Space product assurance - Qualification and Procurement of printed circuit boards

This standard addresses the qualification and procurement of printed circuit boards, which are necessary for all type of space projects.

Raumfahrtproduktsicherung - Qualifizierung und Beschaffung von Leiterplatten

Assurance produit des projets spatiaux - Qualification et approvisionnement des circuits imprimés

Zagotavljanje kakovosti proizvodov v vesoljski tehniki - Kvalifikacija in nabava plošč tiskanih vezij

Ta standard obravnava kvalifikacijo in nabavo plošč tiskanih vezij, ki so potrebna za vse vrste vesoljskih projektov.

General Information

Status
Published
Public Enquiry End Date
20-Dec-2017
Publication Date
08-Aug-2019
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
24-Jul-2019
Due Date
28-Sep-2019
Completion Date
09-Aug-2019

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SLOVENSKI STANDARD
SIST EN 16602-70-60:2019
01-september-2019
Nadomešča:
SIST EN 16602-70-10:2015
SIST EN 16602-70-11:2015
Zagotavljanje kakovosti proizvodov v vesoljski tehniki - Kvalifikacija in nabava
plošč tiskanih vezij

Space product assurance - Qualification and Procurement of printed circuit boards

Raumfahrtproduktsicherung - Qualifizierung und Beschaffung von Leiterplatten

Assurance produit des projets spatiaux - Qualification et approvisionnement des circuits

imprimés
Ta slovenski standard je istoveten z: EN 16602-70-60:2019
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
49.140 Vesoljski sistemi in operacije Space systems and
operations
SIST EN 16602-70-60:2019 en,fr,de

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 16602-70-60:2019
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SIST EN 16602-70-60:2019
EUROPEAN STANDARD
EN 16602-70-60
NORME EUROPÉENNE
EUROPÄISCHE NORM
July 2019
ICS 31.180; 49.140
Supersedes EN 16602-70-10:2015, EN 16602-70-
11:2015
English version
Space product assurance - Qualification and Procurement
of printed circuit boards

Assurance produit des projets spatiaux - Qualification Raumfahrtproduktsicherung - Qualifizierung und

et approvisionnement des circuits imprimés Beschaffung von Leiterplatten
This European Standard was approved by CEN on 9 November 2018.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for

giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical

references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to

any CEN and CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by

translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC

Management Centre has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,

Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,

Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania,

Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.

CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels

© 2019 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. EN 16602-70-60:2019 E

reserved worldwide for CEN national Members and for
CENELEC Members.
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EN 16602-70-60:2019 (E)
Table of contents

European Foreword ................................................................................................. 13

Introduction .............................................................................................................. 14

1 Scope ..................................................................................................................... 15

2 Normative references ........................................................................................... 16

3 Terms, definitions and abbreviated terms .......................................................... 18

3.1 Terms from other standards .................................................................................... 18

3.2 Terms specific to the present standard ................................................................... 19

3.3 Abbreviated terms................................................................................................... 27

3.4 Nomenclature ......................................................................................................... 29

4 Principles .............................................................................................................. 30

4.1 General ................................................................................................................... 30

4.2 Roles ...................................................................................................................... 30

4.3 References to acceptance criteria ........................................................................... 30

5 QA for qualification .............................................................................................. 31

5.1 Qualified PCBs ....................................................................................................... 31

5.2 Ceramic PCB technology ........................................................................................ 32

5.3 Flexible PCB ........................................................................................................... 32

5.3.1 General ..................................................................................................... 32

5.3.2 Qualification of flexible PCB ...................................................................... 32

5.4 Qualification process .............................................................................................. 34

5.5 Request for qualification ......................................................................................... 34

5.6 Quality standards .................................................................................................... 35

5.7 Description of qualification vehicle .......................................................................... 35

5.8 Evaluation ............................................................................................................... 36

5.9 Audit ....................................................................................................................... 36

5.10 Qualification test programme .................................................................................. 38

5.11 PID ......................................................................................................................... 38

5.12 Qualification approval ............................................................................................. 39

5.13 Process change ...................................................................................................... 39

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5.14 QA report ................................................................................................................ 40

5.15 Qualification renewal .............................................................................................. 40

5.16 Nonconformances during qualification renewal ....................................................... 41

6 QA for manufacture and procurement ................................................................ 43

6.1 Overview ................................................................................................................ 43

