SIST EN IEC 62132-8:2026

Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method (IEC 62132-8:2026)

IEC 62132-8:2026 specifies a method for measuring the immunity of an integrated circuit (IC) to radio frequency (RF) radiated electromagnetic disturbances using an IC stripline.
This edition includes the following significant technical changes with respect to the previous edition:
a) frequency range of 150 kHz to 3 GHz was deleted from the scope;
b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements are fulfilled.
This part of IEC 62132 is to be read in conjunction with IEC 62132-1.

Integrierte Schaltungen - Messung der elektromagnetischen Störfestigkeit - Teil 8: Messung der Störfestigkeit bei Einstrahlungen - IC-Streifenleiterverfahren (IEC 62132-8:2026)

Circuits intégrés - Mesure de l'immunité électromagnétique - Partie 8: Mesure de l'immunité rayonnée - Méthode de la ligne TEM à plaques pour circuit intégré (IEC 62132-8:2026)

IEC 62132-8:2026 définit une méthode de mesure de l’immunité d’un circuit intégré (CI) aux perturbations électromagnétiques rayonnées au moyen d’une ligne TEM à plaques pour circuit intégré.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) la gamme de fréquences de 150 kHz à 3 GHz a été supprimée du domaine d’application;
b) extension de la fréquence utile supérieure à 6 GHz ou plus, pour autant que les exigences définies soient satisfaites.

Integrirana vezja - Meritve elektromagnetne odpornosti - 8. del: Meritev odpornosti proti sevanju - Metoda z IC na tračnem valovodu (IEC 62132-8:2026)

IEC 62132-8:2026 določa metodo za merjenje odpornosti integriranega vezja (IC) na radiofrekvenčne (RF) elektromagnetne motnje, ki se širijo po zraku, z uporabo IC stripline (trakasta linija).
Ta izdaja vključuje naslednje pomembne tehnične spremembe v primerjavi s prejšnjo izdajo:
a) frekvenčno območje od 150 kHz do 3 GHz je bilo izbrisano iz obsega;
b) razširitev zgornje uporabne frekvence na 6 GHz ali več, dokler so izpolnjene določene zahteve.
Ta del IEC 62132 se bere v povezavi z IEC 62132-1.

General Information

• Status: Published
• Public Enquiry End Date: 29-May-2025
• Publication Date: 09-Apr-2026
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 31-Mar-2026
• Due Date: 05-Jun-2026
• Completion Date: 10-Apr-2026
• Directive: Harmonized Standard2014/30/EU - Directive 2014/30/EU of the European Parliament and of the Council of 26 February 2014 on the harmonisation of the laws of the Member States relating to electromagnetic compatibility (recast)
• Ref Project: EN IEC 62132-8:2026 - Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method

Relations

• Replaces: SIST EN 62132-8:2012 - Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method
• Effective Date: 01-May-2026
• Refers: SIST EN 62132-1:2016 - Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions
• Effective Date: 10-Mar-2026
• Referred By: SIST EN IEC 63244-1:2021 - Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1 : General requirements and specifications (IEC 63244-1:2021)
• Effective Date: 31-Mar-2026

Overview

FprEN IEC 62132-8:2025 - "Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method" defines a standardized test method for assessing the radiated RF immunity of integrated circuits (ICs) using an IC stripline (a TEM waveguide arrangement). Drafted under IEC SC 47A and submitted for CENELEC parallel voting, this document belongs to the IEC 62132 series on IC electromagnetic immunity and links to IEC 62132‑1 for general conditions and definitions.

Key topics and technical requirements

• Test concept: Uses an IC stripline (active conductor above an enlarged ground plane) to generate a controlled transverse electromagnetic (TEM) field for DUT exposure.
• Test conditions: Defines required operational conditions such as supply voltage, DUT mounting on an EMC test board, and DUT monitoring points (see IEC 62132‑1 for board requirements).
• Test equipment: Specifies items including RF disturbance generator, IC stripline (open or closed/shielded versions), 50 Ω terminations, cables and shielding.
• Test setup & procedure: Covers configuration, operational checks, immunity measurement steps, RF disturbance signal characteristics, frequency stepping, test levels, dwell times and detailed measurement sequence.
• Field strength & impedance: Normative Annex A provides methods for field strength determination and characteristic impedance calculation/verification of stripline arrangements.
• IC stripline details: Normative Annex B and informative Annex C describe stripline geometries (open/closed), DUT dimensional limits and shielding effects; figures and tables support practical implementation.
• Reporting & acceptance: Specifies required test report content and includes a section on RF immunity acceptance levels.

