SIST EN IEC 61139-3:2024

Industrial networks - Single-drop digital communication interface - Part 3: Wireless extensions (IEC 61139-3:2023)

IEC 61139-3:2023 specifies a wireless single-drop digital communication interface (SDCI wireless).
This is an extension to the single-drop digital communication interface (SDCI) technology that is specified in IEC 61131-9.
This document specifies the wireless communication services and protocol (physical layer, data link layer and application layer in accordance with the ISO/OSI reference model) for W‑Masters and W‑Devices.
NOTE This document does not cover the integration into higher level systems such as fieldbuses.

Industrielle Netzwerke - Digitale Single-Drop-Kommunikationsschnittstelle - Teil 3: Drahtlose Erweiterungen (IEC 61139-3:2023)

Réseaux industriels - Interface de communication numérique point à point - Partie 3: Extensions sans fil (IEC 61139-3:2023)

L’IEC 61139:2023 spécifie une interface de communication numérique point à point sans fil (SDCI sans fil).
Il s’agit d’une extension de la technologie d’interface de communication numérique point à point (SDCI) qui est spécifiée dans l’IEC 61131-9.
Le présent document spécifie les services et le protocole de communication sans fil (couche physique, couche de liaison de données et couche d’application conformément au modèle de référence ISO/OSI) pour les Maîtres sans fil et les Appareils sans fil.
NOTE Le présent document ne couvre pas l’intégration dans des systèmes de niveau supérieur tels que les bus de terrain.

Industrijska omrežja - Enožični digitalni komunikacijski vmesnik - 3. del: Brezžične razširitve (IEC 61139-3:2023)

Standard IEC 61139-3:2023 določa brezžični enožični digitalni komunikacijski vmesnik (brezžični SDCI).
To je razširitev tehnologije enožičnega digitalnega komunikacijskega vmesnika, ki je določena v standardu IEC 61131-9.
Ta dokument določa brezžične komunikacijske storitve in protokol (fizično plast, plast podatkovnih povezav in aplikacijsko plast v skladu z referenčnim modelom ISO/OSI) za W‑Masters in W‑Devices.
OPOMBA: Ta dokument ne zajema integracije v sisteme višje ravni, kot so področna vodila.

General Information

• Status: Published
• Public Enquiry End Date: 18-Dec-2022
• Publication Date: 05-Mar-2024
• ICS: 25.040.40 - Industrial process measurement and control
• ICS: 35.110 - Networking
• ICS: 35.200 - Interface and interconnection equipment
• Technical Committee: MOV - Measuring equipment for electromagnetic quantities
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 12-Dec-2023
• Due Date: 16-Feb-2024
• Completion Date: 06-Mar-2024
• Ref Project: EN IEC 61139-3:2023 - Industrial networks - Single-drop digital communication interface - Part 3: Wireless extensions

Overview

EN IEC 61139-3:2023 (Industrial networks - Single-drop digital communication interface - Part 3: Wireless extensions) specifies a wireless extension to the SDCI technology defined in IEC 61131-9. Often called SDCI wireless, this standard defines the wireless services and protocol layers (physical, data link and application) for W‑Masters and W‑Devices, aligned with the ISO/OSI model. It targets single-drop (point-to-point) digital links for small sensors and actuators in industrial automation. Note: the document does not cover integration into higher-level systems such as fieldbuses.

Key topics and requirements

• Layered protocol specification: defines the Physical Layer (PL), Data Link Layer (DL‑A) and Application Layer behaviors required for SDCI wireless interoperability.
• Air interface & cell concept: describes topology, W‑Cycles, W‑Frames and slotning mechanisms (uplink/downlink, single/double slot transmission).
• Medium access and coexistence: MAC rules, frequency channels, hopping algorithms, blocklisting and wireless quality supervision to ensure reliable operation in industrial environments.
• Device roles & procedures: behavior and services for W‑Master, W‑Device and W‑Bridge including scan (discovery), pairing/unpairing, automatic pairing, roaming and “I am alive” supervision.
• Physical layer details: modulation, carrier calibration, transmission power, antenna requirements, receiver sensitivity, preamble/syncword, CRC and data whitening.
• Conformity & coexistence references: normative references include IEC 61131-9, IEC/TR 62453-61, ETSI EN 300 328, ETSI EN 300 440 and FCC §15.247 - supporting regulatory compliance and coexistence management.
• Testable state machines & services: PL and DL state machines and service primitives are specified to support implementation, testing and certification.

