EN IEC 62680-1-2:2025
(Main)Universal serial bus interfaces for data and power - Part 1-2: Common components - USB Power Delivery specification
Universal serial bus interfaces for data and power - Part 1-2: Common components - USB Power Delivery specification
IEC 62680-1-2:2024 The USB Power Delivery specification defines a power delivery system covering all elements of a USB system including Hosts, Devices, Hubs, Chargers and cable assemblies. This specification describes the architecture, protocols, power supply behavior, connectors and cabling necessary for managing power delivery over USB at up to 100W. This specification is intended to be fully compatible and extend the existing USB infrastructure. It is intended that this specification will allow system OEMs, power supply and peripheral developers adequate flexibility for product versatility and market differentiation without losing backwards compatibility. IEC 62680-1-2:2024 cancels and replaces the sixth edition published in 2022 and constitutes a technical revision. Extended Power Range (EPR) including Adjustable Voltage Supply (AVS) has been added. This document is the USB-IF publication Universal Serial Bus Power Delivery Specification Revision 3.2, Version 1.0.
Universelle Bus-Schnittstellen für Daten und Energie - Teil 1-2: Gemeinsame Komponenten - Festlegung für die Energieübertragung über USB
Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie 1-2: Composants communs - Spécification de l'alimentation électrique par port USB
IEC 62680-1-2:2024 La spécification de l'alimentation électrique par port USB définit un système d'alimentation électrique qui couvre tous les éléments d'un système USB, y compris les hôtes, les dispositifs, les hubs, les chargeurs et les assemblages de câbles. La présente spécification décrit l'architecture, les protocoles, le comportement de l'alimentation électrique, les connecteurs et le câblage nécessaires à la gestion de l'alimentation électrique sur USB jusqu'à 100 W. La présente spécification est destinée à être entièrement compatible avec les infrastructures USB existantes et à en assurer une extension. Il est prévu que cette spécification offre aux OEM de systèmes, ainsi qu'aux développeurs d'alimentations électriques et de périphériques, une souplesse appropriée pour une polyvalence des produits et leur différenciation sur le marché, sans perdre en compatibilité ascendante. L’IEC 62680-1-2:2024 annule et remplace et remplace la sixième édition parue en 2022 et constitue une révision technique. La plage de puissance étendue (EPR, Extended Power Range)) incluant l’alimentation à tension réglable (AVS, Adjustable Voltage Supply) a été ajoutée. Le présent document est la publication de l'USB-IF relative à l'alimentation électrique par port USB, révision 3.2, version 1.0.
Vmesniki univerzalnega serijskega vodila za prenos podatkov in napajanje - 1-2. del: Skupne komponente - Specifikacija za zagotavljanje napajanja prek USB (IEC 62680-1-2:2024)
Ta specifikacija je namenjena za uporabo kot dopolnilo obstoječih specifikacij za [USB 2.0], [USB 3.2], [USB tipa C 2.3] in [USBBC 1.2]. Obravnava samo elemente, potrebne za zagotavljanje napajanja prek USB. Namenjena je dobaviteljem električne energije, proizvajalcem platform, naprav in kabelskih sklopov [USB 2.0], [USB 3.2], [USB tipa C 2.3] in [USBBC 1.2].
Normativne informacije so podane za namene zagotavljanja interoperabilnosti sestavnih delov, izdelanih v skladu s to specifikacijo.
Informativne informacije (če so podane) ponazarjajo možne načine načrtovane uporabe.
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
01-junij-2025
Vmesniki univerzalnega serijskega vodila za prenos podatkov in napajanje - 1-2.
del: Skupne komponente - Specifikacija za zagotavljanje napajanja prek USB (IEC
62680-1-2:2024)
Universal serial bus interfaces for data and power - Part 1-2: Common components -
USB power delivery specification (IEC 62680-1-2:2024)
Universelle Bus-Schnittstellen für Daten und Energie - Teil 1-2: Gemeinsame
Komponenten - Festlegung für die Energieübertragung über USB (IEC 62680-1-2:2024)
Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie
1-2: Composants communs - Spécification de l'alimentation électrique par port USB (IEC
62680-1-2:2024)
Ta slovenski standard je istoveten z: EN IEC 62680-1-2:2025
ICS:
35.200 Vmesniška in povezovalna Interface and interconnection
oprema equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 62680-1-2
NORME EUROPÉENNE
EUROPÄISCHE NORM January 2025
ICS 29.220; 33.120; 35.200 Supersedes EN IEC 62680-1-2:2022
English Version
Universal serial bus interfaces for data and power - Part 1-2:
Common components - USB Power Delivery specification
(IEC 62680-1-2:2024)
Interfaces de bus universel en série pour les données et Universelle Bus-Schnittstellen für Daten und Energie - Teil
l'alimentation électrique - Partie 1-2: Composants communs 1-2: Gemeinsame Komponenten - Festlegung für die
- Spécification de l'alimentation électrique par port USB Energieübertragung über USB
(IEC 62680-1-2:2024) (IEC 62680-1-2:2024)
This European Standard was approved by CENELEC on 2025-01-17. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
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CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2025 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62680-1-2:2025 E
European foreword
The text of document 100/4138/CDV, future edition 7 of IEC 62680-1-2, prepared by TC 100/Technical
Area 18 "Multimedia home systems and applications for end-user networks" was submitted to the IEC-
CENELEC parallel vote and approved by CENELEC as EN IEC 62680-1-2:2025.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2026-01-31
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2028-01-31
document have to be withdrawn
This document supersedes EN IEC 62680-1-2:2022 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Any feedback and questions on this document should be directed to the users’ national committee. A
complete listing of these bodies can be found on the CENELEC website.
