EN 61188-5-2:2003

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung - Teil 5-2: Betrachtungen zur Montage (Anschlussfläche/Verbindung) - Einzelbauelemente

Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-2: Considérations sur les liaisons pistes-soudures - Composants discrets

Donne des informations sur la géométrie des zones de report, en vue du soudage par refusion des divers composants discrets. Fournit les dimensions, formes et tolérances appropriées des zones de report pour montage en surface afin d'assurer une surface suffisante pour le cordon de brasure et pour permettre l'inspection, les essais et les retouches des joints de brasure.

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

General Information

• Status: Published
• Publication Date: 22-Sep-2003
• Withdrawal Date: 31-Aug-2006
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 6060 - Document made available - Publishing
• Start Date: 23-Sep-2003
• Completion Date: 23-Sep-2003
• Ref Project: SIST EN 61188-5-2:2004 - Printed boards and printed board assemblies - Design and use -- Part 5-2: Attachment (land/joint) considerations - Discrete components

Standards Content (Sample)

SLOVENSKI STANDARD
01-marec-2004
Printed boards and printed board assemblies - Design and use - Part 5-2:
Attachment (land/joint) considerations - Discrete components
Printed boards and printed board assemblies - Design and use -- Part 5-2: Attachment
(land/joint) considerations - Discrete components
Leiterplatten und Flachbaugruppen - Konstruktion und Anwendung -- Teil 5-2:
Betrachtungen zur Montage (Anschlussfläche/Verbindung) - Einzelbauelemente
Cartes imprimées et cartes imprimées équipées - Conception et utilisation -- Partie 5-2:
Considérations sur les liaisons pistes-soudures - Composants discrets
Ta slovenski standard je istoveten z: EN 61188-5-2:2003
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 61188-5-2
NORME EUROPÉENNE
EUROPÄISCHE NORM September 2003

ICS 31.180; 31.190
English version
Printed boards and printed board assemblies -
Design and use
Part 5-2: Attachment (land/joint) considerations -
Discrete components
(IEC 61188-5-2:2003)
Cartes imprimées et cartes imprimées Leiterplatten und Flachbaugruppen -
équipées - Konstruktion und Anwendung
Conception et utilisation Teil 5-2: Betrachtungen zur Montage
Partie 5-2: Considérations sur les liaisons (Anschlussfläche/Verbindung) -
pistes-soudures - Einzelbauelemente
Composants discrets (IEC 61188-5-2:2003)
(CEI 61188-5-2:2003)
This European Standard was approved by CENELEC on 2003-09-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Lithuania, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 61188-5-2:2003 E
Foreword
The text of document 91/382/FDIS, future edition 1 of IEC 61188-5-2, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved
by CENELEC as EN 61188-5-2 on 2003-09-01.

This European Standard is to be read in conjunction with EN 61188-5-1:2002.

The following dates were fixed:

– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-06-01

– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2006-09-01

Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61188-5-2:2003 was approved by CENELEC as a European
Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60051 NOTE Harmonized as EN 60051 series (not modified).
IEC 61191-1 NOTE Harmonized as EN 61191-1:1998 (not modified).
IEC 61191-2 NOTE Harmonized as EN 61191-2:1998 (not modified).
__________
- 3 - EN 61188-5-2:2003
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1) 2)
IEC 60068-2-58 - Environmental testing EN 60068-2-58 1999
Part 2-58: Tests - Test Td: Test
methods for solderability, resistance to
dissolution of metallization and to
soldering heat of surface mounting
devices (SMD)
1) 2)
IEC 60115-1 - Fixed resistors for use in electronic EN 60115-1 2001
(mod) equipment
Part 1: Generic specification
1) 2)
IEC 60286-3 - Packaging of components for automatic EN 60286-3 1998
handling
Part 3: Packaging of surface mount
components on continuous tapes

1) 2)
IEC 60286-4 - Part 4: Stick magazines for electronic EN 60286-4 1998
components encapsulated in packages
of form E and G
1) 2)
IEC 60286-5 - Part 5: Matrix trays EN 60286-5 1997
(mod)
1) 2)
IEC 60286-6 - Part 6: Bulk case packaging for surface EN 60286-6 1998
mounting components
1)
IEC 60384-3 - Fixed capacitors for use in electronic - -
equipment. Part 3: Sectional
specification: Fixed tantalum chip
capacitors
1)
IEC 60384-18 - Part 18: Sectional specification: Fixed - -
aluminium electrolytic chip capacitors
with solid and non-solid electrolyte

1)
Undated reference.
2)
Valid edition at date of issue.

