SIST EN IEC 60747-17:2021
(Main)Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation (IEC 60747-17:2020)
Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation (IEC 60747-17:2020)
IEC 60747-17:2020(E) specifies the terminology, essential ratings, characteristics, safety test and the measuring methods of magnetic coupler and capacitive coupler.
It specifies the principles and requirements of insulation and isolation characteristics for magnetic and capacitive couplers for basic insulation and reinforced insulation.
This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to IEC PAS 60747-17:2011:
a) introduced lifetime safety factors for improved life time consideration, to comply with widely recognized aging mechanisms of silicone dioxide (TDDB) and thin film polymer isolation layers;
b) significantly improved "end of life testing" paragraph and statistical life time consideration by adding detailed description on process, safety factors, methods of generating data points and respective lifetime interpolations as well as being specific on minimum amount of samples required;
c) introduced concept of certification by similarity, including Annex A, giving guidance on qualification considerations and required certification process;
d) alternative pulse shape allowed for surge pulse testing, to avoid issues due to surge tester availability;
e) various improvements throughout the standard: definitions, for example type of coupler have been improved, introduction of surge impulse VIMP rating, usage of glass transition temperature, pre-conditioning have been redefined for improved usability and better compatibility with today’s design and functionality of couplers, available mold compounds, etc.
Halbleiterbauelemente - Teil 17: Magnetische und kapazitive Koppler für Basisisolierung und verstärkte Isolierung (IEC 60747-17:2020)
Dispositifs à semiconducteurs - Partie 17: Coupleur magnétique et capacitif pour l’isolation principale et renforcée (IEC 60747-17:2020)
L'IEC 60747-17:2020 spécifie la terminologie, les valeurs assignées essentielles, les caractéristiques, l’essai de sécurité et les méthodes de mesure des coupleurs magnétiques et des coupleurs capacitifs.
Elle spécifie les principes et exigences de l’isolation et les caractéristiques d’isolement des coupleurs magnétiques et capacitifs pour l’isolation principale et l’isolation renforcée.
Cette première édition annule et remplace l’IEC PAS 60747-17:2011. Cette édition constitue une révision technique.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’IEC PAS 60747‑17:2011:
a) introduction des facteurs de sécurité de durée de vie pour la prise en considération de la durée de vie améliorée, conformément aux mécanismes de vieillissement du dioxyde de silicium (TDDB) largement reconnus, et couches d’isolement en polymère à couches minces;
b) prise en considération de l’alinéa et de la durée de vie statistique de l’"essai de fin de vie" considérablement améliorée par l’ajout d’une description détaillée du processus, des facteurs de sécurité, des méthodes de génération de points de données et des interpolations de la durée de vie respective, ainsi que par la spécification de la quantité minimale d'échantillons exigés;
c) introduction du concept de certification par similarité, comprenant l’Annexe A, qui donne des recommandations relatives aux considérations de qualification et au processus de certification exigé;
d) forme d'impulsion alternative admise pour l’essai d’impulsion de choc afin d'éviter les problèmes de disponibilité de l’appareil d’essai aux ondes de choc;
e) plusieurs améliorations tout au long de la norme: amélioration des définitions, par exemple des types de coupleurs; introduction de la valeur assignée de l’impulsion de choc VIMP, utilisation d’une température de transition vitreuse, redéfinition du préconditionnement pour une utilisation améliorée et une meilleure compatibilité avec la conception et les fonctionnalités actuelles des coupleurs, les composants moulés disponibles, etc.