Applications and who uses this standard

• Device manufacturers building wireless sensors, actuators and I/O modules that implement SDCI wireless for factory automation and process control.
• Control system OEMs integrating wireless single-drop links at the sensor/actuator level.
• System integrators and automation engineers designing wireless cells, planning RF coexistence and defining device roles.
• Test labs and certification bodies verifying interoperability, conformity and regulatory compliance.
• Standards committees and product managers aligning roadmaps to IEC 61131-9 ecosystems.

Practical use cases include replacing wired single-drop links with low-power wireless connections for distributed sensors and actuators, simplifying retrofit installations, and enabling flexible machine layouts while maintaining deterministic SDCI behavior.

Related standards

• IEC 61131-9 (SDCI baseline)
• IEC/TR 62453-61 (coexistence management)
• ETSI EN 300 328, ETSI EN 300 440 (radio harmonized standards)
• FCC §15.247 (U.S. radio rules)

EN IEC 61139-3:2023 is essential for anyone implementing interoperable, regulatory-compliant wireless SDCI devices in industrial networks.

Standards Content (Sample)

SLOVENSKI STANDARD
01-april-2024
Industrijska omrežja - Enožični digitalni komunikacijski vmesnik - 3. del: Brezžične
razširitve (IEC 61139-3:2023)
Industrial networks - Single-drop digital communication interface - Part 3: Wireless
extensions (IEC 61139-3:2023)
Industrielle Netzwerke - Digitale Single-Drop-Kommunikationsschnittstelle - Teil 3:
Drahtlose Erweiterungen (IEC 61139-3:2023)
Réseaux industriels - Interface de communication numérique point à point - Partie 3:
Extensions sans fil (IEC 61139-3:2023)
Ta slovenski standard je istoveten z: EN IEC 61139-3:2023
ICS:
25.040.40 Merjenje in krmiljenje Industrial process
industrijskih postopkov measurement and control
35.110 Omreževanje Networking
35.200 Vmesniška in povezovalna Interface and interconnection
oprema equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61139-3

NORME EUROPÉENNE
EUROPÄISCHE NORM December 2023
ICS 35.200
English Version
Industrial networks - Single-drop digital communication interface
- Part 3: Wireless extensions
(IEC 61139-3:2023)
Réseaux industriels - Interface de communication Industrielle Netzwerke - Digitale Single-Drop-
numérique point à point - Partie 3: Extensions sans fil Kommunikationsschnittstelle - Teil 3: Drahtlose
(IEC 61139-3:2023) Erweiterungen
(IEC 61139-3:2023)
This European Standard was approved by CENELEC on 2023-12-06. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2023 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61139-3:2023 E

