Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2022)

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.
This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3: Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten (IEC 60286-3:2022)

Emballage de composants pour opérations automatisées - Partie 3: Emballage des composants pour montage en surface en bandes continues (IEC 60286-3:2022)

L’IEC 60286-3:2022 s’applique à la mise sur bande des composants électroniques sans fils de sortie ou avec tronçons de sortie destinés à être connectés à des circuits électroniques. Elle fournit uniquement les dimensions essentielles pour la mise sur bande des composants destinés aux opérations susmentionnées. Le présent document inclut également des exigences relatives à l’emballage de produits à puce isolée incluant puces nues et puces à contact (puces retournées). Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:


       
  1. ajout de termes et définitions;

  2.    
  3. ajout d’un tableau de classification des symboles relatifs au diamètre du trou d’entraînement et à la distance entre le centre de l’orifice de la bobine et le centre du trou d’entraînement;

  4.    
  5. ajout du trou d’entraînement par rapport à la bobine (facultatif);

  6.    
  7. révision des tolérances du diamètre de l’orifice de la bobine;

  8.    
  9. révision des tolérances de dimension de la largeur de la bande d’entraînement de 72 mm;

  10.    
  11. ajout de l’Annexe B (informative);

  12.    
  13. ajout de la taille de composant 0201M.

Pakiranje komponent za avtomatsko obdelavo - 3. del: Pakiranje komponent za površinsko montažo na neprekinjenih trakovih (IEC 60286-3:2022)

General Information

Status
Published
Public Enquiry End Date
28-Feb-2022
Publication Date
09-Jan-2023
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
04-Jan-2023
Due Date
11-Mar-2023
Completion Date
10-Jan-2023

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Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN IEC 60286-3:2023
01-februar-2023
Nadomešča:
SIST EN IEC 60286-3:2019
Pakiranje komponent za avtomatsko obdelavo - 3. del: Pakiranje komponent za
površinsko montažo na neprekinjenih trakovih (IEC 60286-3:2022)

Packaging of components for automatic handling - Part 3: Packaging of surface mount

components on continuous tapes (IEC 60286-3:2022)

Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3:

Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten (IEC 60286-
3:2022)
Emballage de composants pour opérations automatisées - Partie 3: Emballage des
composants pour montage en surface en bandes continues (IEC 60286-3:2022)
Ta slovenski standard je istoveten z: EN IEC 60286-3:2022
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
55.060 Tulci. Vretena Spools. Bobbins
SIST EN IEC 60286-3:2023 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 60286-3:2023
---------------------- Page: 2 ----------------------
SIST EN IEC 60286-3:2023
EUROPEAN STANDARD EN IEC 60286-3
NORME EUROPÉENNE
EUROPÄISCHE NORM December 2022
ICS 31.020; 31.240 Supersedes EN IEC 60286-3:2019
English Version
Packaging of components for automatic handling - Part 3:
Packaging of surface mount components on continuous tapes
(IEC 60286-3:2022)

Emballage de composants pour opérations automatisées - Gurtung und Magazinierung von Bauelementen für

Partie 3: Emballage des composants pour montage en automatische Verarbeitung - Teil 3: Gurtung von

surface en bandes continues oberflächenmontierbaren Bauelementen auf Endlosgurten

(IEC 60286-3:2022) (IEC 60286-3:2022)

This European Standard was approved by CENELEC on 2022-12-20. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the

Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,

Türkiye and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2022 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 60286-3:2022 E
---------------------- Page: 3 ----------------------
SIST EN IEC 60286-3:2023
EN IEC 60286-3:2022 (E)
European foreword

The text of document 40/2972/FDIS, future edition 7 of IEC 60286-3, prepared by IEC/TC 40

"Capacitors and resistors for electronic equipment" was submitted to the IEC-CENELEC parallel vote

and approved by CENELEC as EN IEC 60286-3:2022.
The following dates are fixed:

• latest date by which the document has to be implemented at national (dop) 2023-09-20

level by publication of an identical national standard or by endorsement

• latest date by which the national standards conflicting with the (dow) 2025-12-20

document have to be withdrawn

This document supersedes EN IEC 60286-3:2019 and all of its amendments and corrigenda (if any).

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Any feedback and questions on this document should be directed to the users’ national committee. A

complete listing of these bodies can be found on the CENELEC website.
Endorsement notice

The text of the International Standard IEC 60286-3:2022 was approved by CENELEC as a European

Standard without any modification.