Publication Year Title EN/HD Year
1) 2)
IEC 60384-20 - Part 20: Sectional specification: Fixed EN 60384-20 1999
metallized polyphenylene sulfide film
dielectric surface mount d.c. capacitors

1) 2)
IEC 61188-5-1 - Printed boards and printed board EN 61188-5-1 2002
assemblies - Design and use
Part 5-1: Attachment (land/joint)
considerations - Generic requirements

1) 2)
IEC 61605 - Fixed inductors for use in electronic and EN 61605 1997
telecommunication equipment - Marking
codes
NORME
CEI
INTERNATIONALE IEC
61188-5-2
INTERNATIONAL
Première édition
STANDARD
First edition
2003-06
Cartes imprimées et cartes imprimées équipées –
Conception et utilisation –
Partie 5-2:
Considérations sur les liaisons pistes-soudures –
Composants discrets
Printed boards and printed board assemblies –
Design and use –
Part 5-2:
Attachment (land/joint) considerations –
Discrete components
© IEC 2003 Droits de reproduction réservés ⎯ Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
CODE PRIX
XA
Commission Electrotechnique Internationale PRICE CODE
International Electrotechnical Commission
ɆɟɠɞɭɧɚɪɨɞɧɚɹɗɥɟɤɬɪɨɬɟɯɧɢɱɟɫɤɚɹɄɨɦɢɫɫɢɹ
Pour prix, voir catalogue en vigueur
For price, see current catalogue

61188-5-2 © IEC:2003 – 3 –
CONTENTS
FOREWORD . 9
INTRODUCTION .13
1 Scope .15
2 Normative references.15
3 Packaging.17
4 Fixed rectangular chip resistors .17
4.1 Introductory remark .17
4.2 Component description .17
4.3 Component dimensions .19
4.4 Solder joint fillet design .21
4.5 Land pattern dimensions.25
5 Fixed cylindrical chip resistors .29
5.1 Introductory remark .29
5.2 Component description .29
5.3 Component dimensions .31
5.4 Solder joint fillet design .31
5.5 Land pattern dimensions.35
6 Fixed multilayer ceramic chip capacitors.39
6.1 Introductory remark .39
6.2 Component description .39
6.3 Component dimensions .43
6.4 Solder joint fillet design .43
6.5 Land pattern dimensions.47
7 Fixed tantalum chip capacitors.51
7.1 Introductory remark .51
7.2 Component description .51
7.3 Component dimensions .53
7.4 Solder joint fillet design .53
7.5 Land pattern dimensions.57
8 Fixed aluminium electrolytic chip capacitors with non-solid electrolyte
(vertical type).61
8.1 Introductory remark .61
8.2 Component description .61
8.3 Component dimensions .63
8.4 Solder joint fillet design .65
8.5 Land pattern dimensions.67
9 Fixed aluminium electrolytic chip capacitors with non-solid electrolyte
(horizontal type).71
9.1 Introductory remark .71
9.2 Component description .71
9.3 Component dimensions .73
9.4 Solder joint fillet design .75
9.5 Land pattern dimensions.77

61188-5-2 © IEC:2003 – 5 –
10 Fixed film chip capacitors .81
10.1 Introductory remark .81
10.2 Component description .81
10.3 Component dimensions .83
10.4 Solder joint fillet design .85
10.5 Land pattern dimensions.42
11 Fixed chip inductors (multilayer type).91
11.1 Introductory remark .
...