European foreword
The text of document 65C/1268/FDIS, future edition 1 of IEC 61139-3, prepared by SC 65C "Industrial
networks" of IEC/TC 65 "Industrial-process measurement, control and automation" was submitted to
the IEC-CENELEC parallel vote and approved by CENELEC as EN IEC 61139-3:2023.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2024-09-06
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2026-12-06
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 61139-3:2023 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standard indicated:
IEC 61139 (series) NOTE Approved as EN IEC 61139 (series)
IEC 61375-1 NOTE Approved as EN 61375-1
IEC/TR 62453-61 NOTE Approved as CLC/TR 62453-61
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the
relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cencenelec.eu.
Publication Year Title EN/HD Year
IEC 61131-1 - Programmable controllers - Part 1: General EN 61131-1 -
information
IEC 61131-2 - Industrial-process measurement and - -
control - Programmable controllers - Part 2:
Equipment requirements and tests
IEC 61131-9 2022 Programmable controllers - Part 9: Single- EN IEC 61131-9 2022
drop digital communication interface for
small sensors and actuators (SDCI)
IEC 61158-1 - Industrial communication networks - EN IEC 61158-1 -
Fieldbus specifications - Part 1: Overview
and guidance for the IEC 61158 and IEC
61784 series
IEC 62657-2 - Industrial communication networks - EN 62657-2 -
Wireless communication networks - Part 2:
Coexistence management
ETSI EG 203 367 - Short Range Devices (SRD) ETSI EG 203 - -
367 “Guide to the application of
harmonized standards covering articles
3.1b and 3.2 of the Directive 2014/53/EU
(RED) to multi-ratio and combined ratio
and non-radio equipment”
ETSI EN 300 328 - Wideband transmission systems; Data - -
transmission equipment operating in the
2,4 GHz ISM band and using wide band
modulation techniques; Harmonised
Standard covering the essential
requirements of article 3.2 of Directive
2014/53/EU”
ETSI EN 300 440 - Short Range Devices (SRD); Radio - -
equipment to be used in the 1 GHz to 40
GHz frequency range; Harmonised
Standard covering the essential
requirements of article 3.2 of Directive
2014/53/EU
FCC §15.247 - Radio frequency devices; Operation within - -
the bands 902-928 MHz, 2400-2483.5
MHz, and 5725-5850 MHz
IEC 61139-3 ®
Edition 1.0 2023-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Industrial networks – Single-drop digital communication interface –

Part 3: Wireless extensions
Réseaux industriels – Interface de communication numérique point à point –

Partie 3: Extensions sans fil
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 35.200  ISBN 978-2-8322-7751-5

– 2 – IEC 61139-3:2023 © IEC 2023
CONTENTS
FOREWORD . 20
INTRODUCTION . 22
1 Scope . 23
2 Normative references . 23
3 Terms and definitions, abbreviated terms and conventions . 24
3.1 Terms and definitions . 24
3.2 Abbreviated terms . 30
3.3 Conventions . 32
3.3.1 General . 32
3.3.2 Service primitives . 32
3.3.3 Service parameters. 33
3.3.4 Service procedures . 33
3.3.5 Service attributes . 34
3.3.6 Figures . 34
3.3.7 Transmission octet order . 35
3.3.8 Behavioral descriptions . 35
3.3.9 Triple table format . 36
4 Overview of wireless digital communication interface . 36
4.1 Purpose and topology . 36
4.2 Positioning in the automation hierarchy . 36
4.2.1 General . 36
4.2.2 Relationship to IEC 61131-9 . 37
4.2.3 Role of a W‑Master . 38
4.2.4 Role of a W‑Device . 39
4.2.5 Role of a W-Bridge . 39
4.2.6 System configuration tool . 39
4.2.7 Mapping to fieldbuses . 39
4.3 Cell concept . 39
4.4 Wireless Mechanisms . 41
4.4.1 General . 41
4.4.2 Scan (W‑Device Discovery) . 41
4.4.3 Pairing . 41
4.4.4 Unpairing . 42
4.4.5 Roaming . 42
4.4.6 Automatic Pairing . 43
4.4.7 Transmission Error Handling . 44
4.4.8 "I am alive" supervision (IMA) . 44
4.4.9 Wireless Quality supervision . 44
4.5 Concept of air interface . 44
4.5.1 General . 44
4.5.2 Frequency division multiple access (FDMA) . 45
4.5.3 Time Division Multiple Access (TDMA). 45
4.5.4 SSlots, DSlots, transmission capacity . 47
4.5.5 Assignment of W‑Devices to W-Tracks and slots . 47
4.5.6 Assignment of W-Ports to W‑Devices . 48
4.5.7 W-Cycle . 48