In the official version, for Bibliography, the following notes have to be added for the standard indicated:

IEC 60068-1 NOTE Harmonized as EN 60068-1
IEC 60068-2-45 NOTE Harmonized as EN 60068-2-45
IEC 61340 (series) NOTE Harmonized as EN IEC 61340 (series)
IEC/TR 62258-3 NOTE Harmonized as CLC/TR 62258-3
ISO 11469 NOTE Harmonized as EN ISO 11469
---------------------- Page: 4 ----------------------
SIST EN IEC 60286-3:2023
EN IEC 60286-3:2022 (E)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any amendments)

applies.

NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the

relevant EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available

here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60191-2 - Mechanical standardization of - -
semiconductor devices - Part 2:
Dimensions
IEC 61340-4-5 - Electrostatics - Part 4-5: Standard test EN IEC 61340-4-5 -
methods for specific applications - Methods
for characterizing the electrostatic
protection of footwear and flooring in
combination with a person
IEC 61340-4-6 - Electrostatics - Part 4-6: Standard test EN 61340-4-6 -
methods for specific applications - Wrist
straps
IEC 61340-4-7 - Electrostatics - Part 4-7: Standard test EN 61340-4-7 -
methods for specific applications -
Ionization
IEC 61340-4-9 - Electrostatics - Part 4-9: Standard test EN 61340-4-9 -
methods for specific applications -
Garments
---------------------- Page: 5 ----------------------
SIST EN IEC 60286-3:2023
---------------------- Page: 6 ----------------------
SIST EN IEC 60286-3:2023
IEC 60286-3
Edition 7.0 2022-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Packaging of components for automatic handling –
Part 3: Packaging of surface mount components on continuous tapes
Emballage de composants pour opérations automatisées –
Partie 3: Emballage des composants pour montage en surface en bandes
continues
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.020; 31.240 ISBN 978-2-8322-5899-6

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 7 ----------------------
SIST EN IEC 60286-3:2023
– 2 – IEC 60286-3:2022 © IEC 2022
CONTENTS

FOREWORD ........................................................................................................................... 6

INTRODUCTION ..................................................................................................................... 8

1 Scope .............................................................................................................................. 9

2 Normative references ...................................................................................................... 9

3 Terms, definitions and symbols........................................................................................ 9

3.1 Terms and definitions .............................................................................................. 9

3.2 Symbols ................................................................................................................ 11

4 Structure of the specification ......................................................................................... 13

5 Dimensional requirements for taping .............................................................................. 13

5.1 Component cavity positioning requirements .......................................................... 13

5.1.1 Requirements for type 1a, type 1b, type 2a, type 2b and type 3 ..................... 13

5.1.2 Requirements for type 4 ................................................................................ 13

5.2 Component cavity dimension requirements (type 1a, type 1b, type 2a, type

2b and type 3) ....................................................................................................... 14

5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape

widths: 8 mm and 12 mm) ..................................................................................... 14

5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) ................ 17

5.5 Type 2a – Blister carrier tape, with single round sprocket holes and tape

pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) ................ 19

5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with

1mm tape pitch (tape widths: 4 mm) ...................................................................... 21

5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm)........ 23

5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singled bare die

and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) ............ 26

6 Polarity and orientation requirements of components in the tape ................................... 28

6.1 Requirements for all types .................................................................................... 28

6.2 Specific requirements for type 1a .......................................................................... 29

6.3 Specific requirements for type 4 ............................................................................ 29

7 Carrier tape requirements .............................................................................................. 29

7.1 Taping materials ................................................................................................... 29

7.2 Minimum bending radius (for all types) .................................................................. 29

7.3 Camber ................................................................................................................. 30

8 Cover tape requirements (for type 1a, type 1b, type 2a, type 2b and type 3) .................. 31

9 Component taping and additional tape requirements...................................................... 33

9.1 All types ................................................................................................................ 33

9.2 Specific requirements for type 1b .......................................................................... 33

9.3 Specific tape requirements for type 2b .................................................................. 33

9.4 Specific requirement for type 4 ............................................................................. 34

9.4.1 General ......................................................................................................... 34

9.4.2 Coordinate system ......................................................................................... 34

9.4.3 Component positioning and lateral displacement ........................................... 35

9.5 Specific requirements for tapes containing die products ........................................ 36

9.5.1 General ......................................................................................................... 36

