Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability.

Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für Halbleiterbauelemente

Normalisation mécanique des dispositifs à semiconducteurs - Partie 4: Système de codification et classification en formes des boîtiers pour dispositifs à semiconducteurs

La CEI 60191-4:2013 spécifie une méthode pour la désignation des structures des boîtiers et pour la classification des formes des structures de boîtiers des dispositifs à semiconducteurs, ainsi qu'une méthode générale pour établir des codes de désignation descriptifs universels pour les boîtiers à semiconducteurs. Le code de désignation descriptif fournit un outil de communication utile mais n'intègre pas de contrôle permettant d'assurer l'interchangeabilité des boîtiers. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) Un matériau désigné par le code 'S' est ajouté pour indiquer un boîtier à base de silicium. b) La description de 'WL' qui est ajoutée est destinée à un usage général.

Standardizacija mehanskih lastnosti polprevodniških elementov - 4. del: Kodirni sistem in klasifikacija oblik okrovov polprevodniških elementov (IEC 60191-4:2013)

Ta del standarda IEC 60191 določa metodo za označevanje okrovov in klasifikacijo oblik okrovov polprevodniških elementov ter sistematično metodo za vzpostavitev univerzalnih opisnih oznak za polprevodniške elemente. Opisna oznaka je uporabno komunikacijsko orodje, vendar ne ponuja nadzora za zagotavljanje medsebojne zamenljivosti.

General Information

Status
Published
Publication Date
09-Apr-2014
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
31-Mar-2014
Due Date
05-Jun-2014
Completion Date
10-Apr-2014

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SLOVENSKI STANDARD
SIST EN 60191-4:2014
01-maj-2014
1DGRPHãþD
SIST EN 60191-4:2002
SIST EN 60191-4:2002/A1:2005
SIST EN 60191-4:2002/A2:2005
Standardizacija mehanskih lastnosti polprevodniških elementov - 4. del: Kodirni

sistem in klasifikacija oblik okrovov polprevodniških elementov (IEC 60191-4:2013)

Mechanical standardization of semiconductor devices - Part 4: Coding system and
classification into forms of package outlines for semiconductor device packages
Mechanische Normung von Halbleiterbauelementen - Teil 4: Codierungssystem für
Gehäuse und Eingruppierung der Gehäuse nach der Gehäuseform für
Halbleiterbauelemente
Normalisation mécanique des dispositifs à semiconducteurs - Partie 4: Système de

codification et classification en formes des boîtiers pour dispositifs à semiconducteurs

Ta slovenski standard je istoveten z: EN 60191-4:2014
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN 60191-4:2014 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN 60191-4:2014
---------------------- Page: 2 ----------------------
SIST EN 60191-4:2014
EUROPEAN STANDARD
EN 60191-4
NORME EUROPÉENNE
March 2014
EUROPÄISCHE NORM
ICS 31.080 Supersedes EN 60191-4:1999 + A1:2002 + A2:2002
English version
Mechanical standardization of semiconductor devices -
Part 4: Coding system and classification into forms of package outlines
for semiconductor device packages
(IEC 60191-4:2013)
Normalisation mécanique des dispositifs à Mechanische Normung von
semiconducteurs - Halbleiterbauelementen -
Partie 4: Système de codification et Teil 4: Codierungssystem für Gehäuse
classification en formes des boîtiers pour und Eingruppierung der Gehäuse nach
dispositifs à semiconducteurs der Gehäuseform für
(CEI 60191-4:2013) Halbleiterbauelemente
(IEC 60191-4:2013)

This European Standard was approved by CENELEC on 2013-11-14. CENELEC members are bound to comply

with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard

the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and notified

to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,

the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,

Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,

Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2014 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60191-4:2014 E
---------------------- Page: 3 ----------------------
SIST EN 60191-4:2014
EN 60191-4:2014 - 2 -
Foreword

The text of document 47D/837/FDIS, future edition 3 of IEC 60191-4, prepared by SC 47D,

Semiconductor devices packaging, of IEC TC 47, Semiconductor devices, was submitted to the IEC-

CENELEC parallel vote and was approved by CENELEC as EN 60191-4:2014.
The following dates were fixed:
– latest date by which the EN has to be implemented (dop) 2014-09-21
at national level by publication of an identical
national standard or by endorsement
– latest date by which the national standards conflicting (dow) 2016-11-14
with the EN have to be withdrawn

This European Standard supersedes EN 60191-4:1999 and its Amendments A1:2002 and A2:2002.

