temi metodami, se ne uporabljajo kot absolutni kvantitativni podatki za namene preskusa uspešno - neuspešno.

General Information

• Status: Published
• Publication Date: 13-Oct-2011
• Withdrawal Date: 11-Oct-2014
• ICS: 19.040 - Environmental testing
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 14-Oct-2011
• Completion Date: 14-Oct-2011
• Ref Project: SIST EN 60068-2-83:2012 - Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Relations

• Revised: prEN IEC 60068-2-83:2024 - Environmental testing - Part 2-83: Tests - Test tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
• Effective Date: 10-Oct-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-januar-2012
2NROMVNRSUHVNXãDQMHGHO3UHVNXVL3UHVNXV7ISUHVNXVVSDMNDQMD
HOHNWURQVNLKNRPSRQHQW]DSRYUãLQVNRPRQWDåR60']PHWRGR]DXJRWDYOMDQMH
RPRþOMLYRVWL]XSRUDERVSDMNDOQHSDVWH
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic
components for surface mounting devices (SMD) by the wetting balance method using
solder paste
Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung Tf: Prüfung der Lötbarkeit von
Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage
unter Verwendung von Lotpaste
Essais d'environnement - Partie 2-83: Essais - Essais Tf: Essai de brasabilité des
composants électroniques pour les composants pour montage en surface (CMS) par la
méthode de la balance de mouillage utilisant de la pâte à braser
Ta slovenski standard je istoveten z: EN 60068-2-83:2011
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.020 Elektronske komponente na Electronic components in
splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60068-2-83
NORME EUROPÉENNE
October 2011
EUROPÄISCHE NORM
ICS 19.040; 31.190
English version
Environmental testing -
Part 2-83: Tests -
Test Tf: Solderability testing of electronic components for surface
mounting devices (SMD) by the wetting balance method using solder
paste
(IEC 60068-2-83:2011)
Essais d'environnement -  Umweltprüfungen -
Partie 2-83: Essais - Teil 2-83: Prüfungen -
Essais Tf: Essai de brasabilité des Prüfung Tf: Prüfung der Lötbarkeit von
composants électroniques pour les Bauelementen der Elektronik für
composants pour montage en surface Oberflächenmontage (SMD) mit der
(CMS) par la méthode de la balance de Benetzungswaage unter Verwendung von
mouillage utilisant de la pâte à braser Lotpaste
(CEI 60068-2-83:2011) (IEC 60068-2-83:2011)

This European Standard was approved by CENELEC on 2011-10-12. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60068-2-83:2011 E
Foreword
The text of document 91/975/FDIS, future edition 1 of IEC 60068-2-83, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN 60068-2-83:2011.

The following dates are fixed:
(dop) 2012-07-12
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2014-10-12
• latest date by which the national
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.
Endorsement notice
The text of the International Standard IEC 60068-2-83:2011 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-69 NOTE  Harmonized as EN 60068-2-69.
IEC 61189-5 NOTE  Harmonized as EN 61189-5.

- 3 - EN 60068-2-83:2011
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

IEC 60068-1 - Environmental testing - EN 60068-1 -
Part 1: General and guidance
IEC 60068-2-20 2008 Environmental testing - EN 60068-2-20 2008
Part 2-20: Tests - Test T: Test methods for
solderability and resistance to soldering heat
of devices with leads
IEC 60068-2-58 - Environmental testing - EN 60068-2-58 -
Part 2-58: Tests - Test Td: Test methods for
solderability, resistance to dissolution of
metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60194 - Printed board design, manufacture and EN 60194 -
assembly - Terms and definitions

IEC 61190-1-3 - Attachment materials for electronic assembly -EN 61190-1-3 -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications

IEC 60068-2-83 ®
Edition 1.0 2011-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Environmental testing –
Part 2-83: Tests – Test Tf: Solderability testing of electronic components for
surface mounting devices (SMD) by the wetting balance method using solder
paste
Essais d’environnement –
Partie 2-83: Essais – Essai Tf: Essai de brasabilité des composants
électroniques pour les composants pour montage en surface (CMS) par la
méthode de la balance de mouillage utilisant de la pâte à braser

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX W
ICS 19.040; 31.190 ISBN 978-2-88912-665-1

– 2 – 60068-2-83  IEC:2011
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 8
3 Terms and definitions . 8
4 Test . 9
4.1 General description . 9
4.2 Test methods . 9
5 Preconditioning . 9
6 Preparation . 10
6.1 Solder paste . 10
6.2 Test jig plate . 10
6.3 Specimen holder . 10
7 Quick heating method . 10
7.1 Equipment . 10
7.2 Test jig plate . 11
7.3 Preparation . 12
7.4 Test condition . 12
7.4.1 Test temperature . 12
7.4.2 Feed of solder paste and immersion condition . 13
7.4.3 Immersion and withdrawal conditions for test specimen . 14
7.5 Test procedure . 14
7.6 Presentation of the result . 15
7.7 Characterisation parameter examples . 15
8 Synchronous method . 16
8.1 Equipment . 16
8.2 Test jig plate . 17
8.3 Synchronous fixture . 17
8.4 Preparation . 17
8.5 Test condition . 17
8.5.1 Test temperature . 17
8.5.2 Feed of solder paste and immersion condition . 17
8.5.3 Immersion and withdrawal conditions for the test specimen . 17
8.6 Test procedure . 17
8.7 Presentation of the results . 18
8.8 Characterisation parameter examples . 19
9 Temperature profile method . 19
9.1 Equipment . 19
9.2 Test jig plate . 19
9.3 Preparation . 20
9.4 Test condition . 20
9.4.1 Test temperature . 20
9.4.2 Feed of solder paste and immersion condition . 21
9.4.3 Immersion and withdrawal conditions for test specimen . 21
9.5 Test procedure . 21

60068-2-83  IEC:2011 – 3 –
9.6 Presentation of the result . 22
9.7 Characterisation parameter examples . 23
Annex A (normative) Equipment for the quick heating and synchronous method . 24
Annex B (informative) Reading of the output data and correction of the result in the
quick heating test. 25
Annex C (normative) Test equipment for the temperature profile method . 28
Annex D (informative) Reading of the output data and correction of the result in the
temperature profile test . 29
Annex E (informative) Caveats / Notes. 32
Bibliography . 36

Figure 1 – Examples of the quick heating method test equipment . 11
Figure 2 – Example of test jig plate for quick heating and synchronous method . 12
Figure 3 – Example of the temperature profile. 13
Figure 4 – Example of applying solder paste to a test jig plate . 14
Figure 5 – Typical output shape of signal in the quick heating method . 15
Figure 6 – Example of synchronous method test equipment .
...