Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

IEC 61191-1:2018 is also available as IEC 61191-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
- the term "assembly drawing" has been changed to "assembly documentation" throughout;
- references to IEC standards have been corrected;
- Clause 9 was completely rewritten;
- Annex B was removed because there are already procedures for circuit board assemblies.

Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives aux ensembles électriques et électroniques brasés utilisant les techniques de montage en surface et associées

IEC 61191-1:2018 est disponible sous forme de IEC 61191-1:2018 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L’IEC 61191-1:2018 établit les exigences relatives aux matériaux, méthodes et critères de vérification utilisés dans le cadre de la production d’interconnexions et d’ensembles brasés de qualité faisant appel à la technique de montage en surface ainsi qu’à des techniques d’assemblage associées. La présente partie de l’IEC 61191 comprend également des recommandations concernant la qualité des processus de fabrication. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- les exigences ont été mises à jour pour être conformes aux critères d’acceptation de l’IPC‑A-610F;
- le terme "dessin d’assemblage" a été remplacé partout par "document d’assemblage";
- les références aux normes IEC ont été corrigées;
- l’Article 9 a été entièrement réécrit;
- l’Annexe B a été retirée car des procédures d’assemblages de cartes à circuits existent déjà.

General Information

Status
Published
Publication Date
13-Sep-2018
Current Stage
PPUB - Publication issued
Completion Date
14-Sep-2018
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IEC 61191-1:2018 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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IEC 61191-1
Edition 3.0 2018-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 1: Generic specification – Requirements for soldered electrical and
electronic assemblies using surface mount and related assembly technologies
Ensembles de cartes imprimées –
Partie 1: Spécification générique – Exigences relatives aux ensembles
électriques et électroniques brasés utilisant les techniques de montage en
surface et associées
IEC 61191-1:2018-09(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 61191-1
Edition 3.0 2018-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 1: Generic specification – Requirements for soldered electrical and
electronic assemblies using surface mount and related assembly technologies
Ensembles de cartes imprimées –
Partie 1: Spécification générique – Exigences relatives aux ensembles
électriques et électroniques brasés utilisant les techniques de montage en
surface et associées
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190; 31.240 ISBN 978-2-8322-5953-5

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 61191-1:2018 © IEC 2018
CONTENTS

FOREWORD ......................................................................................................................... 6

1 Scope ............................................................................................................................ 8

2 Normative references..................................................................................................... 8

3 Terms and definitions .................................................................................................... 9

4 General requirements .................................................................................................. 10

4.1 Order of precedence ........................................................................................... 10

4.1.1 General remark ............................................................................................ 10

4.1.2 Conflict ........................................................................................................ 10

4.1.3 Conformance documentation ........................................................................ 10

4.2 Interpretation of requirements .............................................................................. 11

4.3 Classification ...................................................................................................... 11

4.4 Defects and process indicators ............................................................................ 11

4.5 Process control requirements .............................................................................. 12

4.6 Requirements flowdown ...................................................................................... 12

4.7 Physical designs ................................................................................................. 12

4.7.1 New designs ................................................................................................ 12

4.7.2 Existing designs ........................................................................................... 12

4.8 Visual aids .......................................................................................................... 12

4.9 Proficiency of personnel ...................................................................................... 13

4.9.1 Design proficiency ........................................................................................ 13

4.9.2 Manufacturing proficiency............................................................................. 13

4.10 Electrostatic discharge (ESD) .............................................................................. 13

4.11 Facilities ............................................................................................................. 13

4.11.1 General ....................................................................................................... 13

4.11.2 Environmental controls ................................................................................. 13

4.11.3 Temperature and humidity ............................................................................ 13

4.11.4 Lighting ....................................................................................................... 14

4.11.5 Field conditions ............................................................................................ 14

4.11.6 Clean rooms ................................................................................................ 14

4.12 Assembly tools and equipment ............................................................................ 14

4.12.1 General ....................................................................................................... 14

4.12.2 Process control ............................................................................................ 14

5 Requirements of materials ........................................................................................... 14

5.1 Overview............................................................................................................. 14

5.2 Solder ................................................................................................................. 14

