SIST EN 60191-6-19:2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010)

This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).

Mechanische Normung von Halbleiterbauelementen - Teil 6-19: Messverfahren für die Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung (IEC 60191-6-19:2010)

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-19: Méthodes de mesure du gauchissement des boîtiers à température élevée et du gauchissement maximum admissible (CEI 60191-6-19:2010)

La CEI 60191-6-19:2010 couvre les exigences relatives aux méthodes de mesure du gauchissement des boîtiers à température élevée et du gauchissement maximum admissible pour les boîtiers BGA, FBGA et FLGA. La présente norme annule et remplace l'IEC/PAS 60191-6-19 publié en 2008. Cette première édition constitue une révision technique.

Mehanska standardizacija polprevodniških elementov - 6-19. del: Merilne metode ukrivljenosti okrovov pri povišanih temperaturah in največje dopustne ukrivljenosti (IEC 60191-6-19:2010)

Ta del IEC 60191 določa merilne metode ukrivljenosti okrovov pri povišanih temperaturah in največje dopustne ukrivljenosti za mrežo krogličnih priključkov (BGA), fini raster mreže krogličnih priključkov (FBGA) in fini raster mreže priključkov v ravnini (FLGA).

General Information

• Status: Published
• Publication Date: 22-Jul-2010
• ICS: 01.100.25 - Electrical and electronics engineering drawings
• ICS: 31.080.01 - Semiconductor devices in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 07-Jul-2010
• Due Date: 11-Sep-2010
• Completion Date: 23-Jul-2010
• Ref Project: EN 60191-6-19:2010 - Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60191-6-19:2010
01-september-2010
0HKDQVNDVWDQGDUGL]DFLMDSROSUHYRGQLãNLKHOHPHQWRYGHO0HULOQHPHWRGH
XNULYOMHQRVWLRNURYRYSULSRYLãDQLKWHPSHUDWXUDKLQQDMYHþMHGRSXVWQH
XNULYOMHQRVWL,(&
Mechanical standardization of semiconductor devices - Part 6-19: Measurement
methods of the package warpage at elevated temperature and the maximum permissible
warpage (IEC 60191-6-19:2010)
Mechanische Normung von Halbleiterbauelementen - Teil 6-19: Messverfahren für die
Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung
(IEC 60191-6-19:2010)
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-19: Méthodes de
mesure du gauchissement des boîtiers à température élevée et du gauchissement
maximum admissible (CEI 60191-6-19:2010)
Ta slovenski standard je istoveten z: EN 60191-6-19:2010
ICS:
01.100.25 5LVEHVSRGURþMD Electrical and electronics
HOHNWURWHKQLNHLQHOHNWURQLNH engineering drawings
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN 60191-6-19:2010 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60191-6-19:2010

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SIST EN 60191-6-19:2010

EUROPEAN STANDARD
EN 60191-6-19

NORME EUROPÉENNE
May 2010
EUROPÄISCHE NORM

ICS 31.080.01


English version


Mechanical standardization of semiconductor devices -
Part 6-19: Measurement methods of the package warpage
at elevated temperature and the maximum permissible warpage
(IEC 60191-6-19:2010)


Normalisation mécanique des dispositifs  Mechanische Normung
à semiconducteurs - von Halbleiterbauelementen –
Partie 6-19: Méthodes de mesure Teil 6-19: Messverfahren für die Gehäuse-
du gauchissement des boîtiers Verbiegung bei erhöhter Temperatur
à température élevée und die maximal zulässige Verbiegung
et du gauchissement maximum admissible (IEC 60191-6-19:2010)
(CEI 60191-6-19:2010)




This European Standard was approved by CENELEC on 2010-05-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-6-19:2010 E

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SIST EN 60191-6-19:2010
EN 60191-6-19:2010 - 2 -
Foreword
The text of document 47D/757/FDIS, future edition 1 of IEC 60191-6-19, prepared by SC 47D,
Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was
submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-19 on
2010-05-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2011-02-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2013-05-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60191-6-19:2010 was approved by CENELEC as a European
Standard without any modification.
__________

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SIST EN 60191-6-19:2010
- 3 - EN 60191-6-19:2010
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60191-6-2 - Mechanical standardization of semiconductor EN 60191-6-2 -
devices -
Part 6-2: General rules for the preparation of
outline drawings of surface mounted
semiconductor device packages - Design guide
for 1,50 mm, 1,27 mm and 1,00 mm pitch ball
and column terminal packages


IEC 60191-6-5 - Mechanical standardization of semiconductor EN 60191-6-5 -
devices -
Part 6-5: General rules for the preparation of
outline drawings of surface mounted
semiconductor device packages - Design guide
for fine-pitch ball grid array (FBGA)


IEC 60749-20 - Semiconductor devices - Mechanical and EN 60749-20 -
climatic test methods -
Part 20: Resistance of plastic encapsulated
SMDs to the combined effect of moisture and
soldering heat

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SIST EN 60191-6-19:2010

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SIST EN 60191-6-19:2010

IEC 60191-6-19
®
Edition 1.0 2010-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside


Mechanical standardization of semiconductor devices –
Part 6-19: Measurement methods of the package warpage at elevated
temperature and the maximum permissible warpage

Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-19: Méthodes de mesure du gauchissement des boîtiers à température
élevée et du gauchissement maximum admissible

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
M
CODE PRIX
ICS 31.080.01 ISBN 2-8318-1078-9
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 60191-6-19:2010
– 2 – 60191-6-19 © IEC:2010
CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references .5
3 Terms and definitions .5
4 Sample.9
4.1 Sample size .9
4.2 Solder ball removal .9
4.3 Pretreatment conditions.9
4.4 Maximum time after pretreatment until measurement.9
4.5 Repetition of the reflow cycles for the sample.9
5 Measurement .9
5.1 General description .9
5.2 Temperature profile and the temperatures for measurements .9
5.3 Measurement method.10
5.3.1 Shadow moiré method .10
5.3.2 Laser reflection method .10
5.3.3 Data analysis (Data table, Diagonal scan graph, 3D plot graph).11
6 Maximum permissible package warpage at elevated temperature .11
7 Recommended datasheet for the package warpage.11
7.1 Measurement temperatures for data sheet .11
7.2 Datasheet.11
7.3 Example of datasheets .12

Figure 1 – Measuring area of BGA and FBGA in full grid layout .6
Figure 2 – Measuring area of BGA and FBGA perimeter layout with 4 rows and 4
columns .6
Figure 3 – Measuring area of FLGA perimeter layout with 4 rows and 4 columns .7
Figure 4 – Calculation of the sign of package warpage .8
Figure 5 – Package warpage .8
Figure 6 – Thermocouple placement .10
Figure 7 – Temperature dependency of the package warpage .12
Figure 8 – Recommended datasheet.13

Table 1 – Maximum permissible package warpages for BGA and FBGA.11
Table 2 – Maximum permissible package warpages for FLGA.11

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SIST EN 60191-6-19:2010
60191-6-19 © IEC:2010 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-19: Measurement methods of the package warpage
at elevated temperature and the maximum permissible warpage


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-19 has been prepared by subcommittee 47D: Mechanical
standardization for semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition
constitutes a technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
47D/757/FDIS 47D/764/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

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SIST EN 60191-6-19:2010
– 4 – 60191-6-19 © IEC:2010
This
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