EN 60191-4:2014 includes the following significant changes with respect to EN 60191-4:1999:

a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent

rights.
Endorsement notice

The text of the International Standard IEC 60191-4:2013 was approved by CENELEC as a European

Standard without any modification.
---------------------- Page: 4 ----------------------
SIST EN 60191-4:2014
IEC 60191-4
Edition 3.0 2013-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Mechanical standardization of semiconductor devices –
Part 4: Coding system and classification into forms of package outlines for
semiconductor device packages
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 4: Système de codification et classification en formes des structures des
boîtiers pour dispositifs à semiconducteurs
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX T
ICS 31.080 ISBN 978-2-8322-1155-7

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 5 ----------------------
SIST EN 60191-4:2014
– 2 – 60191-4  IEC:2013
CONTENTS

FOREWORD ........................................................................................................................... 3

1 Scope ............................................................................................................................... 5

2 Coding system of package outlines for semiconductor devices .......................................... 5

3 Classification into forms of package outlines for semiconductor devices ............................ 5

4 Coding system for semiconductor-device packages ........................................................... 6

4.1 General ................................................................................................................... 6

4.2 New descriptive codes ............................................................................................. 6

4.3 Descriptive designators ............................................................................................ 6

4.3.1 General remarks .......................................................................................... 6

4.3.2 Minimum descriptive designator ................................................................... 6

4.3.3 Terminal-position prefix................................................................................ 8

4.3.4 Package-body-material prefix ....................................................................... 8

4.3.5 Package-specific feature prefix .................................................................... 9

4.3.6 Lead-form and terminal-count suffixes ......................................................... 9

4.3.7 Detailed information field ........................................................................... 11

5 Coding system of package-outline styles ......................................................................... 12

Annex A (informative) Examples of descriptive coding system application ............................. 15

Annex B (informative) Derivation and application of the descriptive coding system –

Common package names ...................................................................................................... 22

Figure 1 – Descriptive coding for semiconductor device packages ........................................... 7

Figure 2 – Relationship of codes to profile ............................................................................. 10

Figure A.1 – Typical package styles and descriptive coding system (1 of 4) ........................... 17

Figure A.2 – Examples of lead forms (or terminal shapes) ..................................................... 21

Figure B.1 – Descriptive coding system for common name of semiconductor-device

package ................................................................................................................................ 22

Table 1 – Package-outline-style codes..................................................................................... 8

Table 2 – Terminal-position prefixes ........................................................................................ 9

Table 3 – Prefixes for predominant package-body material .................................................... 10

Table 4 – Prefixes for package-specific features .................................................................... 10

Table 5 – Suffixes for lead form (or terminal shape) ............................................................... 12

Table A.1 – Descriptive coding system application ................................................................. 16

Table B.1 – Basic package code and names .......................................................................... 23

Table B.2 – Common package name and descriptive code examples ..................................... 24

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SIST EN 60191-4:2014
60191-4  IEC:2013 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –
Part 4: Coding system and classification into forms of package
outlines for semiconductor device packages
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60191-4 has been prepared by subcommittee 47D: Semiconductor

devices packaging, of IEC technical committee 47: Semiconductor devices.
This third edition cancels and replaces the second edition published in 1999,

Amendment 1:2001 and Amendment 2:2002.This edition constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.
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SIST EN 60191-4:2014
– 4 – 60191-4  IEC:2013
The text of this standard is based on the following documents:
FDIS Report on voting
47D/837/FDIS 47D/848/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all the parts in the IEC 60191 series, published under the general title Mechanical

standardization of semiconductor devices, can be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until the

stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to

the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct understanding

of its contents. Users should therefore print this document using a colour printer.

---------------------- Page: 8 ----------------------
SIST EN 60191-4:2014
60191-4  IEC:2013 – 5 –
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –
Part 4: Coding system and classification into forms of package
outlines for semiconductor device packages
1 Scope

This part of IEC 60191 specifies a method for the designation of package outlines and for the

classification of forms of package outlines for semiconductor devices and a systematic method

for generating universal descriptive designators for semiconductor device packages.