5.3 Flux .................................................................................................................... 14

5.4 Solder paste ....................................................................................................... 15

5.5 Preform solder .................................................................................................... 15

5.6 Adhesives ........................................................................................................... 15

5.7 Cleaning agents .................................................................................................. 15

5.7.1 General ....................................................................................................... 15

5.7.2 Cleaning agents selection ............................................................................ 15

5.8 Polymeric coatings .............................................................................................. 16

5.8.1 Solder resists and localized maskants .......................................................... 16

5.8.2 Conformal coating and encapsulants ............................................................ 16

5.8.3 Spacers (permanent and temporary) ............................................................. 16

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IEC 61191-1:2018 © IEC 2018 – 3 –

5.9 Chemical strippers .............................................................................................. 16

5.10 Cleaning Agents .................................................................................................. 16

5.11 Heat shrinkable soldering devices ....................................................................... 16

6 Components and printed board requirements ............................................................... 16

6.1 General ............................................................................................................... 16

6.2 Solderability ........................................................................................................ 17

6.2.1 Parts solderability ........................................................................................ 17

6.2.2 Reconditioning ............................................................................................. 17

6.2.3 Solderability testing of ceramic boards ......................................................... 17

6.3 Solderability maintenance ................................................................................... 17

6.3.1 General ....................................................................................................... 17

6.3.2 Preconditioning ............................................................................................ 17

6.3.3 Gold embrittlement of solder joints ............................................................... 17

6.3.4 Tinning of non-solderable parts .................................................................... 18

6.4 Solder purity maintenance ................................................................................... 18

6.5 Lead preparation ................................................................................................. 19

6.5.1 General ....................................................................................................... 19

6.5.2 Lead forming ................................................................................................ 19

6.5.3 Lead-forming limits ....................................................................................... 19

7 Assembly process requirements ................................................................................... 20

7.1 Overview............................................................................................................. 20

7.2 Cleanliness ......................................................................................................... 20

7.3 Part markings and reference designations ........................................................... 20

7.4 Solder connection contours ................................................................................. 20

7.5 Moisture traps ..................................................................................................... 20

7.6 Thermal dissipation ............................................................................................. 20

8 Assembly soldering requirements ................................................................................. 20

8.1 General ............................................................................................................... 20

8.1.1 Soldering process ........................................................................................ 20

8.1.2 Machine maintenance .................................................................................. 21

8.1.3 Handling of parts .......................................................................................... 21

8.1.4 Preheating ................................................................................................... 21

8.1.5 Carriers ....................................................................................................... 21

8.1.6 Hold down of surface mount leads ................................................................ 21

8.1.7 Heat application ........................................................................................... 21

8.1.8 Cooling ........................................................................................................ 21

8.2 Reflow soldering ................................................................................................. 21

8.2.1 Requirements .............................................................................................. 21

8.2.2 Process development for reflow soldering ..................................................... 22

8.2.3 Flux application ............................................................................................ 22

8.2.4 Solder application ........................................................................................ 22

8.3 Manual/hand soldering ........................................................................................ 23

8.3.1 Non-reflow manual soldering ........................................................................ 23

8.3.2 Reflow manual soldering .............................................................................. 23

9 Cleanliness and residue requirements .......................................................................... 24

9.1 General ............................................................................................................... 24

9.2 Qualified cleaning/manufacturing process ............................................................ 24

9.2.1 General ....................................................................................................... 24

---------------------- Page: 5 ----------------------
– 4 – IEC 61191-1:2018 © IEC 2018

9.2.2 Cleaning designator ..................................................................................... 25

9.2.3 Upper specification limit ............................................................................... 25

9.3 Visual requirements ............................................................................................ 25

9.4 Correlation of ionic testers ................................................................................... 26

9.5 Non-ionic residues .............................................................................................. 26

9.6 SIR testing .......................................................................................................... 26

10 Assembly requirements ................................................................................................ 26

10.1 General ............................................................................................................... 26

