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SIST EN 60068-2-69:2001

(Main)

Environmental testing -- Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

Environmental testing -- Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.

Umweltprüfungen -- Teil 2: Prüfungen - Prüfung Te: Prüfung der Lötbarkeit von Bauelementen der Elektronik für Oberflächenmontagetechnologie mit der Benetzungswaage

Essai d'environnement -- Partie 2: Essais - Essai Te: Essai de brasabilité des composants électroniques pour la technologie de montage en surface par la méthode de la balance de mouillage

Décrit deux méthodes d'essai à la balance de mouillage. Les deux méthodes sont destinées à déterminer quantitativement la brasabilité des sorties sur les composants montés en surface. Les modes opératoires décrivent la méthode de la balance de mouillage en bain d'alliage ainsi que la méthode de la balance de mouillage à la goutte d'alliage; ces deux méthodes sont applicables aux composants munis de sorties métalliques et plots de soudage métallisés.

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

General Information

Status
Withdrawn
Publication Date
28-Feb-2001
Withdrawal Date
15-Aug-2021
ICS
19.040 - Environmental testing
Technical Committee
ITIV - Electronics assembly technology and Environmental standardization
Current Stage
9990 - Retro Withdrawal (Adopted Project)
Start Date
28-Jul-2021
Due Date
20-Aug-2021
Completion Date
16-Aug-2021
Ref Project
EN 60068-2-69:1996 - Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

Relations

Replaced By
SIST EN 60068-2-69:2008 - Environmental testing -- Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Effective Date
29-Jan-2023
Replaced By
SIST EN 60068-2-69:2008 - Environmental testing -- Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Effective Date
07-Jun-2022
Replaced By
SIST EN 60068-2-69:2008 - Environmental testing -- Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Effective Date
01-Jul-2010

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60068-2-69:2001
01-marec-2001
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of
electronic components for surface mount technology by the wetting balance
method
Environmental testing -- Part 2: Tests - Test Te: Solderability testing of electronic
components for surface mount technology by the wetting balance method
Umweltprüfungen -- Teil 2: Prüfungen - Prüfung Te: Prüfung der Lötbarkeit von
Bauelementen der Elektronik für Oberflächenmontagetechnologie mit der
Benetzungswaage
Essai d'environnement -- Partie 2: Essais - Essai Te: Essai de brasabilité des
composants électroniques pour la technologie de montage en surface par la méthode de
la balance de mouillage
Ta slovenski standard je istoveten z: EN 60068-2-69:1996
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
SIST EN 60068-2-69:2001 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60068-2-69:2001

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