Practical applications and users

This standard is aimed at professionals involved in IC EMC evaluation and product compliance:

• IC design and verification engineers - to validate IC immunity to radiated RF disturbances during design iterations.
• EMC test laboratories - to implement repeatable, comparable stripline-based radiated immunity tests for ICs.
• QA and compliance teams - to document immunity performance and produce standardized test reports for regulatory or customer requirements.
• PCB and system integrators - for understanding how IC immunity can be measured and how board geometry and grounding influence test results.

Practical value includes enabling consistent, reproducible radiated immunity measurements at the IC level, supporting root-cause EMC troubleshooting, and informing design mitigations.

Related standards and references

• IEC 62132‑1 (general conditions and definitions for IC immunity testing)
• IEC 61000‑4‑20 (EMC testing in TEM waveguides)
• IEC 60050 electropedia (vocabulary)

Keywords: IC stripline method, radiated immunity, electromagnetic immunity, IEC 62132‑8, integrated circuits, TEM waveguide, EMC test board, DUT monitoring, field strength, characteristic impedance.

Standards Content (Sample)

SLOVENSKI STANDARD
01-maj-2026
Nadomešča:
SIST EN 62132-8:2012
Integrirana vezja - Meritve elektromagnetne odpornosti - 8. del: Meritev odpornosti
proti sevanju - Metoda z IC na tračnem valovodu (IEC 62132-8:2026)
Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of
radiated immunity - IC stripline method (IEC 62132-8:2026)
Integrierte Schaltungen - Messung der elektromagnetischen Störfestigkeit - Teil 8:
Messung der Störfestigkeit bei Einstrahlungen - IC-Streifenleiterverfahren (IEC 62132-
8:2026)
Circuits intégrés - Mesure de l'immunité électromagnétique - Partie 8: Mesure de
l'immunité rayonnée - Méthode de la ligne TEM à plaques pour circuit intégré (IEC
62132-8:2026)
Ta slovenski standard je istoveten z: EN IEC 62132-8:2026
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62132-8

NORME EUROPÉENNE
EUROPÄISCHE NORM March 2026
ICS 31.200 Supersedes EN 62132-8:2012
English Version
Integrated circuits - Measurement of electromagnetic immunity -
Part 8: Measurement of radiated immunity - IC stripline method
(IEC 62132-8:2026)
Circuits intégrés - Mesure de l'immunité électromagnétique Integrierte Schaltungen - Messung der elektromagnetischen
- Partie 8: Mesure de l'immunité rayonnée - Méthode de la Störfestigkeit - Teil 8: Messung der Störfestigkeit bei
ligne TEM à plaques pour circuit intégré Einstrahlungen - IC-Streifenleiterverfahren
(IEC 62132-8:2026) (IEC 62132-8:2026)
This European Standard was approved by CENELEC on 2026-03-19. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2026 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62132-8:2026 E

European foreword
The text of document 47A/1205/FDIS, future edition 2 of IEC 62132-8, prepared by SC 47A
"Integrated circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 62132-8:2026.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2027-03-31
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2029-03-31
document have to be withdrawn
This document supersedes EN 62132-8:2012 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
This document is read in conjunction with EN 62132-1.
This document has been prepared under a standardization request addressed to CENELEC by the
European Commission. The Standing Committee of the EFTA States subsequently approves these
requests for its Member States.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 62132-8:2026 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 61000-4-20 NOTE Approved as EN IEC 61000-4-20
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 60050-131 - International Electrotechnical Vocabulary - - -
Part 131: Circuit theory
IEC 60050-161 - International Electrotechnical Vocabulary. - -
Chapter 161: Electromagnetic compatibility
IEC 62132-1 - Integrated circuits - Measurement of EN 62132-1 -
electromagnetic immunity - Part 1: General
conditions and definitions
IEC 62132-8 ®
Edition 2.0 2026-02
INTERNATIONAL
STANDARD
Integrated circuits - Measurement of electromagnetic immunity -
Part 8: Measurement of radiated immunity - IC stripline method
ICS 31.200  ISBN 978-2-8327-1030-2