10.2 Acceptance requirements .................................................................................... 26

10.2.1 Process control ............................................................................................ 26

10.2.2 Corrective action limits ................................................................................. 27

10.2.3 Control limit determination ............................................................................ 27

10.3 General assembly requirements .......................................................................... 27

10.3.1 Assembly integrity ........................................................................................ 27

10.3.2 Assembly damage ........................................................................................ 27

10.3.3 Markings ...................................................................................................... 28

10.3.4 Flatness (bow and twist) ............................................................................... 28

10.3.5 Solder connection ........................................................................................ 28

10.3.6 Interfacial connections ................................................................................. 30

11 Coating and encapsulation ........................................................................................... 30

11.1 Conformal coating ............................................................................................... 30

11.1.1 Coating instructions ..................................................................................... 30

11.1.2 Application ................................................................................................... 30

11.1.3 Performance requirements ........................................................................... 31

11.1.4 Rework of conformal coating ........................................................................ 32

11.1.5 Conformal coating inspection ....................................................................... 32

11.2 Encapsulation ..................................................................................................... 32

11.2.1 Encapsulation instructions ............................................................................ 32

11.2.2 Application ................................................................................................... 32

11.2.3 Performance requirements ........................................................................... 33

11.2.4 Rework of encapsulant material .................................................................... 33

11.2.5 Encapsulant inspection ................................................................................ 33

12 Rework and repair ....................................................................................................... 33

12.1 Rework of unsatisfactorily soldered electrical and electronic assemblies .............. 33

12.2 Repair ................................................................................................................. 34

12.3 Post rework/repair cleaning ................................................................................. 34

13 Product quality assurance ............................................................................................ 35

13.1 System requirements ........................................................................................... 35

13.2 Inspection methodology ....................................................................................... 35

13.2.1 Verification inspection .................................................................................. 35

13.2.2 Visual inspection .......................................................................................... 35

13.2.3 Sampling inspection ..................................................................................... 36

13.3 Process control ................................................................................................... 36

13.3.1 System details ............................................................................................. 36

13.3.2 Defect reduction ........................................................................................... 36

13.3.3 Variance reduction ....................................................................................... 37

14 Other requirements ...................................................................................................... 37

14.1 Health and safety ................................................................................................ 37

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IEC 61191-1:2018 © IEC 2018 – 5 –

14.2 Special manufacturing requirements .................................................................... 37

14.2.1 Manufacture of devices incorporating magnetic windings .............................. 37

14.2.2 High-frequency applications ......................................................................... 37

14.2.3 High-voltage or high-power applications ....................................................... 37

14.3 Guidance on requirement flowdown ..................................................................... 37

15 Ordering data .............................................................................................................. 37

Annex A (normative) Requirements for soldering tools and equipment ................................ 39

A.1 Requirements for tools and equipment ................................................................. 39

A.2 Abrasives ............................................................................................................ 39

A.3 Benchtop and hand-soldering systems ................................................................. 39

A.4 Soldering iron holders ......................................................................................... 40

A.5 Wiping pads ........................................................................................................ 40

A.6 Soldering guns .................................................................................................... 40

A.7 Solder pots ......................................................................................................... 40

A.8 Process control ................................................................................................... 40

Annex B (normative) Quality assessment ........................................................................... 41

B.1 Process control (PC) ........................................................................................... 41

B.2 Reduction of quality conformance testing ............................................................. 41

B.3 Audit plan ........................................................................................................... 42

Bibliography ....................................................................................................................... 43

Figure 1 – Solder contact angle ........................................................................................... 29

Figure 2 – Solder wetting of plated through-holes without leads ........................................... 30

Figure 3 – Coating conditions .............................................................................................. 31

Table 1 – Solder contamination limits; maximum contaminant limit (percentage by

weight) ............................................................................................................................... 19

Table 2 – Designation of surfaces to be cleaned .................................................................. 25

Table 3 – Residue testing for process control ...................................................................... 25

Table 4 – Maximum acceptable rosin flux residues .............................................................. 26

Table 5 – Electrical and electronic assembly defects ........................................................... 34

Table 6 – Magnification requirements .................................................................................. 35

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– 6 – IEC 61191-1:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARD ASSEMBLIES –
Part 1: Generic specification –
Requirements for soldered electrical and electronic assemblies
using surface mount and related assembly technologies
FOREWORD

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