6.2 Procurement process .............................................................................................. 43

6.2.1 Overview ................................................................................................... 43

6.2.2 Procurement specification ......................................................................... 44

6.2.3 Quotation .................................................................................................. 44

6.2.4 Purchase order ......................................................................................... 45

6.2.5 Design review (DR) ................................................................................... 45

6.2.6 MRR ......................................................................................................... 45

6.3 Final and in-process inspection............................................................................... 46

6.4 Quality records for manufacture and procurement .................................................. 47

6.5 Control of materials and chemistry .......................................................................... 48

6.6 Control of plating chemistry .................................................................................... 49

6.7 Cleanliness of PCB processes ................................................................................ 50

6.7.1 Overview ................................................................................................... 50

6.7.2 Cleanliness control .................................................................................... 51

6.8 Traceability ............................................................................................................. 52

6.9 Operator and inspector training............................................................................... 53

6.10 Repair of bare PCBs ............................................................................................... 54

6.10.1 Overview ................................................................................................... 54

6.10.2 General ..................................................................................................... 54

6.11 Packaging ............................................................................................................... 56

6.12 Storage and baking of PCB and coupons ............................................................... 57

6.13 Shelf-life and relife testing ....................................................................................... 57

6.14 QA for PCB procurement in space projects............................................................. 58

7 Test and inspection for qualification .................................................................. 61

7.1 Overview ................................................................................................................ 61

7.2 Test selection for qualification activities .................................................................. 64

7.3 Initial qualification of PCB manufacturer ................................................................. 68

7.4 Initial qualification of PCB technology ..................................................................... 68

7.5 Qualification renewal .............................................................................................. 68

7.6 Delta qualification ................................................................................................... 68

7.7 Project qualification and RFA .................................................................................. 69

7.7.1 Overview ................................................................................................... 69

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7.7.2 Requirements for project qualification and RFA ........................................ 69

8 Test and inspection for procurement ................................................................. 74

8.1 Outgoing inspection on PCB ................................................................................... 74

8.2 Outgoing inspection on coupons ............................................................................. 75

8.2.1 Overview ................................................................................................... 75

8.2.2 Configuration of coupons for plated holes ................................................. 78

8.2.3 Configuration of dedicated coupons .......................................................... 81

8.2.4 Evaluation of coupons ............................................................................... 82

8.2.5 Delivery of coupons, microsections and spare coupons ............................ 84

8.3 Reporting of outgoing inspection and delivery ......................................................... 85

8.4 Incoming inspection by procurement authority ........................................................ 85

8.5 FAI on PCB by microsectioning .............................................................................. 86

9 Test descriptions .................................................................................................. 88

9.1 Overview ................................................................................................................ 88

9.2 Additional tests ....................................................................................................... 88

9.2.1 Cleanliness ............................................................................................... 88

9.2.2 Bake-out ................................................................................................... 88

9.2.3 Plated copper tensile strength and elongation ........................................... 89

9.2.4 Steam ageing ............................................................................................ 89

9.3 Group 1 – Visual inspection and non-destructive tests ............................................ 90

9.3.1 Visual inspection - general ........................................................................ 90

9.3.2 Visual inspection for qualitative aspects .................................................... 90

9.3.3 Visual inspection for dimensional verification ............................................ 90

9.3.4 Impedance test ......................................................................................... 94

9.3.5 Dielectric constant and loss tangent .......................................................... 94

9.3.6 Cleanliness ............................................................................................... 94

9.3.7 High resistance electrical test .................................................................... 95

9.3.8 Continuity test ........................................................................................... 97

9.4 Group 2 - Miscellaneous tests ................................................................................ 99

9.4.1 Overview ................................................................................................... 99

9.4.2 Peel strength ........................................................................................... 100

9.4.3 Flexural fatigue ....................................................................................... 101

9.4.4 Bending test ............................................................................................ 102

9.4.5 Coating adhesion – tape test ................................................................... 103

9.4.6 Analysis of tin-lead coating ...................................................................... 104

9.4.7 Outgassing .............................................................................................. 104

9.4.8 Thermal analysis ..................................................................................... 105

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9.4.9 Flammability ............................................................................................ 105