The descriptive designator provides a useful communication tool but has no implied control for

assuring package interchangeability.
2 Coding system of package outlines for semiconductor devices

The following coding system will be used in the publications concerning mechanical

standardization:
– first: a three-digit serial number (000 to 999);
– second: a single reference letter indicating the form as shown in Table 1;

– third: a two-digit serial number (00 to 99) to indicate a variant of an outline drawing.

The use of prefix P to indicate a provisional drawing remains unchanged.
Examples
– 101A00
– 050G13
– P 101F01
3 Classification into forms of package outlines for semiconductor devices

The package outline drawings for semiconductor devices are classified into forms according to

the following scheme:
– form A: single-ended
– form B: heat-sink-mounted
– form C: stud-mounted
– form D: axial-leaded
– form E: surface-mounted
– form F: single-ended, heat-sink-mounted
– form G: dual and quad in-line
– form H: axial lead-less.
---------------------- Page: 9 ----------------------
SIST EN 60191-4:2014
– 6 – 60191-4  IEC:2013
4 Coding system for semiconductor-device packages
4.1 General

The standard coding system is a method for identifying the physical features of an electronic

device package family. The system is predicated upon a minimum two-character designator,

which indicates the package outline style. This designator can be extended, through the use of

optional, user-selected fields, to provide additional package information such as terminal

position and count, terminal form, package shape, and predominant body material.
4.2 New descriptive codes

If a new package that does not conform to one of the designated field character codes is being

proposed, a new code may be recommended for standardization.
4.3 Descriptive designators
4.3.1 General remarks

The package outline style code is the only compulsory field within this descriptive designation

system. Additional information may be provided using optional prefixes and suffixes described

by the system. In general, these fields are independent of one another. Unless otherwise

indicated herein, the users of this system may pick and choose which of these fields they wish

to implement for their specific application (see Figure 1). The descriptive designator may be

extended with additional information, provided this information is separated from the

descriptive designator by a slash (/) (see 4.3.7).
NOTE Basic package codes and names are presented in Table B.1.
4.3.2 Minimum descriptive designator

The minimum descriptive designator is a two-letter code that classifies device packages into

standard package outline styles. These styles identify general external physical features.

Common two-letter descriptive codes or abbreviations are included, such as CC, FP, SO, GA.

Figure A.1 shows two-letter codes for various device package outline styles and depicts

examples of each. Table 1 lists the two-letter package-outline-style codes described in

Clause 5.
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SIST EN 60191-4:2014
60191-4  IEC:2013 – 7 –
Optional unless Minimum
Optional – Optional material prefix descriptive – Optional Optional
designator designator
P – S Q C C – J 3 2
Material Features Position Package Form Count
Terminal count
(4.3.6.1, 4.3.6.2)
A one-, two-, or
three-digit suffix
Lead form
(4.3.6.1, 4.3.6.2,
Table 5, Figure A.2)
A single-letter suffix
Package outline style
(4.3.2, Table 1, Figure A.1)
A double-letter designator
Terminal position
(4.3.3, Table 2)
A single-letter prefix
Package-specific features
(4.3.5, Table 4)
A single-letter or multi-
letter prefix
Package-body material
(4.3.4, Table 3)
A single-letter prefix
IEC 2560/13
Figure 1 – Descriptive coding for semiconductor device packages
---------------------- Page: 11 ----------------------
SIST EN 60191-4:2014
– 8 – 60191-4  IEC:2013
Table 1 – Package-outline-style codes
Form Code Outline style
E CC Chip-carrier package
B CP Clamped package (press-pack)
A CY Cylinder or can package
D/E DB Disk-button package
F FM Flange-mount package
A FO Fibre optic device package
E FP Flatpack package
G GA Grid-array package
G IL In-line package. The preferred designator is IP.
G IP
In-line package or inserted package. Restrict to DIP/SIP/ZIP.
D/H LF Long-form horizontal package
MA Microelectronic assembly
B MP Power module package
MW Microwave package
B PF Press-fit package
C PM Post-(stud-) mount package
E SO* Small-outline package
A SS Special-shape package
UC Uncased chip
VP Vertical surface-mount package
XA-XZ Non-defined family; vendor or user option

* Industry practice sometimes uses "P" for "package" in the location normally occupied by this field (except that

there is no preceding hyphen), for example SOP.
4.3.3 Terminal-position prefix

The two-letter, package-outline-style code may be supplemented with a single-letter prefix that

identifies the physical terminal positions or, if applicable, the interconnect land pattern.