IEC 61139-3:2023 © IEC 2023 – 3 –
4.5.8 W-Frame . 49
4.6 Characteristics of the SDCI-W technology . 49
4.7 Layer model . 50
4.8 Conformity assessment . 50
5 Physical Layer (PL) . 51
5.1 General . 51
5.2 Base technology, Physical Layer (PL) . 51
5.2.1 General . 51
5.2.2 Transmission rate . 51
5.2.3 Carrier frequency accuracy . 51
5.2.4 W‑Device Carrier frequency calibration . 51
5.2.5 W‑Master Carrier frequency calibration . 51
5.2.6 Modulation . 51
5.2.7 Transmission power . 52
5.2.8 Antenna . 52
5.2.9 SDCI wireless receiver sensitivity . 52
5.2.10 Transceiver timings . 52
5.3 Downlink and uplink . 55
5.3.1 Transmission octet order for WORD based data types . 55
5.3.2 Downlink and uplink transmission . 56
5.3.3 Preamble . 56
5.3.4 Syncword. 57
5.3.5 Downlink and uplink CRC . 58
5.3.6 CRC Transmission . 58
5.3.7 Data Whitening . 59
5.3.8 Regular downlink packet . 60
5.3.9 Configuration downlink packet . 61
5.3.10 Uplink Single Slot . 61
5.3.11 Uplink Double Slot . 62
5.4 W-Sub-cycle . 62
5.4.1 General . 62
5.4.2 W-Sub-cycle structure . 62
5.4.3 Regular W-Frame . 63
5.4.4 Configuration W-Frame . 64
5.5 Medium Access Control (MAC) . 64
5.5.1 General . 64
5.5.2 Frequency channels . 65
5.5.3 Alternative Hopping algorithms . 66
5.5.4 Configuration Frequencies . 66
5.5.5 Blocklisting . 66
5.5.6 Wireless Quality . 66
5.6 Physical Layer (PL) services . 68
5.6.1 Overview . 68
5.6.2 PL Services for W‑Master . 68
5.6.3 PL Services for W‑Device . 82
5.7 Physical Layer PL protocol . 89
5.7.1 Usage of the Configuration Channel . 89
5.7.2 PL W‑Master state machine . 94
5.7.3 PL W‑Device state machine . 106

– 4 – IEC 61139-3:2023 © IEC 2023
6 Data Link Layer DL-A . 111
6.1 General . 111
6.2 General W‑Master . 112
6.2.1 General . 112
6.2.2 W-Track and W‑Device-Mapper (TDMapper). 112
6.3 General (W‑Device) . 112
6.4 DL-A services . 113
6.4.1 Overview . 113
6.4.2 MCmd (W‑Master and W‑Device) . 113
6.4.3 ISDUMsg (W‑Master and W‑Device) . 114
6.4.4 DownLinkAck (W‑Master) . 116
6.4.5 UpLinkAck (W‑Device) . 118
6.4.6 EventMsg (W‑Master and W‑Device) . 118
6.4.7 PDOutMsg (W‑Master and W‑Device) . 119
6.4.8 PDInMsg (W‑Master and W‑Device) . 121
6.5 Acknowledgments (DownLinkAck and UpLinkAck) . 122
6.6 Message handler . 122
6.6.1 General . 122
6.6.2 State machine of the W‑Master Message handler (DL-A) . 123
6.6.3 Compilation of DLink control octet . 126
6.6.4 State machine of the W‑Device Message handler (DL-A) . 127
6.6.5 Compilation of ULink control octet . 131
7 Data Link Layer DL-B . 132
7.1 DL-B services . 132
7.1.1 Overview of services within W‑Master and W‑Device . 132
7.1.2 DL_PDCycle (W‑Master and W‑Device) . 132
7.1.3 DL_PDInputTransport (W‑Master) . 132
7.1.4 DL_Control (W‑Master and W‑Device) . 133
7.1.5 DL_PDOutputUpdate (W‑Master) . 133
7.1.6 DL_PDOutputTransport (W‑Device) . 134
7.1.7 DL_PDInputUpdate (W‑Device) . 135
7.1.8 DL_Event (W‑Master and W‑Device) . 135
7.1.9 DL_ISDUTransport (W‑Master and W‑Device) . 136
7.1.10 DL_ISDUAbort (W‑Master and W‑Device) . 137
7.1.11 DL_TDConfig (W‑Master) . 137
7.1.12 DL_Read (W‑Master and W‑Device) . 138
7.1.13 DL_Write (W‑Master and W‑Device) . 140
7.1.14 DL_SetMode (W‑Master) . 141
7.1.15 DL_Mode (W‑Master and W‑Device) . 142
7.1.16 DL_MaxRetry (W‑Device) . 142
7.1.17 DL_SetParam (W‑Master and W‑Device) . 142
7.2 DL-mode handler . 143
7.2.1 General . 143
7.2.2 State machine of the W‑Master DL-mode handler . 144
7.2.3 State machine of the W‑Device DL-mode handler . 146
7.3 Process Data handler. 147
7.3.1 General . 147
7.3.2 State machine of the W‑Master Process Data Out handler . 147