9.4.10 Offgassing ............................................................................................... 106

9.4.11 Solderability ............................................................................................ 106

9.5 Group 3 – Thermal stress and as-received ........................................................... 110

9.5.1 Overview ................................................................................................. 110

9.5.2 Microsectioning ....................................................................................... 110

9.5.3 Solder bath float ...................................................................................... 115

9.5.4 Rework simulation ................................................................................... 115

9.5.5 Interconnect stress test (IST) .................................................................. 117

9.6 Group 4 – Assembly and life test - extended......................................................... 124

9.6.1 Overview ................................................................................................. 124

9.6.2 Test flow for group 4 ............................................................................... 124

9.6.3 Insulation resistance ............................................................................... 126

9.6.4 Dielectric withstanding voltage (DWV) ..................................................... 127

9.7 Group 5 – ECM tests ............................................................................................ 128

9.7.1 Overview ................................................................................................. 128

9.7.2 Temperature, Humidity, Bias (THB) ........................................................ 128

9.7.3 Conductive Anodic Filament (CAF) ......................................................... 134

9.8 Group 6 – Assembly and life test - short ............................................................... 140

9.8.1 Overview ................................................................................................. 140

9.8.2 Test flow for group 6 ............................................................................... 140

9.8.3 Reflow simulation .................................................................................... 141

9.8.4 Thermal cycling ....................................................................................... 141

10 Acceptance criteria .......................................................................................... 143

10.1 Overview .............................................................................................................. 143

10.2 Inspection by microsectioning for dimensional verification .................................... 143

10.3 Inspection by microsectioning for qualitative aspects ............................................ 164

10.4 Visual inspection ................................................................................................... 194

10.5 Visual inspection of sculptured flex PCB ............................................................... 210

10.6 Additional requirement to the tables ...................................................................... 229

10.6.1 Annular ring............................................................................................. 229

10.6.2 Pad lift and associated laminate cracks ................................................... 230

10.6.3 Miscellaneous ......................................................................................... 232

Annex A (normative) Qualification letter – DRD ................................................. 235

Annex B (normative) CoC for PCB – DRD ........................................................... 236

Annex C (normative) Qualification test report – DRD ........................................ 250

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Annex D (normative) Process Identification Document (PID) for PCB

manufacturing – DRD ........................................................................................ 251

Annex E (normative) Process change notice (PCN) – DRD ............................... 254

Annex F (normative) QA report – DRD ................................................................ 255

Annex G (normative) PCB approval sheet – DRD ............................................... 256

Annex H (informative) Example of plated­through hole microsection ............. 261

Annex I (informative) Cleanliness requirements for laminate and prepreg ...... 262

Annex J (informative) Example qualification programme .................................. 265

Bibliography ........................................................................................................... 268

Figures

Figure 3-1: Example of material supplier treatment side of foil (white arrows) and PCB

manufacturer treatment side of foil (opposite side) ............................................. 25

Figure 7-1: Test flow for qualification .................................................................................... 62

Figure 8-1: Flow for preparation, test and inspection of procurement coupons ..................... 78

Figure 8-2: Example of Bn coupon with 3 holes per drilling sequence .................................. 79

Figure 8-3: Example of placement of coupons and PCB in usable area of

manufacturing panel ........................................................................................... 80

Figure 8-4: Example of vias manufactured at different plating and drilling sequences .......... 81

Figure 8-5: Example of target quality of microsection of rigid-flex interface with UV

fluorescent resin and polarised light ................................................................... 84

Figure 9-1: Conductor width (w) measured at the foot as seen in a cross-section. ............... 91

Figure 9-2: Warp .................................................................................................................. 92

Figure 9-3: Twist................................................................................................................... 93

Figure 9-4: Horizontal adjacency on layer Ln and vertical adjacency on the layers

above and below. ............................................................................................... 97

Figure 9-5: Midpoint classification ........................................................................................ 97

Figure 9-6: Setting of test point assignments. The numbers 1 to 7 correspond to the

conditions of requirement 9.3.8.2g. .................................................................... 99

Figure 9-7: Example of target quality of microsection of innerlayer (top) and knee of the

hole (bottom), as-polished (left) and after micro-etch (right). ............................ 113

Figure 9-8: Examples of inadequate quality of microsection showing in the top image

inadequate polishing, leaving scratches on surface, in the middle image
over-etched sample and in the bottom image inadequate lighting, revealing

no detail on metallisation, nor on laminate by transparency.............................. 114