Examples of three-letter designators include common acronyms or abbreviations, such as DIP,

LCC (QCC preferred), PGA, QFP, SIP, ZIP.
NOTE 1 A terminal is defined as an externally available point of connection.

NOTE 2 The proper terminal-position prefix is determined by the interconnect land structure. For example, the

code for a single row of terminals formed into a staggered configuration would be "Z".

Table 2 gives a list of one-letter, terminal-position prefix codes.
4.3.4 Package-body-material prefix

The three-letter descriptive designator (see 4.3.2) may be further supplemented by a single-

letter prefix that identifies the predominant package-body material. This prefix shall not be

used unless the terminal-position prefix described in 4.3.2 is also used. Examples of such four-

letter descriptive designators include common acronyms or abbreviations, such as CDIP, PDIP,

PLCC (PQCC preferred), MELF, PQFP.
Table 3 gives a list of one-letter package-body-material prefix codes.
---------------------- Page: 12 ----------------------
SIST EN 60191-4:2014
60191-4  IEC:2013 – 9 –

If the package-body material is other than one of those defined in Table 3, the letter "X" shall

be used within the descriptive designator to signify a special or new material and shall later be

replaced with an IEC-approved code.
4.3.5 Package-specific feature prefix

Package-specific features may be described through the use of a multiletter prefix. The

package-specific feature prefix shall be set off from the following portion of the descriptive

designator by a dash (–).

Table 4 gives a list of package-specific feature prefix codes. Figure 2 shows the relationship of

codes to profile and pitch.
4.3.6 Lead-form and terminal-count suffixes
4.3.6.1 General lead-form and number of terminals

The general lead form (or terminal shape) and/or the number of terminals on a package may

be described through the use of two fields, the lead-form suffix and the terminal-count suffix.

These two fields shall be set off from the preceding portion of the descriptive designator by a

dash (–).

Users of this system may choose to use the lead-form suffix, or the terminal-count suffix, or

both. If the lead-form suffix is used in conjunction with the terminal-count suffix, it shall

precede the terminal-count suffix.
Table 2 – Terminal-position prefixes
a) b)
Code Name Position

A Axial Terminals extend from both ends in the direction of the major axis of a cylindrical or

elliptical package
B Bottom Terminals extend from the bottom of the package

D Double Terminals are on opposite sides of a square or rectangular package or located in two

parallel rows

E End Terminals are package endcaps having a circular or elliptical cross-section

L Lateral Terminals are on the four sides of a square or rectangular package
The preferred name is "quad", code Q

P Perpendicular Terminals are perpendicular to the seating plane on a square or rectangular

package. Restrict to PGA family

Q Quad Terminals are on four sides of a square or rectangular package or located in four

parallel rows

R Radial Terminals extended radially from the periphery of a cylindrical or spherical package

S Single Terminals are on one surface of a square or rectangular package in a single row

T Triple Terminals are on three sides of a square or rectangular package

U Upper Terminals are perpendicular to and opposite the seating plane, and are on one

surface of a package
X Other Terminal positions are other than those described

Z Zig-zag Terminals are on one surface of a square or rectangular package arranged in a

staggered configuration
These descriptions assume the seating plane in the bottom of the package.

Reference to package shape does not take into account flanges, notches or other irregularities.