9.5.2 Tape design for tapes containing die products ............................................... 36

9.5.3 Cleanliness .................................................................................................... 36

9.5.4 Die lateral movement (type 1a, type 2a and type 2b) ..................................... 37

---------------------- Page: 8 ----------------------
SIST EN IEC 60286-3:2023
IEC 60286-3:2022 © IEC 2022 – 3 –

10 Reel requirements ......................................................................................................... 37

10.1 Dimensions ........................................................................................................... 37

10.1.1 General ......................................................................................................... 37

10.1.2 Reel dimensions ............................................................................................ 37

10.1.3 Reel hole dimensions .................................................................................... 38

10.1.4 Drive hole dimensions (optional) .................................................................... 39

10.2 Marking ................................................................................................................. 40

11 Tape reeling requirements ............................................................................................. 41

11.1 All types ................................................................................................................ 41

11.2 Specific requirements for type 1a .......................................................................... 41

11.3 Specific requirements for type 4 ............................................................................ 41

11.4 Leader and trailer tape .......................................................................................... 41

11.4.1 General ......................................................................................................... 41

11.4.2 Leader ........................................................................................................... 42

11.4.3 Trailer ............................................................................................................ 42

11.5 Recycling .............................................................................................................. 42

11.6 Missing components ............................................................................................. 42

Annex A (normative) Recommended measuring methods for type 1b ................................... 43

A.1 Measurement method for carrier tape thickness (T and T ) ................................... 43

A.2 Measurement method for cavity (A and B ) ......................................................... 43

0 0

A.3 Measurement method for cavity depth (dimension K ) .......................................... 44

Annex B (informative) Measuring methods of electrostatic potential and charge decay

performance while cover tape is peeled off from carrier tape containing surface mount

devices ................................................................................................................................. 45

B.1 General ................................................................................................................. 45

B.2 Method for measuring electrostatic potential and charge decay performance ........ 46

B.2.1 General ......................................................................................................... 46

B.2.2 Measurement instrument and device .............................................................. 48

B.2.3 Sample (test specimen) ................................................................................. 50

B.2.4 Pre-treatment conditions and measurement environment conditions .............. 50

B.2.5 Measurement conditions ................................................................................ 51

B.2.6 Method for measuring electrostatic potential .................................................. 51

B.2.7 Method for measuring the electrostatic charge decay performance ................ 52

B.3 Items to be described in the test report and items to be specified in the

related standards .................................................................................................. 53

B.3.1 Items to be described in the test report .......................................................... 53

B.3.2 Items specified in related standards ............................................................... 54

Bibliography .......................................................................................................................... 55

Figure 1 – Sectional view of component cavity (type 1b) ....................................................... 11

Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) ............... 14

Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset ................ 15

Figure 4 – Maximum component tilt, rotation and lateral movement ...................................... 15

Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) ........................ 17

0 1 0 1

Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset ................ 18

Figure 7 – Maximum component tilt, rotation and lateral movement ...................................... 18

Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) ...................... 19

---------------------- Page: 9 ----------------------
SIST EN IEC 60286-3:2023
– 4 – IEC 60286-3:2022 © IEC 2022

Figure 9 – Illustration of 2 mm cavity pitch and pocket offset ................................................ 20

Figure 10 – Maximum component tilt, rotation and lateral movement .................................... 20

Figure 11 – Type 2b carrier tape ........................................................................................... 22

Figure 12 – Maximum pocket offset ....................................................................................... 22

Figure 13 – Maximum component tilt, rotation and lateral movement .................................... 22

Figure 14 – Blister carrier tape .............................................................................................. 24

Figure 15 – Elongated sprocket hole skew ............................................................................ 24

Figure 16 – Maximum component tilt, rotation and lateral movement .................................... 24

Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment

pitch) .................................................................................................................................... 26

Figure 18 – Illustration of 2 mm compartment pitch ............................................................... 26

Figure 19 – Maximum component planar rotation and lateral displacement ........................... 27

Figure 20 – Example of polarity and orientation .................................................................... 29

Figure 21 – Bending radius ................................................................................................... 30

Figure 22 – Measuring method and camber .......................................................................... 31

Figure 23 – Dot seals for thin components (as exceptions) ................................................... 32

Figure 24 – Type 4 coordinate system .................................................................................. 35

Figure 25 – Component clearance and positioning method ................................................... 36

Figure 26 – Reel ................................................................................................................... 37