Figure 9-9: Examples of barrel cracks after IST testing showing a nominal crack size

(left) and a large crack filled with SnPb (right) .................................................. 123

Figure 9-10: THB test pattern ............................................................................................. 130

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Figure 9-11: Build-up for THB test vehicle .......................................................................... 130

Figure 9-12: Insulation resistance during THB Ambient (until sample nr 1000) and THB

ECM showing continuous breach of insulation on 4 patterns in the lower

graph. The top graph shows stable insulation. ................................................. 133

Figure 9-13: Horizontal microsection showing fibre contamination on tracks in prepreg

resin causing breach of insulation. ................................................................... 133

Figure 9-14: Lay-out of CAF pattern ................................................................................... 137

Figure 9-15: Schematic for CAF growth .............................................................................. 137

Figure 10-1: Annular ring internal ....................................................................................... 145

Figure 10-2: Annular ring external ...................................................................................... 146

Figure 10-3: Copper foil thickness ...................................................................................... 147

Figure 10-4: Three measurements of copper plating thickness at locations that are at 25

%, 50 % and 75 % of the height of the hole ....................................................... 149

Figure 10-5: Measurement “average on resin” is performed on zone A. Measurement

“on any local thin areas on resin or glass” is performed on Zone B .................. 149

Figure 10-6: Glass fibre protrusion in case of negative etchback (left) and positive

etchback (right) ................................................................................................ 150

Figure 10-7: Example of negative etchback (left) and approximately neutral etchback

(right) ............................................................................................................... 150

Figure 10-8: Wicking is measured from resin of hole wall (red arrows). In case it

exceeds the annular ring, the insulation distance to adjacent circuitry (blue

arrow) can be reduced. .................................................................................... 151

Figure 10-9: Example of wicking ......................................................................................... 151

Figure 10-10: Wrap target condition ................................................................................... 152

Figure 10-11: Wrap thickness below requirement, not acceptable ...................................... 152

Figure 10-12:Projected-peak-to-peak insulation ................................................................. 153

Figure 10-13: Example of glass compression ..................................................................... 153

Figure 10-14: Microvia insulation ........................................................................................ 154

Figure 10-15: Penetration of capture pad for µvia, not acceptable ...................................... 154

Figure 10-16: Microvia aspect ratio, X ≥ Z............................................................................ 155

Figure 10-17: Dimple in microvia ......................................................................................... 155

Figure 10-18: ICD on capture pad (pictures are unetched) ................................................... 155

Figure 10-19: Microvia plating, target condition .................................................................. 156

Figure 10-20: Example of void in microvia plating ............................................................... 156

Figure 10-21: Tin-lead thickness in PTH schematic (left) and a typical microsection

(right) ............................................................................................................... 158

Figure 10-22: Tin-lead thickness on PTH corner – target thickness (left), coverage of less

than 1 µm (middle), absence of SnPb on IMC (right) ......................................... 158

Figure 10-23: Tin-lead thickness on pad ............................................................................. 158

Figure 10-24: Undercut....................................................................................................... 161

Figure 10-25: Example of spurious copper ......................................................................... 161

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Figure 10-26: Overhang of electrolytic Au .......................................................................... 162

Figure 10-27: Example of dimensional verification of rigid-flex interface ............................. 163

Figure 10-28: Examples of acceptable voids ...................................................................... 167

Figure 10-29: Examples of unacceptable voids .................................................................. 167

Figure 10-30: Examples of separation between hole wall and resin inside blind via ........... 167

Figure 10-31: Example of acceptable thin line separation ................................................... 168

Figure 10-32: Example of non-acceptable bulging .............................................................. 168

Figure 10-33: Example of dimple on blind via ..................................................................... 169

Figure 10-34: Example of bump on blind via ....................................................................... 169

Figure 10-35: Example of plating nodule ............................................................................ 170

Figure 10-36: Example of burrs reducing hole diameter ..................................................... 170

Figure 10-37: Example of voids – top image shows etch-out and bottom image shows

an encapsulated void or inclusion..................................................................... 172

Figure 10-38: Skip plating on flex laminate as-polished (top) and after micro-etch

(bottom)............................................................................................................ 172

Figure 10-39: Skip plating on glass fibres ........................................................................... 172

Figure 10-40: Open wedge void (top), encl
...

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