Polprevodniški elementi - 17. del: Magnetni in kapacitivni spojnik za osnovno in ojačeno izolacijo (IEC 60747-17:2020)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
01-januar-2021
Polprevodniški elementi - 17. del: Magnetni in kapacitivni spojnik za osnovno in
ojačeno izolacijo (IEC 60747-17:2020)
Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and
reinforced insulation (IEC 60747-17:2020)
Halbleiterbauelemente - Teil 17: Magnetische und kapazitive Koppler für Basisisolierung
und verstärkte Isolierung (IEC 60747-17:2020)
Dispositifs à semiconducteurs - Partie 17: Coupleur magnétique et capacitif pour
l’isolation principale et renforcée (IEC 60747-17:2020)
Ta slovenski standard je istoveten z: EN IEC 60747-17:2020
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 60747-17
NORME EUROPÉENNE
EUROPÄISCHE NORM
November 2020
ICS 31.080.99
English Version
Semiconductor devices - Part 17: Magnetic and capacitive
coupler for basic and reinforced insulation
(IEC 60747-17:2020)
Dispositifs à semiconducteurs - Partie 17: Coupleur Halbleiterbauelemente - Teil 17: Magnetische und
magnétique et capacitif pour l'isolation principale et kapazitive Koppler für Basisisolierung und verstärkte
renforcée Isolierung
(IEC 60747-17:2020) (IEC 60747-17:2020)
This European Standard was approved by CENELEC on 2020-10-26. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60747-17:2020 E
European foreword
The text of document 47E/711/FDIS, future edition 1 of IEC 60747-17, prepared by SC 47E "Discrete
semiconductor devices" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN IEC 60747-17:2020.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-07-26
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2023-10-26
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60747-17:2020 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60060-1:2010 NOTE Harmonized as EN 60060-1:2010 (not modified)
IEC 60068-1:2013 NOTE Harmonized as EN 60068-1:2014 (not modified)
IEC 60068-2-6:2007 NOTE Harmonized as EN 60068-2-6:2008 (not modified)
IEC 60068-2-17:1994 NOTE Harmonized as EN 60068-2-17:1994 (not modified)
IEC 60068-2-27:2008 NOTE Harmonized as EN 60068-2-27:2009 (not modified)
IEC 60270:2000 NOTE Harmonized as EN 60270:2001 (not modified)
IEC 60664-4:2005 NOTE Harmonized as EN 60664-4:2006 (not modified)
IEC 60747-5-5:2007 NOTE Harmonized as EN 60747-5-5:2011 (not modified)
IEC 61000-4-5:2014 NOTE Harmonized as EN 61000-4-5:2014 (not modified)
IEC 61000-4-8:2009 NOTE Harmonized as EN 61000-4-8:2010 (not modified)
IEC 61000-4-9:2016 NOTE Harmonized as EN 61000-4-9:2016 (not modified)
IEC 61649:2008 NOTE Harmonized as EN 61649:2008 (not modified)
IEC 62368-1:2018 NOTE Harmonized as EN IEC 62368-1:2020 (not modified)
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-1 2007 Environmental testing - Part 2-1: Tests - EN 60068-2-1 2007
Test A: Cold
IEC 60068-2-2 2007 Environmental testing - Part 2-2: Tests - EN 60068-2-2 2007
Test B: Dry heat
IEC 60068-2-14 2009 Environmental testing - Part 2-14: Tests - EN 60068-2-14 2009
Test N: Change of temperature
IEC 60068-2-20 2008 Environmental testing - Part 2-20: Tests - EN 60068-2-20 2008
Test T: Test methods for solderability and
resistance to soldering heat of devices
with leads
IEC 60068-2-30 2005 Environmental testing - Part 2-30: Tests - EN 60068-2-30 2005
Test Db: Damp heat, cyclic (12 h + 12 h
cycle)
IEC 60068-2-58 2015 Environmental testing - Part 2-58: Tests - EN 60068-2-58 2015
Test Td: Test methods for solderability,
resistance to dissolution of metallization
and to soldering heat of surface mounting
devices (SMD)
IEC 60068-2-67 1995 Environmental testing - Part 2-67: Tests - EN 60068-2-67 1996
Test Cy: Damp heat, steady state,
accelerated test primarily intended for
components
IEC 60112 2003 Method for the determination of the proof EN 60112 2003
and the comparative tracking indices of
solid insulating materials
IEC 60216-1 2013 Electrical insulating materials - Thermal EN 60216-1 2013
endurance properties - Part 1: Ageing
procedures and evaluation of test results
Publication Year Title EN/HD Year
IEC 60216-2 2005 Electrical insulating materials - Thermal EN 60216-2 2005
endurance properties - Part 2:
Determination of thermal endurance
properties of electrical insulating
materials - Choice of test criteria
IEC 60664-1 2007 Insulation coordination for equipment EN 60664-1 2007
within low-voltage systems - Part 1:
Principles, requirements and tests
IEC 60672-2 1999 Ceramic and glass insulating materials - EN 60672-2 2000
Part 2: Methods of test
IEC 60695-11-5 2016 Fire hazard testing - Part 11-5: Test EN 60695-11-5 2017