---------------------- Page: 13 ----------------------
SIST EN 60191-4:2014
– 10 – 60191-4  IEC:2013
Table 3 – Prefixes for predominant package-body material
Code Material
C Ceramic, metal-sealed co-fired
G Ceramic, glass-sealed
L Glass
M Metal
P Plastic (including epoxy)
S Silicon
T Tape
X Other
Table 4 – Prefixes for package-specific features
Order Functional classification Code Package-specific feature
H Integral heat slug
1 Outline addition D Transparent window
P Piggyback or Terminal for stack
None Standard profile (1,70 mm < none)
L Low profile (1,20 mm < L ≤ 1,70 mm)
Thin profile (1,00 mm < T ≤ 1,20 mm)
2 Seating height V Very thin profile (0,80 mm < V ≤ 1,00 mm)
W Very, very thin profile (0,65 mm < W ≤ 0,80 mm)
Ultra thin profile (0,50 mm < U ≤ 0,65 mm)
X Extremely thin profile (X ≤ 0,50 mm)
Shrink pitch (< basic pitch) (restricted to DIP, SIP, SOP
families)
SDIP (1,778 mm pitch)
SZIP (1,778 mm and 1,27 mm pitch)
3 Terminal pitch and position
SSOP (1,0 mm, 0,8 mm, 0,65 mm, 0,5 mm and 0,4 mm
pitch)
Fine pitch (QFP at ≤ 0,50 mm pitch and ≤ 0,80 mm pitch
for BGA and LGA)
I Interstitial pitch (staggered leads)
X ≤ 0,50 mm < U ≤ 0,65 mm < W ≤ 0,80 mm < V ≤ 1,00 mm
< T ≤ 1,20 mm < L ≤ 1,70 mm < No code
IEC 2561/13
Figure 2 – Relationship of codes to profile
4.3.6.2 Lead-form suffix

The lead-form suffix is a one-letter suffix that identifies the standard form or shape of the lead.

Table 5 gives a list of one-letter, lead-form suffix codes.

If more than one type of terminal is present, the terminals carrying the principal current

determine the lead-form code. If one of these terminals is a mounting stud or flange, its shape

---------------------- Page: 14 ----------------------
SIST EN 60191-4:2014
60191-4  IEC:2013 – 11 –

shall not govern the choice of lead-form (or terminal-shape) suffix because that has already

been described by the package-outline-style code. If the lead form is other than one of those

defined in Table 5, the letter "X" shall be used within the descriptive designator to signify a

special or new lead form and shall later be replaced with an IEC-approved code. Examples are

illustrated in Figure A.2.
4.3.6.3 Terminal-count suffix

The terminal-count suffix is a numeric field used to identify the number of terminals on the

device package. If there is more than one type of terminal, the terminal count shall include only

those terminals that were used to determine the lead-form suffix in accordance with 4.3.6.1. If

the terminal count (including terminals not used) is less than the number of available terminal

positions, the latter may be added in parentheses, for example 20(26) and 168(289).

4.3.7 Detailed information field

A slash (/), followed by a supplemental one- to twenty-character detailed information field, may

be added to the descriptive designator. The field may contain the IEC designation or some

other user-specified coding scheme.

The slash (/) shall signify the beginning of the supplementary detailed information field. There

shall be no space character between the slash (/) and adjacent fields.
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SIST EN 60191-4:2014
– 12 – 60191-4  IEC:2013
Table 5 – Suffixes for lead form (or terminal shape)
Code Form/shape Description (see Figure A.2)
A Screw A threaded hole for a screw on the top of the package

B Butt or ball A short lead or solder ball intended for attachment perpendicular to the land

structure

C C-bend A "C"-shaped compliant or non-compliant lead bent down and under the body

of the package
D Solder lug A lug terminal on the package
E Fast-on plug A fast-on plug extending from the body of the package
F Flat A compliant or non-compliant, non-formed flat lead that extends away from
the body of the package

G Gull wing A compliant lead bent down from the body of the package with a foot at the

end pointing away from the package
H High-current cable A lug terminal at the end of a flexible lead

I Insulated A flat lead formed by depositing a thin conductor on a supporting insulating

film
J "J" bend A "J"-shaped compliant lead bent down and back under the body of the
package
L "L" bend An "L"-shaped compliant lead intended for surface mounting
N No lead Metallized terminal pads located on the body of the package

P* Pin or peg A tempered lead extending from the body of the package and intended for

attachment to a plated through-hole in the land structure
Q Quick-connect A tab-like terminal extending from the body of the package

R Wrap-around A metallized non-compliant terminal wrapped around the package body

S "S" bend An "S"-shaped compliant lead bent under the body of the package

T Through-hole A terminal with flat or V-shaped cross-section intended for attachment to a

plated through-hole in the land structure
U "J" inverted A "J"-shaped compliant or non
...

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