Figure 27 – Reel hole presentation ....................................................................................... 39

Figure 28 – Drive hole layout ................................................................................................ 40

Figure 29 – Tape reeling and label area on the reel .............................................................. 41

Figure 30 – Leader and trailer ............................................................................................... 42

Figure A.1 – Carrier tape thickness measurement points ...................................................... 43

Figure A.2 – Cavity cross-section .......................................................................................... 44

Figure A.3 – Cavity depth dimension ..................................................................................... 44

Figure B.1 – Configuration of measurement method using electrostatic potential

measuring system ................................................................................................................. 46

Figure B.2 – Diagram of measure electrostatic potential when peeling cover tape ................. 47

Figure B.3 – Configuration of electrostatic charge decay measurement method .................... 47

Figure B.4 – Diagram of the measurement of electrostatic charge decay performance .......... 48

Figure B.5 – Dimensions of the sample ................................................................................. 50

Table 1 – Component size codes .......................................................................................... 10

Table 2 – Classification to symbols concerning tape, reel and common symbols ................... 11

Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape ............................ 16

Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape ............................. 16

Table 5 – Component tilt, planar rotation and lateral movement ............................................ 17

Table 6 – Constant dimensions of 8 mm pressed carrier tape ............................................... 18

Table 7 – Variable dimensions of 8 mm pressed carrier tape ................................................ 19

Table 8 – Component tilt, planar rotation and lateral movement ............................................ 19

Table 9 – Constant dimensions of 8 mm to 24 mm blister carrier tape ................................... 20

Table 10 – Variable dimensions of 8 mm to 24 mm blister carrier tape .................................. 21

Table 11 – Component tilt, rotation and lateral movement ..................................................... 21

---------------------- Page: 10 ----------------------
SIST EN IEC 60286-3:2023
IEC 60286-3:2022 © IEC 2022 – 5 –

Table 12 – Constant dimensions of 4 mm carrier tape ........................................................... 23

Table 13 – Variable dimensions of 4 mm carrier tape ............................................................ 23

Table 14 – Component tilt, planar rotation and lateral movements ........................................ 23

Table 15 – Constant dimensions of 32 mm to 200 mm blister carrier tape ............................. 25

Table 16 – Variable dimensions of 32 mm to 200 mm blister carrier tape .............................. 25

Table 17 – Component tilt, planar rotation and lateral movements ........................................ 26

Table 18 – Dimensions of adhesive backed punched carrier tape ......................................... 27

Table 19 – Variable dimensions of adhesive-backed punched carrier tape ............................ 28

Table 20 – Component planar rotation and lateral displacement ........................................... 28

Table 21 – Minimum bending radius ...................................................................................... 30

Table 22 – Peel force ............................................................................................................ 32

Table 23 – Absolute referencing data for component target position ..................................... 34

Table 24 – Reel dimensions .................................................................................................. 38

Table 25 – Reel hole dimensions .......................................................................................... 39

Table 26 – Drive hole dimensions ......................................................................................... 40

Table B.1 – Conditions of the environment in which the samples are kept and the

conditions of the measurement test environment before measurement .................................. 51

---------------------- Page: 11 ----------------------
SIST EN IEC 60286-3:2023
– 6 – IEC 60286-3:2022 © IEC 2022
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 3: Packaging of surface mount components
on continuous tapes
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC Publication(s)"). Their

preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

may participate in this preparatory work. International, governmental and non-governmental organizations liaising

with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence between

any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

IEC 60286-3 has been prepared by IEC technical committee 40: Capacitors and resistors for

electronic equipment. It is an International Standard.

This seventh edition cancels and replaces the sixth edition published in 2019. This edition

constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
a) addition terms and definitions.

b) addition of a table of the classification to symbols concerning drive hole diameter and

distance between the reel hole centre and the drive hole centre;
c) addition of drive hole to the reel (optional);
d) revision of reel hole diameter tolerances;
e) revision of 72 mm tape size carrier tape width dimension tolerances;
---------------------- Page: 12 ----------------------
SIST EN IEC 60286-3:2023
IEC 60286-3:2022 © IEC 2022 – 7 –
f) addition of Annex B (informative);
g) addition of component size 0201M.
The text of this International Standard is based on the following documents:
Draft Report on voting
40/2972/FDIS 40/2984/RVD
Full i
...