flames - Needle-flame test method -
Apparatus, confirmatory test arrangement
and guidance
IEC 62539 2007 Guide for the statistical analysis of - -
electrical insulation breakdown data
IEC 60747-17 ®
Edition 1.0 2020-09
INTERNATIONAL
STANDARD
Semiconductor devices –
Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-8801-6
– 2 – IEC 60747-17:2020 © IEC 2020
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Electrical characteristics – Coupler logic and timing definitions . 19
5 Coupler for protection against electrical shock . 20
5.1 General . 20
5.2 Type . 20
5.3 Ratings . 20
5.3.1 General . 20
5.3.2 Safety limiting values . 20
5.3.3 Functional ratings . 20
5.3.4 Rated isolation voltages. 20
5.4 Electrical safety requirements . 20
5.5 Electrical, environmental and/or endurance test information . 21
5.5.1 General . 21
5.5.2 Routine test . 23
5.5.3 Sample test . 23
5.5.4 Maximum surge isolation voltage . 23
5.5.5 Type test . 24
6 Measuring methods for couplers . 35
6.1 General . 35
6.2 Isolation capacitance (C ) . 35
lO
6.2.1 Purpose . 35
6.2.2 Circuit diagram . 35
6.2.3 Measurement procedure . 36
6.2.4 Precautions to be observed . 36
6.2.5 Special conditions . 36
6.3 Isolation resistance between input and output, R . 36
lO
6.3.1 Purpose . 36
6.3.2 Circuit diagram . 36
6.3.3 Precautions to be observed . 37
6.3.4 Measurement procedure . 37
6.3.5 Special conditions . 37
6.4 Isolation test . 37
6.4.1 Purpose . 37
6.4.2 Circuit diagram . 37
6.4.3 Test procedure . 38
6.4.4 Requirements . 38
6.5 Partial discharges of coupler . 39
6.5.1 Purpose . 39
6.5.2 Circuit diagram . 39
6.5.3 Description of Figure 9 test circuit and requirements . 39
6.5.4 Test procedure . 40
6.5.5 Description of calibration circuit (see Figure 10) . 40
IEC 60747-17:2020 © IEC 2020 – 3 –
6.5.6 Test methods . 41
6.5.7 Specified conditions . 41
6.5.8 Test voltage conditions . 42
6.6 Switching times of couplers . 42
6.6.1 Purpose . 42
6.6.2 Circuit diagram . 42
6.6.3 Measurement procedure . 43
6.6.4 Specified conditions . 44
6.7 Measuring methods of common-mode transient immunity (CMTI) for
magnetic and capacitive couplers . 44
6.7.1 Purpose . 44
6.7.2 Circuit diagram . 44
6.7.3 Precautions to be observed . 45
6.7.4 Static CMTI measuring procedure . 46
6.7.5 Specified conditions . 47
6.7.6 Dynamic CMTI measuring procedure . 47
Annex A (informative) Qualification guidance . 48
Bibliography . 51
Figure 1 – Time intervals for methods a and b of the test voltage . 15
Figure 2 –1,2/50 µs surge pulse according 61000-4-5:2014 allowed as equivalent
impulse for isolation testing . 24
Figure 3 – Determination of time to failure (referring to method in 5.5.5.8) . 31
Figure 4 – Determination of working voltage (referring to method in 5.5.5.8 for
exponential model) . 32
Figure 5 – Determination of working voltage (referring to method in 5.5.5.8 for non-
linear model) . 33
Figure 6 – Isolation capacitance measurement circuit . 36
Figure 7 – Isolation resistance measurement circuit . 37
Figure 8 – Isolation voltage measurement circuit . 38
Figure 9 – Partial discharge test circuit . 39
Figure 10 – Connections for the calibration of the complete test arrangement . 40
Figure 11 – Switching time test circuit . 43
Figure 12 – Transition time waveform measurement . 43
Figure 13 – Propagation delay time waveform measurement . 44
Figure 14 – Static versus dynamic data source signal VI . 45
Figure 15 – Common-mode transient immunity (CMTI) test setup for both static and
dynamic testing . 45
Figure 16 – Static common-mode transient immunity (CMTI) and V and low to high
CM
data transition waveform . 47
Figure A.1 – Lifetime verification . 49
Table 1 – Overview on characteristics and symbols . 19
Table 2 – Datasheet characteristics . 21
Table 3 – Tests and test sequence for coupler providing basic insulation and reinforced
insulation for protection against electrical shock . 22
Table 4 – Test conditions . 23
– 4 – IEC 60747-17:2020 © IEC 2020
Table 5 – Safety factor F. 41
Table 6 – Specified conditions for method a and method b. 42
Table A.1 – Front end process changes within component . 49
Table A.2 – Front End Process Changes within SiO/SiN/imide-passivation . 50
Table A.3 – Layout changes . 50
Table A.4 – Backend changes . 50
IEC 60747-17:2020 © IEC 2020 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 17: Magnetic and capacitive coupler
for basic and reinforced insulation
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-17 has been prepared by subcommittee SC 47E: Discrete
semiconductor devices, of IEC technical committee TC 47: Semiconductor devices.
