Mechanical standardization of semiconductor devices -- Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

This part of IEC 60191 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.

Mechanische Normung von Halbleiterbauelementen -- Teil 6-16: Glossar für Fassungen für die Prüfung und Voralterung von BGA, LGA, FBGA und FLGA

Normalisation mécanique des dispositifs à semi-conducteurs - Partie 6-16 : Glossaire des supports de test et de déverminage pour les BGA, LGA, FBGA et FLGA

La CEI 60191-6-16:2007 fournit un glossaire relatif aux supports pour boîtiers à semiconducteurs de type BGA, LGA, FBGA et FLGA. Cette norme est destinée à établir des définitions et une unification de la terminologie relatives aux supports de test et de déverminage pour les BGA, LGA, FBGA et FLGA.

Mehanska standardizacija polprevodniških elementov - 6-16. del: Pojmovnik polprevodniških preskušanj in podstavkov za utekanje za BGA, LGA, FBGA in FLGA (IEC 60191-6-16:2007)

General Information

Status
Published
Publication Date
07-Nov-2007
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
24-Oct-2007
Due Date
29-Dec-2007
Completion Date
08-Nov-2007

Buy Standard

Standard
SIST EN 60191-6-16:2008
English language
14 pages
sale 10% off
Preview
sale 10% off
Preview

e-Library read for
1 day

Standards Content (sample)

SLOVENSKI STANDARD
SIST EN 60191-6-16:2008
01-januar-2008
Mehanska standardizacija polprevodniških elementov - 6-16. del: Pojmovnik
polprevodniških preskušanj in podstavkov za utekanje za BGA, LGA, FBGA in
FLGA (IEC 60191-6-16:2007)
Mechanical standardization of semiconductor devices -- Part 6-16: Glossary of
semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

Mechanische Normung von Halbleiterbauelementen -- Teil 6-16: Glossar für Fassungen

für die Prüfung und Voralterung von BGA, LGA, FBGA und FLGA

Normalisation mécanique des dispositifs à semi-conducteurs - Partie 6-16 : Glossaire

des supports de test et de déverminage pour les BGA, LGA, FBGA et FLGA
Ta slovenski standard je istoveten z: EN 60191-6-16:2007
ICS:
01.100.25 5LVEHVSRGURþMD Electrical and electronics
HOHNWURWHKQLNHLQHOHNWURQLNH engineering drawings
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN 60191-6-16:2008 en,de

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN 60191-6-16:2008
---------------------- Page: 2 ----------------------
SIST EN 60191-6-16:2008
EUROPEAN STANDARD
EN 60191-6-16
NORME EUROPÉENNE
June 2007
EUROPÄISCHE NORM
ICS 31.080.01
English version
Mechanical standardization of semiconductor devices -
Part 6-16: Glossary of semiconductor tests
and burn-in sockets for BGA, LGA, FBGA and FLGA
(IEC 60191-6-16:2007)
Normalisation mécanique Mechanische Normung
des dispositifs à semi-conducteurs - von Halbleiterbauelementen -
Partie 6-16: Glossaire des supports Teil 6-16: Glossar für Fassungen
de test et de déverminage für die Prüfung und Voralterung
pour les BGA, LGA, FBGA et FLGA von BGA, LGA, FBGA und FLGA
(CEI 60191-6-16:2007) (IEC 60191-6-16:2007)

This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply

with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard

the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on

application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other

language made by translation under the responsibility of a CENELEC member into its own language and notified

to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the

Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,

Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60191-6-16:2007 E
---------------------- Page: 3 ----------------------
SIST EN 60191-6-16:2008
EN 60191-6-16:2007 - 2 -
Foreword

The text of document 47D/679/FDIS, future edition 1 of IEC 60191-6-16, prepared by SC 47D,

Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was

submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-16 on

2007-05-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-02-01
national standard or by endorsement
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-05-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice

The text of the International Standard IEC 60191-6-16:2007 was approved by CENELEC as a European

Standard without any modification.
__________
---------------------- Page: 4 ----------------------
SIST EN 60191-6-16:2008
- 3 - EN 60191-6-16:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated

references, only the edition cited applies. For undated references, the latest edition of the referenced

document (including any amendments) applies.

NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD

applies.
Publication Year Title EN/HD Year
IEC 60191-1 1966 Mechanical standardization of semiconductor - -
devices -
Part 1: Preparation of drawings of
semiconductor devices
IEC 60191-2 1966 Mechanical standardization of semiconductor - -
devices -
Part 2: Dimensions
IEC 60191-3 1999 Mechanical standardization of semiconductor EN 60191-3 1999
devices -
Part 3: General rules for the preparation of
outline drawings of integrated circuits
IEC 60191-4 1999 Mechanical standardization of semiconductor EN 60191-4 1999
devices -
Part 4: Coding system and classification into
forms of package outlines for semiconductor
device packages
---------------------- Page: 5 ----------------------
SIST EN 60191-6-16:2008
---------------------- Page: 6 ----------------------
SIST EN 60191-6-16:2008
INTERNATIONAL IEC
STANDARD 60191-6-16
First edition
2007-04
Mechanical standardization
of semiconductor devices –
Part 6-16:
Glossary of semiconductor tests and burn-in
sockets for BGA, LGA, FBGA and FLGA
PRICE CODE
Commission Electrotechnique Internationale L
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
---------------------- Page: 7 ----------------------
SIST EN 60191-6-16:2008
– 2 – 60191-6-16 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
______________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –
Part 6-16: Glossary of semiconductor tests and burn-in sockets
for BGA, LGA, FBGA and FLGA
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any

equipment declared to be in conformity with an IEC Publication.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60191-6-16 has been prepared by subcommittee 47D: Mechanical

standardization of semiconductor devices, of IEC technical committee 47: Semiconductor

devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47D/679/FDIS 47D/683/RVD

Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.
This
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.