IEC 61139-3:2023 © IEC 2023 – 5 –
7.3.3 State machine of the W‑Master Process Data In handler . 151
7.3.4 State machine of the W‑Device Process Data Out handler . 153
7.3.5 State machine of the W‑Device Process Data In handler . 155
7.4 Indexed Service Data Unit (ISDU) handler . 157
7.4.1 General . 157
7.4.2 State machine of the W‑Master ISDU handler . 157
7.4.3 State machine of the W‑Device ISDU handler . 160
7.4.4 General structure and encoding of ISDUs . 162
7.5 Command handler . 163
7.5.1 General . 163
7.5.2 State machine of the W‑Master command handler . 163
7.5.3 State machine of the W‑Device command handler . 166
7.6 Event handler . 167
7.6.1 General . 167
7.6.2 State machine of the W‑Master Event handler . 167
7.6.3 State machine of the W‑Device Event handler . 170
7.7 Transmission of segmented data and retry handling . 171
7.7.1 General . 171
7.7.2 Transmission of segmented data . 172
7.7.3 Retry-Handling . 173
8 Application Layer (AL) . 174
8.1 General . 174
8.2 Application Layer services . 174
8.2.1 General . 174
8.2.2 AL_Read (W‑Master and W‑Device) . 174
8.2.3 AL_Write (W‑Master and W‑Device) . 176
8.2.4 AL_Abort (W‑Master and W‑Device) . 177
8.2.5 AL_NewInput (W‑Master) . 177
8.2.6 AL_GetInput (W‑Master) . 178
8.2.7 AL_SetInput (W‑Device) . 179
8.2.8 AL_PDCycle (W‑Master and W‑Device) . 179
8.2.9 AL_GetOutput (W‑Device) . 180
8.2.10 AL_NewOutput (W‑Device) . 180
8.2.11 AL_SetOutput (W‑Master) . 181
8.2.12 AL_Event (W‑Master and W‑Device) . 181
8.2.13 AL_Control (W‑Master and W‑Device) . 183
8.3 Application layer protocol . 183
8.3.1 Overview . 183
8.3.2 ISDU processing . 183
8.3.3 Event processing . 189
8.3.4 Process Data transfer . 191
9 System management . 195
9.1 General . 195
9.2 Modes . 195
9.2.1 Service Mode . 195
9.2.2 Cyclic Mode . 196
9.3 System management of the W‑Master . 197
9.3.1 Overview . 197

– 6 – IEC 61139-3:2023 © IEC 2023
9.3.2 System management W‑Master services . 198
9.3.3 SM W‑Master protocol . 211
9.4 System management of the W‑Device . 223
9.4.1 Overview . 223
9.4.2 System management W‑Device services . 224
9.4.3 SM W‑Device protocol . 231
10 W‑Device . 238
10.1 Overview. 238
10.2 Process Data Exchange (PDE) . 239
10.3 IMA handling . 240
10.4 Parameter Manager (PM) . 240
10.4.1 General . 240
10.4.2 Parameter manager state machine . 241
10.4.3 Dynamic parameter . 241
10.4.4 Single parameter . 241
10.4.5 Block parameter . 241
10.4.6 Concurrent parameterization access . 241
10.4.7 Command handling . 241
10.5 Data Storage (DS) . 241
10.6 Event Dispatcher (ED) . 241
10.7 W‑Device features . 242
10.7.1 General . 242
10.7.2 Scan . 242
10.7.3 Pairing by UniqueID . 242
10.7.4 Pairing by Button / Re-Pairing . 242
10.7.5 Roaming . 242
10.7.6 Unpairing . 242
10.7.7 W‑Device backward compatibility . 243
10.7.8 Protocol revision compatibility . 243
10.7.9 Device human machine interface (HMI) . 243
10.7.10 Parameter access locking . 243
10.7.11 Data Storage locking . 243
10.7.12 W‑Device parameter locking . 243
10.7.13 W‑Device user interface locking . 243
10.7.14 Data Storage concept . 244
10.7.15 Block Parameter . 244
10.8 W‑Device reset options . 244
10.9 W‑Device design rules and constraints . 244
10.9.1 General . 244
10.9.2 Process Data . 244
10.9.3 MaxRetry error detection . 244
10.9.4 Communication loss . 245
10.9.5 Direct Parameter Page . 245
10.9.6 ISDU communication channel . 245
10.9.7 DeviceID rules related to W‑Device variants . 245
10.9.8 Protocol constants . 245
10.10 I/O W‑Device description (IODD) . 246
10.10.1 General . 246
10.10.2 Profile Characteristics. 247