This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a
technical revision.
This edition includes the following significant technical changes with respect to
IEC PAS 60747-17:2011:
a) introduced lifetime safety factors for improved life time consideration, to comply with
widely recognized aging mechanisms of silicone dioxide (TDDB) and thin film polymer
isolation layers;
b) significantly improved "end of life testing" paragraph and statistical life time consideration
by adding detailed description on process, safety factors, methods of generating data
points and respective lifetime interpolations as well as being specific on minimum amount
of samples required;
– 6 – IEC 60747-17:2020 © IEC 2020
c) introduced concept of certification by similarity, including Annex A, giving guidance on
qualification considerations and required certification process;
d) alternative pulse shape allowed for surge pulse testing, to avoid issues due to surge tester
availability;
e) various improvements throughout the standard: definitions, for example type of coupler
have been improved, introduction of surge impulse V rating, usage of glass transition
IMP
temperature, pre-conditioning have been redefined for improved usability and better
compatibility with today’s design and functionality of couplers, available mold compounds,
etc.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47E/711/FDIS 47E/715/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60747 series, published under the general title Semiconductor
devices, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IEC 60747-17:2020 © IEC 2020 – 7 –
SEMICONDUCTOR DEVICES –
Part 17: Magnetic and capacitive coupler
for basic and reinforced insulation
1 Scope
This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety test
and the measuring methods of magnetic coupler and capacitive coupler.
It specifies the principles and requirements of insulation and isolation characteristics for
magnetic and capacitive couplers for basic insulation and reinforced insulation.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-2-1:2007, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2:2007, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-14:2009, Environmental testing – Part 2-14: Tests – Test N: Change of
temperature
IEC 60068-2-20:2008, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60068-2-30:2005, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
IEC 60068-2-58:2015, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-67:1995, Environmental testing – Part 2: Tests – Test Cy: Damp heat, steady
state, accelerated test primarily intended for components
IEC 60112:2003, Method for the determination of the proof and the comparative tracking
indices of solid insulating materials
IEC 60216-1:2013, Electrical insulating materials – Thermal endurance properties – Part 1:
Ageing procedures and evaluation of test results
IEC 60216-2:2005, Electrical insulating materials – Thermal endurance properties – Part 2:
Determination of thermal endurance properties of electrical insulating materials – Choice of
test criteria
IEC 60664-1:2007, Insulation coordination for equipment within low-voltage systems – Part 1:
Principles, requirements and tests
– 8 – IEC 60747-17:2020 © IEC 2020
IEC 60672-2:1999, Ceramic and glass insulating materials – Part 2: Methods of test
IEC 60695-11-5:2016, Fire hazard testing – Part 11-5: Test flames – Needle-flame test
method – Apparatus, confirmatory test arrangement and guidance
IEC 62539:2007, Guide for the statistical analysis of electrical insulation breakdown data
3 Terms and definitions
3.1
details of outline and encapsulation
information related method of encapsulation and terminal connections within the coupler's
isolation system
3.1.1
outline drawing
drawing or sketch restricted to line to describe the shape of objects or circuitry
3.1.2
method of encapsulation
encapsulating materials used forming part of the isolation system
3.1.3
terminal identification
terminal identification and indication of any connection between a terminal and the case
3.2
type of coupler
internal construction and insulation method of coupler to achieve basic or reinforced
insulation
3.2.1
SiO isolator
isolator with an internal insulation construction utilizing silicon dioxide based material
3.2.2
thin film polymer isolator
isolator with an internal insulation construction, utilising a thin film polymer insulation
3.3
isolation
ability to reject electrical and magnetic interference or noise
3.4
insulation
part of an electromechanical product which galvanically separates the conducting parts at
different electrical potentials
3.4.1
reinforced insulation
insulation of hazardous-live-parts which provides a degree of protection against electric shock
equivalent to double insulation
Note 1 to entry: Reinforced insulation may comprise several layers which cannot be tested singly as basic
insulation or supplementary insulation.