SLOVENSKI STANDARD
oSIST prEN IEC 60286-3:2022
01-februar-2022
Pakiranje komponent za avtomatsko obdelavo - 3. del: Pakiranje komponent za
površinsko montažo na neprekinjenih trakovih

Packaging of components for automatic handling - Part 3: Packaging of surface mount

components on continuous tapes

Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 3:

Gurtung von oberflächenmontierbaren Bauelementen auf Endlosgurten
Emballage de composants pour opérations automatisées - Partie 3: Emballage des
composants pour montage en surface en bandes continues
Ta slovenski standard je istoveten z: prEN IEC 60286-3:2021
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
55.060 Tulci. Vretena Spools. Bobbins
oSIST prEN IEC 60286-3:2022 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
oSIST prEN IEC 60286-3:2022
---------------------- Page: 2 ----------------------
oSIST prEN IEC 60286-3:2022
40/2899/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 60286-3 ED7
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2021-12-10 2022-03-04
SUPERSEDES DOCUMENTS:
40/2845/CD, 40/2885/CC
IEC TC 40 : CAPACITORS AND RESISTORS FOR ELECTRONIC EQUIPMENT
SECRETARIAT: SECRETARY:
Netherlands Mr Ronald Drenthen
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if any,
in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY

SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING

Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft for
Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.

This document is still under study and subject to change. It should not be used for reference purposes.

Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of which

they are aware and to provide supporting documentation.
TITLE:

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on

continuous tapes
PROPOSED STABILITY DATE: 2032
NOTE FROM TC/SC OFFICERS:

Copyright © 2021 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this

electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.

You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without

permission in writing from IEC.
---------------------- Page: 3 ----------------------
oSIST prEN IEC 60286-3:2022
CDV IEC 60286-3/Ed7  IEC (E) – 2 – 40/2899/CDV
1 CONTENTS

3 FOREWORD ........................................................................................................................... 6

4 INTRODUCTION ..................................................................................................................... 8

5 1 Scope .............................................................................................................................. 9

6 2 Normative references ...................................................................................................... 9

7 3 Terms and definitions and symbols .................................................................................. 9

8 3.1 Terms and definitions.............................................................................................. 9

9 3.2 Symbols ................................................................................................................ 11

10 4 Structure of the specification ......................................................................................... 12

11 5 Dimensional requirements for taping .............................................................................. 13

12 5.1 Component cavity positioning requirements .......................................................... 13

13 5.1.1 Requirements for type 1a, type 1b, type 2a, type 2b and type 3 ..................... 13

14 5.1.2 Requirements for type 4 ................................................................................ 13

15 5.2 Component cavity dimension requirements (type 1a, type 1b, type 2a, type

16 2b and type 3) ....................................................................................................... 14

17 5.3 Type 1a – Punched carrier tape, with top and bottom cover tape (tape

18 widths: 8 mm and 12 mm) ..................................................................................... 14

19 5.4 Type 1b – Pressed carrier tape, with top cover tape (tape width: 8 mm) ................ 16

20 5.5 Type 2a – Blister carrier tape, with single round sprocket holes and tape

21 pitches down to 2 mm (tape widths: 8 mm, 12 mm, 16 mm and 24 mm) ................ 18

22 5.6 Type 2b – Blister carrier tape, with single round sprocket holes and with

23 1mm tape pitch (tape widths: 4 mm) ...................................................................... 21

24 5.7 Type 3 – Blister carrier tape, with double sprocket holes (32 mm to 200 mm) ....... 22

25 5.8 Type 4 – Adhesive-backed punched plastic carrier tape for singled bare die

26 and other surface mount components (8 mm, 12 mm, 16 mm and 24 mm) ............ 25

27 6 Polarity and orientation requirements of components in the tape ................................... 27

28 6.1 Requirements for all types .................................................................................... 27

29 6.2 Specific requirements for type 1a .......................................................................... 28

30 6.3 Specific requirements for type 4 ............................................................................ 28

31 7 Carrier tape requirements .............................................................................................. 28

32 7.1 Taping materials ................................................................................................... 28

33 7.2 Minimum bending radius (for all types) .................................................................. 28

34 7.3 Camber ................................................................................................................. 29

35 8 Cover tape requirements (for type 1a, type 1b, type 2a, type 2b and type 3) .................. 30

36 9 Component taping and additional tape requirements ..................................................... 32

37 9.1 All types ................................................................................................................ 32

38 9.2 Specific requirements for type 1b .......................................................................... 32