IEC 61139-3:2023 © IEC 2023 – 7 –
10.10.3 CommNetwork Profile Instance for the IODD . 247
10.11 W‑Device diagnosis . 249
10.11.1 Concepts . 249
10.11.2 Events . 249
10.11.3 W‑Device HMI . 250
10.12 W‑Device connectivity . 251
11 W‑Master . 251
11.1 Overview. 251
11.2 Services of the Standardized Master Interface (SMI) . 254
11.2.1 Overview . 254
11.2.2 SMI_WMasterConfiguration . 255
11.2.3 SMI_ReadbackWMasterConfiguration . 256
11.2.4 SMI_WTrackStatus . 258
11.2.5 SMI_WScan . 260
11.2.6 SMI_WPortPairing . 262
11.2.7 SMI_WScanStatus . 264
11.2.8 SMI_WQualityStatus . 266
11.3 Configuration Manager (CM) . 268
11.3.1 General . 268
11.3.2 Coordination of Master applications . 268
11.3.3 State machines of the Configuration Manager . 269
11.4 Data Storage (DS) . 275
11.5 On-request Data Exchange (ODE) . 276
11.6 Diagnosis Unit (DU) . 276
11.7 Process Data Exchange (PDE) . 276
11.7.1 General . 276
11.7.2 Process Data input mapping . 276
11.7.3 Process Data output mapping . 276
11.7.4 Process Data invalid/valid qualifier status . 276
11.8 Port and Device Configuration Tool (PDCT) . 277
11.8.1 General . 277
11.8.2 Basic layout examples . 277
11.9 Gateway application . 279
11.9.1 General . 279
11.9.2 Changing W‑Device configuration including Data Storage . 279
11.9.3 Parameter server and recipe control . 279
11.9.4 Interoperability to 5G Systems . 280
11.10 Human machine Interface (HMI), Faulty W‑Device replacement . 280
12 W-Bridge . 280
12.1 Overview. 280
12.2 Process Data Exchange (PDE) . 281
12.2.1 General . 281
12.2.2 Process Data mapping . 281
12.3 On-request Data Exchange (ODE) . 281
12.3.1 General . 281
12.3.2 Wireless Parameters . 281
12.3.3 Parameters of connected SDCI Device . 281
12.4 Data Storage . 282
12.5 Diagnosis Unit (DU) . 282

– 8 – IEC 61139-3:2023 © IEC 2023
12.5.1 General . 282
12.5.2 Device Events (Wireless) . 282
12.5.3 Device Events . 282
12.5.4 Port Events . 282
12.6 Design Rules . 283
12.6.1 General . 283
12.6.2 Timing constraints . 283
12.6.3 Static behaviour . 283
12.6.4 Dynamic behavior . 285
12.6.5 UniqueID . 292
12.7 I/O W‑Device description (W-IODD) . 292
Annex A (normative) W-Messages Codings . 294
A.1 Overview. 294
A.2 Definition of a W-Message . 294
A.3 Downlink W-Messages: control octets . 294
A.3.1 DLink control octet . 294
A.3.2 DLink control octets contains MasterCommand . 296
A.4 Uplink W-Messages . 297
A.4.1 General . 297
A.4.2 ULink control octet . 297
A.5 Example for combination of several W-Messages within a DLink / PreDLink . 297
A.6 Example for DLink data transmission within cyclic process data and
segmentation .
...