[SOURCE: IEC 60664-1:2007, 3.17.5]
IEC 60747-17:2020 © IEC 2020 – 9 –
3.4.2
basic insulation
insulation providing a basic safeguard against electric shock
3.5
isolation side
all terminals of side 1 which are isolated from all terminals of side 2 by an isolation barrier,
forming a two-terminal device
3.6
isolation capacitance
C
IO
total capacitance between the terminals on side 1 of the isolation barrier connected together
and the terminals on side 2 of the isolation barrier connected together forming a two-terminal
device
Note 1 to entry: See IEC 60747-5-5:2007, 4.3.
3.7
isolation resistance
R
IO
resistance between the terminals on side 1 of the isolation barrier connected together and all
the terminals on side 2 of the isolation barrier connected together forming a two-terminal
device
3.8
isolation resistance at safety limiting temperature
R
IO_S
resistance at safety limiting temperature T between the terminals on side 1 of the isolation
S
barrier connected together and all the terminals on side 2 of the isolation barrier connected
together forming a two-terminal device which should be larger or equal to 1E9 Ω
3.9
isolation voltage
voltage between any specified terminals connected together on side 1 of the isolation barrier
and any terminals connected together on side 2 of the isolation barrier
3.10
logic state match
condition in which an output logic state matches the associated input logic state
3.11
logic state transition match
condition in which an output logic state change follows the associated input logic state change
3.12
common mode transient immunity
CMTI
maximum tolerable rate-of-rise (or fall) of a common-mode voltage
Note 1 to entry: The common mode transient immunity is given in volts per second. CMTl should include the
amplitude of the common-mode voltage that can be tolerated.
3.12.1
common mode transient immunity at logic high output
|CM |
H
common mode transient immunity of the coupler with logic at high output
– 10 – IEC 60747-17:2020 © IEC 2020
3.12.2
common mode transient immunity at logic low output
|CM |
L
common mode transient immunity of the coupler with logic at low output
3.12.3
common mode transient immunity at logic dynamic output
|CM |
D
maximum slew rate of a common-mode voltage (V ) at which the coupler transmits the data
CM
without missing the transition or creating unexpected transitions for all combinations of slew
rate polarity and data edges
Note 1 to entry: The data transition shall occur in the specified time frame, and invalid data in terms of delay
times, transitions or number of transitions, or magnitude (not meeting minimum logic V or maximum logic low
OH
V specifications) will be construed as a failure.
OL
3.12.4
CMTI performance
dV /dt
CM
maximum slew rate of a common mode voltage at which the output of the coupler remains at
the specific logic level and at the specified timing
3.12.5
common mode voltage
V
CM
common mode voltage at which the slew rate is measured
3.13
propagation delay
t t
pLH , pHL
time required for a change in the input state of a digital coupler to propagate to the
corresponding output
Note 1 to entry: The propagation delay from LOW to HIGH is expressed by t .
pLH
Note 2 to entry: The propagation delay from HIGH to LOW is expressed by t .
pHL
3.14
pulse width distortion
|t – t |
pLH pHL
PWD
unintentional and generally undesired change in the form of a signal causing the signal input
pulse width to differ from signal output pulse width
3.15
supply voltage
V
DD
supply voltages supplied on input and output side of coupler
Note 1 to entry: The supply voltage is also commonly expressed by V
CC.
3.16
integrated circuit
IC
microcircuit in which all or some of the circuit elements are inseparably associated and
electrically interconnected so that it is considered to be indivisible for the purpose of
construction and commerce on side 1 and side 2
IEC 60747-17:2020 © IEC 2020 – 11 –
[SOURCE: IEC 60050-521:2002, 521-10-03, modified – The words "on side 1 and side 2"
have been added.]