39 9.3 Specific tape requirements for type 2b .................................................................. 32

40 9.4 Specific requirement for type 4 ............................................................................. 33

41 9.4.1 General ......................................................................................................... 33

42 9.4.2 Coordinate system ......................................................................................... 33

43 9.4.3 Component positioning and lateral displacement ........................................... 34

44 9.5 Specific requirements for tapes containing die products ........................................ 35

45 9.5.1 General ......................................................................................................... 35

46 9.5.2 Tape design for tapes containing die products ............................................... 35

47 9.5.3 Cleanliness .................................................................................................... 35

48 9.5.4 Die lateral movement (type 1a, type 2a and type 2b) ..................................... 35

49 10 Reel requirements ......................................................................................................... 36

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50 10.1 Dimensions ........................................................................................................... 36

51 10.1.1 General ......................................................................................................... 36

52 10.1.2 Reel dimensions ............................................................................................ 36

53 10.1.3 Reel hole dimensions .................................................................................... 37

54 10.1.4 Drive hole dimensions (optional) .................................................................... 37

55 10.2 Marking ................................................................................................................. 38

56 11 Tape reeling requirements ............................................................................................. 39

57 11.1 All types ................................................................................................................ 39

58 11.2 Specific requirements for type 1a .......................................................................... 39

59 11.3 Specific requirements for type 4 ............................................................................ 39

60 11.4 Leader and trailer tape .......................................................................................... 39

61 11.4.1 General ......................................................................................................... 39

62 11.4.2 Leader ........................................................................................................... 40

63 11.4.3 Trailer ............................................................................................................ 40

64 11.5 Recycling .............................................................................................................. 40

65 11.6 Missing components ............................................................................................. 40

66 Annex A (normative) Recommended measuring methods for type 1b ................................... 41

67 A.1 Measurement method for carrier tape thickness (T and T ) ................................... 41

68 A.2 Measurement method for cavity (A and B ) ......................................................... 41

0 0

69 A.3 Measurement method for cavity depth (dimension K ) .......................................... 42

70 Annex B (informative) Measuring methods of electrostatic potential and charge decay

71 performance while cover tape is peeled off from carrier tape containing surface

72 mount devices ............................................................................................................... 43

73 B.1 General ................................................................................................................. 43

74 B.2 Method for measuring electrostatic potential and charge decay performance ........ 43

75 B.2.1 General ......................................................................................................... 43

76 B.2.2 Measurement instrument and device.............................................................. 45

77 B.2.3 Sample(test specimen) .................................................................................. 47

78 B.2.4 Pre-treatment conditions and measurement environment conditions .............. 48

79 B.2.5 Measurement conditions ................................................................................ 48

80 B.2.6 Measuring method of electrostatic potential ................................................... 49

81 B.2.7 Measuring method of electrostatic charge decay performance ....................... 49

82 B.3 Items to be described in the test report and items to be specified in the

83 related standards .................................................................................................. 50

84 B.3.1 Items to be described in the test report .......................................................... 50

85 B.3.2 Items specified in related standards ............................................................... 52

86 Bibliography .......................................................................................................................... 53

88 Figure 1 – Sectional view of component cavity (type 1b) ....................................................... 10

89 Figure 2 – 8 mm and 12 mm punched carrier-tape dimensions (4 mm cavity pitch) ............... 14

90 Figure 3 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset ................ 15

91 Figure 4 – Maximum component tilt, rotation and lateral movement ...................................... 15

92 Figure 5 – Dimensions (P = 4 mm/P = 2 mm) and (P = 4 mm/P = 1 mm) ........................ 17

0 1 0 1

93 Figure 6 – Illustration of 2 mm and 1 mm cavity pitch and maximum pocket offset ................ 17

94 Figure 7 – Maximum component tilt, rotation and lateral movement ...................................... 17

95 Figure 8 – Blister carrier tape dimensions (8 mm, 12 mm, 16 mm and 24 mm) ...................... 19

96 Figure 9 – Illustration of 2 mm cavity pitch and pocket offset ................................................ 19

97 Figure 10 – Maximum component tilt, rotation and lateral movement .................................... 19

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98 Figure 11 – Type 2b carrier tape ........................................................................................... 21

99 Figure 12 – Maximum pocket offset....................................................................................... 21

100 Figure 13 – Maximum component tilt, rotation and lateral movement .................................... 21

101 Figure 14 – Blister carrier tape .............................................................................................. 23

