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SIST EN 60068-2-58:2001

(Main)

Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

Umweltprüfungen -- Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit, Widerstandsfähigkeit gegenüber Auflösen der Metallisierung und Lötwärmebeständigkeit bei oberflächenmontierbaren Bauelemente (SMD)

Essais d'environnement -- Partie 2-58: Essais - Essai Td: Méthodes d'essai de la soudabilité, de la résistance de la métallisation à la dissolution et de la résistance à la chaleur de soudage des composants pour montage en surface (CMS)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

General Information

Status
Withdrawn
Publication Date
28-Feb-2001
Withdrawal Date
16-Mar-2008
ICS
19.040 - Environmental testing
31.190 - Electronic component assemblies
Technical Committee
ITIV - Electronics assembly technology and Environmental standardization
Current Stage
9900 - Withdrawal (Adopted Project)
Start Date
28-Jan-2008
Due Date
20-Feb-2008
Completion Date
17-Mar-2008
Ref Project
EN 60068-2-58:1999 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Relations

Replaced By
SIST EN 60068-2-58:2005 - Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Effective Date
28-Jan-2023
Replaced By
SIST EN 60068-2-58:2005 - Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Effective Date
06-May-2014
Replaces
SIST EN 60068-2-58:2005 - Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Effective Date
01-Apr-2008

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60068-2-58:2001
01-marec-2001
1DGRPHãþD
SIST EN 60068-2-58:2005
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability,
resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability,
resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMD)
Umweltprüfungen -- Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit,
Widerstandsfähigkeit gegenüber Auflösen der Metallisierung und Lötwärmebeständigkeit
bei oberflächenmontierbaren Bauelemente (SMD)
Essais d'environnement -- Partie 2-58: Essais - Essai Td: Méthodes d'essai de la
soudabilité, de la résistance de la métallisation à la dissolution et de la résistance à la
chaleur de soudage des composants pour montage en surface (CMS)
Ta slovenski standard je istoveten z: EN 60068-2-58:1999
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 60068-2-58:2001 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovolje
...

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