3.17
input and output terminal
I/O
side 1 and side 2 terminals of an integrated circuit providing signal conditioning to the internal
coupling element
3.18
ground potential
GND
reference potential for any side of a coupler
3.19
input voltage
V
I
input voltage, either V , V or analog level
IL IH
3.20
output voltage
V
O
output voltage, either V , V or analog level
OL OH
3.21
maximum ambient operating temperature
T
op max
maximum ambient operating temperature allowed during operation of coupler
3.22
reference-point temperature
T
REF
temperature defined by the manufacturer to refer to a defined point such as junction
temperature, case temperature, etc.
3.23
characteristic lifetime
t63
refers to characteristic lifetime (t63 %) when applying Weibull distribution to determine the
mean lifetime
Note 1 to entry: In general, lifetime reliability is defined as the mean lifetime (t50 %) at which cumulative failure
rate reaches 50 %. When Weibull distribution is used, a characteristic lifetime (t63 %) is considered for the mean
lifetime. This is referred to as t63 in the statistical lifetime consideration.
3.24
general safety ratings of couplers for basic and reinforced insulation
thermal and mechanical operating conditions that exceed the specified ratings (limiting
values) for normal operation, and to which the specified safety requirements refer
Note 1 to entry: The couplers may become permanently inoperative when safety ratings are applied.
3.25
electrical safety ratings of couplers for basic and reinforced insulation
electrical requirements that have to be met and maintained after the couplers have been
subjected to specified safety ratings, to ensure protection against electrical shock
Note 1 to entry: The couplers may become permanently inoperative when safety ratings are applied.
– 12 – IEC 60747-17:2020 © IEC 2020
[SOURCE: IEC 60747-5-5:2007, 5.2, modified – In the term, the word "requirements" has
been replaced with "ratings", and "isolation" with insulation. In the definition, the word
"photocoupler" has been replaced by "couplers".]
3.25.1
partial discharge
PD
localized electrical discharge which occurs in the insulation between all terminals of the side 1
and all terminals of side 2 of the coupler
3.25.2
apparent charge
q
pd
electrical discharge caused by a partial discharge in the coupler
3.25.3
threshold apparent charge
q
pd(TH)
specified value of apparent charge that is as small as technically feasible, which determines
the partial-discharge extinction voltage.
Note 1 to entry: A threshold apparent charge of 5 pC was found to be a practicable criterion for couplers.
Otherwise, it should be defined on each individual device design. Smaller threshold values are desirable but not
required if accurate measurement in a production environment is not practical. This threshold shall not be
exceeded at any time.
Note 2 to entry: In actual testing, this criterion applies to the apparent charge pulse with the maximum value.
Note 3 to entry: The term "specified discharge magnitude" (see 6.1.3.5.4.1 of IEC 60664-1:2007) is synonymous
with "threshold apparent charge".
3.26
test voltage
V
pd(t)
voltage applied during the test period of the partial discharge test between all terminals of
side 1 (connected together) and all terminals of side 2 (connected together) to the coupler
under test
3.26.1
initial test voltage for partial discharge
V
pd(ini)
test voltage applied during the initial test time t
ini
3.26.2
initial test voltage for partial discharge, method a
V
pd(ini),a
value of the voltage applied at the beginning of the measurement, for a specified time t ,
ini
which is intended to simulate the occurrence of a transient overvoltage
Note 1 to entry: Refer to Figure 1, method a.
3.26.3
initial test voltage for partial discharge, method b
V
pd(ini),b
isolation test voltage applied between all terminals of side 1 (connected together) and all
terminals of side 2 (connected together) at routine test (method b) which is equal or higher to
the manufacturer's maximum transient voltage rating
IEC 60747-17:2020 © IEC 2020 – 13 –
3.27
multiplying factor
F
multiplying factor applied for method a and method b
Note 1 to entry: See Table 5 for more information.
3.28
apparent charge measuring voltage
V
pd(m)
test voltage at which apparent charge is measured
Note 1 to entry: Specified values of this voltage may be expressed as multiple of the specified value of the rated
repetitive peak isolation voltage: V = F × V . Refer to 3.27.
pd(m) IORM
Note 2 to entry: This is a test voltage where the apparent charge shall be equal or less than the specified value.