102 Figure 15 – Elongated sprocket hole skew ............................................................................ 23

103 Figure 16 – Maximum component tilt, rotation and lateral movement .................................... 23

104 Figure 17 – Adhesive-backed punched carrier-tape dimensions (4 mm compartment

105 pitch) .................................................................................................................................... 25

106 Figure 18 – Illustration of 2 mm compartment pitch ............................................................... 25

107 Figure 19 – Maximum component planar rotation and lateral displacement ........................... 26

108 Figure 20 – Example of polarity and orientation .................................................................... 28

109 Figure 21 – Bending radius ................................................................................................... 29

110 Figure 22 – Measuring method and camber .......................................................................... 30

111 Figure 23 – Dot seals for thin components (as exceptions) ................................................... 31

112 Figure 24 – Type 4 coordinate system .................................................................................. 34

113 Figure 25 – Component clearance and positioning method ................................................... 34

114 Figure 26 – Reel ................................................................................................................... 36

115 Figure 27 – Reel hole presentation ....................................................................................... 37

116 Figure 28 – Drive hole layout ................................................................................................ 38

117 Figure 29 – Tape reeling and label area on the reel .............................................................. 39

118 Figure 30 – Leader and trailer ............................................................................................... 40

119 Figure A.1 – Carrier tape thickness measurement points ...................................................... 41

120 Figure A.2 – Cavity cross-section .......................................................................................... 42

121 Figure A.3 – Cavity depth dimension ..................................................................................... 42

122 Figure B.1 – Configuration of measurement method using electrostatic potential

123 measuring system ................................................................................................................. 44

124 Figure B.2 – Diagram of measure electrostatic potential when peeling cover tape ................. 44

125 Figure B.3 – Configuration of electrostatic charge decay measurement method .................... 45

126 Figure B.4 – Diagram of the measure electrostatic charge decay performance ...................... 45

127 Figure B.5 – Dimensions of the sample ................................................................................. 48

128

129 Table 1 – Component size codes .......................................................................................... 10

130 Table 2 – Classification to symbols concerning tape, reel and common symbols ................... 11

131 Table 3 – Constant dimensions of 8 mm and 12 mm punched carrier tape ............................ 15

132 Table 4 – Variable dimensions of 8 mm and 12 mm punched carrier tape ............................. 16

133 Table 5 – Component tilt, planar rotation and lateral movement ............................................ 16

134 Table 6 – Constant dimensions of 8 mm pressed carrier tape ............................................... 18

135 Table 7 – Variable dimensions of 8 mm pressed carrier tape ................................................ 18

136 Table 8 – Component tilt, planar rotation and lateral movement ............................................ 18

137 Table 9 – Constant dimensions of 8 mm to 24 mm blister carrier tape ................................... 20

138 Table 10 – Variable dimensions of 8 mm to 24 mm blister carrier tape .................................. 20

139 Table 11 – Component tilt, rotation and lateral movement ..................................................... 20

140 Table 12 – Constant dimensions of 4 mm carrier tape ........................................................... 22

141 Table 13 – Variable dimensions of 4 mm carrier tape ............................................................ 22

142 Table 14 – Component tilt, planar rotation and lateral movements ........................................ 22

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143 Table 15 – Constant dimensions of 32 mm to 200 mm blister carrier tape ............................. 24

144 Table 16 – Variable dimensions of 32 mm to 200 mm blister carrier tape .............................. 24

145 Table 17 – Component tilt, planar rotation and lateral movements ........................................ 25

146 Table 18 – Dimensions of adhesive backed punched carrier tape ......................................... 26

147 Table 19 – Variable dimensions of adhesive-backed punched carrier tape ............................ 27

148 Table 20 – Component planar rotation and lateral displacement ........................................... 27

149 Table 21 – Minimum bending radius ...................................................................................... 29

150 Table 22 – Peel force ............................................................................................................ 31

151 Table 23 – Absolute referencing data for component target position ..................................... 33

152 Table 24 – Reel dimensions .................................................................................................. 36

153 Table 25 – Reel hole dimensions .......................................................................................... 37

154 Table 26 – Drive hole dimensions ......................................................................................... 38

155 Table B.1 – Conditions of the environment in which the samples are kept and the

156 conditions of the measurement test environment before measurement .................................. 48

157
158
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159 INTERNATIONAL ELECTROTECHNICAL COMMISSION
160 ____________
161
162 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
163
164 Part 3: Packaging of surface mount components
165 on continuous tapes
166
167 FOREWORD

168 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

169 all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

170 co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

171 in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

172 Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

173 preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

174 may participate in this preparatory work. International, governmental and non-governmental organizations liaising

175 with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

176 Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

177 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

178 consensus of opinion on the relevant subjects since each technical committee has representation from all

179 interested IEC National Committees.