IEC 62132-8:2026-02(en)
IEC 62132-8:2026 © IEC 2026
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 General . 6
5 Test conditions . 6
5.1 General . 6
5.2 Supply voltage . 6
5.3 Frequency range . 6
6 Test equipment . 7
6.1 General . 7
6.2 Cables . 7
6.3 Shielding. 7
6.4 RF disturbance generator . 7
6.5 IC stripline . 7
6.6 50 Ω termination . 7
6.7 DUT monitor . 7
7 Test setup . 7
7.1 General . 7
7.2 Test configuration . 7
7.3 EMC test board (PCB) . 8
8 Test procedure . 8
8.1 General . 8
8.2 Operational check . 8
8.3 Immunity measurement . 8
8.3.1 General . 8
8.3.2 RF disturbance signal . 9
8.3.3 Test frequency steps and ranges . 9
8.3.4 Test levels and dwell time . 9
8.3.5 DUT monitoring . 9
8.3.6 Detailed procedure . 9
9 Test report . 10
10 RF immunity acceptance level . 10
Annex A (normative) Field strength determination . 11
A.1 General . 11
A.2 Characteristic impedance of stripline arrangements . 11
A.3 Field strength calculation . 12
A.4 RF characteristic verification of the IC stripline . 12
Annex B (normative) IC stripline descriptions . 14
B.1 IC stripline . 14
B.2 Example for IC stripline arrangement . 15
Annex C (normative) Closed stripline geometrical limitations . 17
Bibliography . 22

IEC 62132-8:2026 © IEC 2026
Figure 1 – IC stripline test setup . 8
Figure A.1 – Definition of height (h) and width (w) of an IC stripline . 11
Figure A.2 – EM field distribution . 12
Figure B.1 – Cross-section view of an example of an open IC stripline . 14
Figure B.2 – Cross-section view of an example of a closed IC stripline . 15
Figure B.3 – Example of a closed version of an IC stripline . 16
Figure C.1 – Calculated H-field reduction of closed version referenced to referring
open version as a function of portion of active conductor width of closed version to
open version . 20
Figure C.2 – Illustration of currents on active conductor and mirrored currents used for
calculation of fields . 21

Table B.1 – Maximum DUT dimensions for 6,7 mm IC stripline (open version) . 15
Table B.2 – Maximum DUT dimensions for 6,7 mm IC stripline (closed version) . 15
Table C.1 – Height of shielding, simulated at h = 6,7mm to achieve practically
bottom
50 Ω system . 19

IEC 62132-8:2026 © IEC 2026
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
Integrated circuits - Measurement of electromagnetic immunity -
Part 8: Measurement of radiated immunity - IC stripline method

