SIST EN 60749:2002 + A1:2002

Semiconductor devices - Mechanical and climatic test methods

EN following parallel vote * Superseded by EN 60749 series

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren

Dispositifs à semiconducteurs - Essais mécaniques et climatiques

Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996)

General Information

• Status: Withdrawn
• Publication Date: 31-Aug-2002
• Withdrawal Date: 30-Jun-2004
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 9900 - Withdrawal (Adopted Project)
• Start Date: 01-Jul-2004
• Due Date: 01-Jul-2004
• Completion Date: 01-Jul-2004
• Ref Project: EN 60749:1999/A1:2000 - Semiconductor devices - Mechanical and climatic test methods

Relations

• Replaced By: SIST EN 60749-10:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 10: Mechanical shock
• Effective Date: 28-Jan-2023
• Replaced By: SIST EN 60749-9:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 9: Permanence of marking
• Effective Date: 28-Jan-2023
• Revised: SIST EN 60749-13:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 13: Salt atmosphere
• Effective Date: 13-May-2010
• Revised: SIST EN 60749-11:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method
• Effective Date: 13-May-2010
• Revised: SIST EN 60749-9:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 9: Permanence of marking
• Effective Date: 13-May-2010
• Revised: SIST EN 60749-4:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
• Effective Date: 13-May-2010
• Revised: SIST EN 60749-12:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 12: Vibration, variable frequency
• Effective Date: 13-May-2010
• Revised: SIST EN 60749-10:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 10: Mechanical shock
• Effective Date: 13-May-2010
• Revised: SIST EN 60749-2:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure
• Effective Date: 13-May-2010
• Revised: SIST EN 60749-6:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 6: Storage at high temperature
• Effective Date: 13-May-2010
• Revised: SIST EN 60749-1:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
• Effective Date: 13-May-2010
• Revised: SIST EN 60749-15:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices
• Effective Date: 13-May-2010
• Revised: SIST EN 60749-14:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
• Effective Date: 13-May-2010
• Revised: SIST EN 60749-31:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)
• Effective Date: 13-May-2010
• Replaced By: SIST EN 60749-3:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 3: External visual examination
• Effective Date: 29-Jan-2023
• Replaced By: SIST EN 60749-1:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
• Effective Date: 28-Jan-2023
• Replaced By: SIST EN 60749-7:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 7: Internal moisture content measurement and the analysis of other residual gases
• Effective Date: 06-May-2014
• Replaced By: SIST EN 60749-31:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)
• Effective Date: 28-Jan-2023
• Revised: SIST EN 60749-3:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 3: External visual examination
• Effective Date: 13-May-2010
• Replaced By: SIST EN 60749-4:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
• Effective Date: 29-Jan-2023
• Replaced By: SIST EN 60749-7:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 7: Internal moisture content measurement and the analysis of other residual gases
• Effective Date: 29-Jan-2023
• Replaced By: SIST EN 60749-15:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices
• Effective Date: 28-Jan-2023
• Replaced By: SIST EN 60749-13:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 13: Salt atmosphere
• Effective Date: 29-Jan-2023
• Replaced By: SIST EN 60749-6:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 6: Storage at high temperature
• Effective Date: 29-Jan-2023
• Replaced By: SIST EN 60749-12:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 12: Vibration, variable frequency
• Effective Date: 29-Jan-2023
• Replaced By: SIST EN 60749-31:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-2:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-9:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 9: Permanence of marking
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-3:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 3: External visual examination
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-1:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-12:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 12: Vibration, variable frequency
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-10:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 10: Mechanical shock
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-6:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 6: Storage at high temperature
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-14:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-11:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-4:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-13:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 13: Salt atmosphere
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-7:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 7: Internal moisture content measurement and the analysis of other residual gases
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-15:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices
• Effective Date: 07-Jun-2022
• Replaced By: SIST EN 60749-2:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure
• Effective Date: 29-Jan-2023
• Replaced By: SIST EN 60749-14:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
• Effective Date: 29-Jan-2023
• Replaced By: SIST EN 60749-11:2004 - Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method
• Effective Date: 29-Jan-2023

Standards Content (Sample)

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996)Halbleiterbauelemente - Mechanische und klimatische PrüfverfahrenDispositifs à semiconducteurs - Essais mécaniques et climatiquesSemiconductor devices - Mechanical and climatic test methods31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in generalICS:Ta slovenski standard je istoveten z:EN 60749:1999/A1:2000SIST EN 60749:2002 + A1:2002en01-september-2002SIST EN 60749:2002 + A1:2002SLOVENSKI
STANDARD



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2002



SIST EN 60749:2002 + A1:2
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