180 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

181 Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

182 Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

183 misinterpretation by any end user.

184 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

185 transparently to the maximum extent possible in their national and regional publications. Any divergence between

186 any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.

187 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

188 assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

189 services carried out by independent certification bodies.

190 6) All users should ensure that they have the latest edition of this publication.

191 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

192 members of its technical committees and IEC National Committees for any personal injury, property damage or

193 other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

194 expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

195 Publications.

196 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

197 indispensable for the correct application of this publication.

198 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

199 rights. IEC shall not be held responsible for identifying any or all such patent rights.

200 IEC 60286-3 has been prepared by IEC technical committee 40: Capacitors and resistors for

201 electronic equipment.

202 This seventh edition cancels and replaces the sixth edition published in 2019. This edition

203 constitutes a technical revision.

204 This edition includes the following significant technical changes with respect to the previous

205 edition:
206 a) addition terms and definitions.

207 b) addition of a table of the classification to symbols concerning drive hole diameter and

208 distance between the reel hole centre and the drive hole centre;
209 c) addition of drive hole to the reel (optional);
210 d) revision of reel hole diameter tolerances;
211 e) revision of 72 mm tape size carrier tape width dimension tolerances;
212 f) addition of Annex B (informative).
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213 g) addition of component sizes 0201M
214 The text of this International Standard is based on the following documents:
Draft Report on voting
40/XX/FDIS 40/XX/RVD
215

216 Full information on the voting for its approval can be found in the report on voting indicated in

217 the above table.

218 The language used for the development of this International Standard is English.

219 This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

220 accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

221 at https://www.iec.ch/members_experts/refdocs. The main document types developed by IEC

222 are described in greater detail at https://www.iec.ch/standardsdev/publications.

223 The committee has decided that the contents of this document will remain unchanged until the

224 stability date indicated on the IEC website under webstore.iec.ch in the data related to the

225 specific document. At this date, the document will be
226 • reconfirmed,
227 • withdrawn,
228 • replaced by a revised edition, or
229 • amended.
230
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231 INTRODUCTION

232 Tape packaging meets the requirements of automatic component placement machines and also

233 covers the use of tape packaging for components and singulated dies for test purposes and

234 other operations.
235
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236 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
237
238 Part 3: Packaging of surface mount components
239 on continuous tapes
240
241
242 1 Scope

243 This part of IEC 60286 is applicable to the tape packaging of electronic components without

244 leads or with lead stumps, intended to be connected to electronic circuits. It includes only those

245 dimensions that are essential for the taping of components intended for the above-mentioned

246 purposes.

247 This document also includes requirements related to the packaging of singulated die products

248 including bare die and bumped die (flip chips).
249 2 Normative references

250 The following documents are referred to in the text in such a way that some or all of their content

251 constitutes requirements of this document. For dated references, only the edition cited applies.

252 For undated references, the latest edition of the referenced document (including any

253 amendments) applies.

254 IEC 60191-2, Mechanical standardization of semiconductor devices – Part 2: Dimensions

255 3 Terms and definitions and symbols
256 3.1 Terms and definitions

257 For the purposes of this document, the following terms and definitions apply. Definitions apply

258 to all tape types, unless specifically mentioned.

259 ISO and IEC maintain terminological databases for use in standardization at the following

260 addresses:
261 • IEC Electropedia: available at https://www.electropedia.org/
262 • ISO Online browsing platform: available at https://www.iso.org/obp
263 3.1.1
264 components

265 electronic part of a product that cannot be physically divided into smaller parts without losing

266 its particular function
267 Note 1 to entry: This includes singulated die product.

268 Note 2 to entry: This is applied to all packaging-types for bare die products unless specifically mentioned otherwise.

269 3.1.2
270 component sizes
271 size of component that are identified with their metric size code
272 Note 1 to entry: This size code is followed by a capital M.

273 Note 2 to entry: To avoid possible confusion with inch-based size codes, an equivalency table is shown in Table 1.

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