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for
standardization comprising all national electrotechnical committees (IEC National Committees).
The object of IEC is to promote international co-operation on all questions concerning
standardization in the electrical and electronic fields. To this end and in addition to other
activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National
Committee interested in the subject dealt with may participate in this preparatory work.
International, governmental and non-governmental organizations liaising with the IEC also
participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two
organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as
possible, an international consensus of opinion on the relevant subjects since each technical
committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted
by IEC National Committees in that sense. While all reasonable efforts are made to ensure that
the technical content of IEC Publications is accurate, IEC cannot be held responsible for the
way in which they are used or for any misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC
Publications transparently to the maximum extent possible in their national and regional
publications. Any divergence between any IEC Publication and the corresponding national or
regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies
provide conformity assessment services and, in some areas, access to IEC marks of conformity.
IEC is not responsible for any services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including
individual experts and members of its technical committees and IEC National Committees for
any personal injury, property damage or other damage of any nature whatsoever, whether direct
or indirect, or for costs (including legal fees) and expenses arising out of the publication, use
of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced
publications is indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve
the use of (a) patent(s). IEC takes no position concerning the evidence, validity or applicability
of any claimed patent rights in respect thereof. As of the date of publication of this document,
IEC had not received notice of (a) patent(s), which may be required to implement this document.
However, implementers are cautioned that this may not represent the latest information, which
may be obtained from the patent database available at https://patents.iec.ch. IEC shall not be
held responsible for identifying any or all such patent rights.
IEC 62132-8:2026 © IEC 2026
IEC 62132-8 has been prepared by subcommittee 47A: Integrated circuits, of IEC technical
committee 47: Semiconductor devices. It is an International Standard.
This second edition cancels and replaces the first edition published in 2012. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) frequency range of 150 kHz to 3 GHz was deleted from the scope;
b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements
are fulfilled.
The text of this Internation Standard is based on the following documents:
FDIS Report on voting
47A/1205/FDIS 47A/1209/RVD
Full information on the voting for the approval of this International Standard can be found in the
report on voting indicated in the above table.
The language used for the development of this International Standard is English.
This part of IEC 62132 is to be read in conjunction with IEC 62132-1.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all the parts in the IEC 62132 series, published under the general title Integrated circuits
- Measurement of electromagnetic immunity, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to
the specific publication. At this date, the publication will be
– reconfirmed,
– withdrawn, or
– revised.
IEC 62132-8:2026 © IEC 2026
1 Scope
This part of IEC 62132 specifies a method for measuring the immunity of an integrated circuit
(IC) to radio frequency (RF) radiated electromagnetic disturbances using an IC stripline.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050-131, International Electrotechnical Vocabulary (IEV) - Part 131: Circuit theory
IEC 60050-161, International Electrotechnical Vocabulary (IEV) - Part 161: Electromagnetic
compatibility
IEC 62132-1, Integrated circuits - Measurement of electromagnetic immunity - Part 1: General
conditions and definitions
3 Terms and definitions
For the purpose of this document, the terms and definitions given in IEC 62132-1, IEC 60050-
131 and IEC 60050-161, and the following, apply.
3.1
transverse electromagnetic mode
TEM mode
waveguide mode in which the components of the electric and magnetic fields in the propagation
direction are much less than the primary field components across any transverse cross-section
3.2
TEM waveguide
open or closed transmission line system, in which a wave is propagating in the transverse
electromagnetic mode to produce a specified field for testing purposes
3.3
IC stripline
TEM waveguide consisting of an active conductor placed on a defined spacing over an enlarged
ground plane, connected to a port structure on each end and an optional shielded enclosure
Note 1 to entry: This arrangement guides a wave propagation in the transverse electromagnetic mode to produce
a specific field for testing purposes between the active conductor and the enlarged ground plane. The ground plane
of the standard EMC test board, according to IEC 62132-1, is used. An optional shielding enclosure may be used to
shield the IC stripline. In contrast to the open version without a shielding enclosure, the shied leads to a closed
version of the IC stripline. For further information, see Annex A.
3.4
characteristic impedance
magnitude of the ratio of the voltage between the active conductor and the corresponding
ground plane to the current on either conductor for any constant phase wave-front
Note 1 to entry: The characteristic impedance is independent of the voltage/current magnitudes and depends only
on the cross sectional geometry of the transmission line. TEM waveguides are typically designed to have a 50 Ω
characteristic impedance. For further information and equation to stripline arrangements, see Annex A.
IEC 62132-8:2026 © IEC 2026
3.5
primary field component
electric field component aligned with the intended test polarization
Note 1 to entry: For example, in IC stripline, the active conductor is parallel to the horizontal floor, and the primary
mode electric field vector is vertical at the transverse centre of the IC stripline.
4 General
An IC to be evaluated for EMC performance is referred to as a device under test (DUT). The
DUT should be mounted on an EMC test board according to IEC 62132-1. The EMC test board
is provided with the appropriate measurement or monitoring points at which the DUT response
parameters can be measured. It controls the geometry and orientation of the DUT relative to
the active conductor and eliminates in the case of a closed version of the IC stripline any
connecting leads within the housing (these are on the non-DUT side of the board, which is
outside the housing).
For the IC stripline, one of the 50 Ω ports is terminated with a 50 Ω load. The other 50 Ω port
is connected to the output of an RF disturbance generator. The injected RF disturbance signal
exposes the DUT to an electromagnetic field determined by the injected power, the typical
impedance and the distance between the ground plane of the EMC test board and the active
conductor of the IC stripline. The relation is given in Annex A.
Rotating the EMC test board in the four possible orientations in the aperture to accept EMC test
board of the IC stripline will affect the sensitivity of the DUT. Dependent upon the DUT, the
response parameters of the DUT may vary (e.g. a change of current consumption, deterioration
in function performance, waveform jitter). The intent of this test method is to provide a
quantitative measure of the RF immunity of DUTs for comparison or other purposes.
For further information, see Annex A.
5 Test conditions
5.1 General
The test conditions shall meet the requirements as described in IEC 62132-1. In addition, the
following test conditions shall apply.
5.2 Supply voltage
The supply voltage shall be as specified by the IC manufacturer. If the users of this procedure
agree to other values, they shall be documented in the test report.
5.3 Frequency range
The effective frequency range of this radiated immunity procedure is 150 kHz to 6 GHz in
combination with the voltage standing wave ratio (VSWR) characteristic ≤ 1,25 for f ≤ 3 GHz
and ≤ 1,4 for f > 3 GHz. The upper frequency can be extended if the IC stripline does not exhibit
significant higher order modes over the frequency range being measured.
NOTE 1 The given VSWR value of 1,4 is based on evolving technical solutions for IC striplines. For accuracy
reasons, the VSWR value is targeted as low as possible (e.g. 1,3).
NOTE 2 Higher-order modes can affect the VSWR of the IC Striplines by interfering with the TEM mode and perturb
the desired field distribution.
IEC 62132-8:2026 © IEC 2026
6 Test equipment
6.1 General
The test equ
...