3.29
partial-discharge inception voltage
V
pd(I)
lowest peak value of an AC test voltage at which the apparent charge is greater than the
specified threshold apparent charge, if the test voltage is increased from a lower value where
no partial discharge occurs
3.30
partial-discharge extinction voltage
V
pd(e)
lowest peak value of an AC test voltage at which the apparent charge is smaller than the
specified threshold apparent charge, if the test voltage is reduced from a higher value where
such discharge occurs
Note 1 to entry: The equivalent RMS value of an AC test voltage may also be used.
3.31
reference voltage for lifetime determination
V
REF
maximum predicated voltage which is determined by the end of life (EOL) test according
5.5.5.8
3.32
lifetime safety factor
lifetime safety factor applied to V to reflect safety consideration on coupler lifetime
REF
3.33
time intervals
duration and sequence of test voltages for partial discharge measurements as shown in
Figure 1
– 14 – IEC 60747-17:2020 © IEC 2020
Time intervals for method a
Time intervals for method b1
IEC 60747-17:2020 © IEC 2020 – 15 –
Time intervals for method b2
Key
t initial time method a only
ini
t isolation test time method b
ini,b
t (partial-discharge) stress time
st
t (partial-discharge) stress time
st2
t isolation test stress time (method b only)
st1
t (partial-discharge) measuring time
m
t , t , t , t settling times
1 2 3 4
Figure 1 – Time intervals for methods a and b of the test voltage
3.34
lifetime
minimum required time in years to failure based on an insulation grade correlated failure rate
3.35
SiO time dependent dielectric breakdown
SiO TDDB
aging effect observed in isolators using internal constructions utilizing SiO based materials
3.36
thin film polymer space charge degradation
aging effect observed in isolators using internal insulation constructions utilizing thin film
polymer dielectric materials
Note 1 to entry: This constitutes test requirements to establish the maximum safe operating voltage at which
space charge aging does not impact the safety related values V and V .
IORM IOTM
3.37
failure rate over lifetime
FROL
maximum allowed failure rate due to isolation break down using lifetime prediction
3.38
statistical model
mathematical model that embodies a set of statistical assumptions concerning the generation
of sample data
– 16 – IEC 60747-17:2020 © IEC 2020
Note 1 to entry: The type of curve fit shall be based on the material type as defined in 3.2.1 and 3.2.2.
Note 2 to entry: In cases where the insulation material type is not compatible or defined with models in 3.38.1 and
3.38.2, such isolators may only be used in case the specific distinctiveness of such insulation material has been
considered and properly addressed by the regulatory experts and has been added as into the standard.
3.38.1
exponential model
modelling method used for material types defined in 3.2.1 (SiO isolators):
kV
L= ce
where
L is the time-to-failure at test voltage V;
V is the test voltage;
c and k are the coefficients
Note 1 to entry: For the usage of k × V dependency, an adequate data set with sufficient measurement points
shall be provided which clearly proves the k × V dependency according to IEC 62539:2007.
3.38.2
non linear model
modelling method used for material types defined in 3.2.2 (thin film polymer isolators):
−n
kV
= L ce
where
L is the time-to-failure at test voltage V;
V is the test voltage;
c, n and k are the coefficients
-n
Note 1 to entry: For the usage of k × V dependency, an adequate data set with sufficient measurement points
-n
shall be provided which clearly proves the k × V dependency according to IEC 62539:2007.
3.38.3
rated isolation voltages
3.38.3.1
DC isolation voltage
V
IO
value of the constant isolation voltage
3.38.3.2
maximum rated isolation working voltage
V
IOWM
RMS value of isolation voltage V assigned by the manufacturer of the couplers,
IORM
characterizing the specified (long term) withstand capability of its isolation
3.38.3.3
maximum rated repetitive peak isolation voltage
V
IORM
repetitive peak isolation voltage assigned by the manufacturer of the couplers, characterizing
the specified withstand capability of its isolation against repetitive peak voltages
Note 1 to entry: This peak isolation voltage includes all repetitive transient voltages, but excludes all non-
repetitive transient voltages.
IEC 60747-17:2020
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