Endorsement notice
The text of the International Standard IEC 62680-1-2:2024 was approved by CENELEC as a
European Standard without any modification.
IEC 62680-1-2 ®
Edition 7.0 2024-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Universal serial bus interfaces for data and power –
Part 1-2: Common components – USB Power Delivery specification
Interfaces de bus universel en série pour les données et l'alimentation
électrique –
Partie 1-2: Composants communs – Spécification de l'alimentation électrique
par port USB
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.220, 33.120, 35.200 ISBN 978-2-8327-0040-2
– 2 – IEC 62680-1-2:2024
© USB-IF 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER –
Part 1-2: Common components – USB Power Delivery specification
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national
electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all
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the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between
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of opinion on the relevant subjects since each technical committee has representation from all interested IEC National
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the corresponding national or regional publication shall be clearly indicated in the latter.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable
for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a) patent(s). IEC
takes no position concerning the evidence, validity or applicability of any claimed patent rights in respect thereof. As of the
date of publication of this document, IEC had not received notice of (a) patent(s), which may be required to implement this
document. However, implementers are cautioned that this may not represent the latest information, which may be obtained
from the patent database available at https://patents.iec.ch. IEC shall not be held responsible for identifying any or all such
patent rights.
IEC 62680-1-2 has been prepared by technical area 18: Multimedia home systems and applications for
end-user networks, of IEC technical committee 100: Audio, video and multimedia systems and
equipment. It is an International Standard.
The text of this standard was prepared by the USB Implementers Forum (USB-IF). The structure and
editorial rules used in this publication reflect the practice of the organization which submitted it.
Page 2 USB Power Delivery Speci�ication Revision 3.2, Version 1.0, 2023-10
IEC 62680-1-2:2024 – 3 –
© USB-IF 2023
The text of this International Standard is based on the following documents:
Draft Report on voting
100/4138/CDV 100/4176/RVC
Full information on the voting for its approval can be found in the report on voting indicated in the above
table.
A list of all parts in the IEC 62680 series, published under the general title Universal serial bus interfaces
for data and power, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the stability
date indicated on the IEC website under webstore.iec.ch in the data related to the specific document. At
this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.
USB Power Delivery Specification Revision 3.2, Version 1.0, 2023-10 Page 3
– 4 – IEC 62680-1-2:2024
© USB-IF 2023
Universal Serial Bus
Power Delivery Specification
3.2
Revision:
1.0
Version:
2023-10
Release date:
Page 4 USB Power Delivery Speci�ication Revision 3.2, Version 1.0, 2023-10
IEC 62680-1-2:2024 – 5 –
© USB-IF 2023
LIMITED COPYRIGHT LICENSE
THE USB 3.0 PROMOTERS GRANT A CONDITIONAL COPYRIGHT LICENSE UNDER THE COPYRIGHTS
EMBODIED IN THE USB POWER DELVERY SPECIFICATION TO USE AND REPRODUCE THE
SPECIFICATION FOR THE SOLE PURPOSE OF, AND SOLELY TO THE EXTENT NECESSARY FOR,
EVALUATING WHETHER TO IMPLEMENT THE SPECIFICATION IN PRODUCTS THAT WOULD COMPLY
WITH THE SPECIFICATION. WITHOUT LIMITING THE FOREGOING, USE THE OF SPECIFICATION
FOR THE PURPOSE OF FILING OR MODIFYING ANY PATENT APPLICATION TO TARGET THE
SPECIFICATION OR USB COMPLIANT PRODUCTS IS NOT AUTHORIZED. EXCEPT FOR THIS EXPRESS
COPYRIGHT LICENSE, NO OTHER RIGHTS OR LICENSES ARE GRANTED, INCLUDING WITHOUT
LIMITATION ANY PATENT LICENSES. IN ORDER TO OBTAIN ANY ADDITIONALY INTELLECTUAL
PROPERTY LICENSES OR LICENSING COMMITMENTS ASSOCIATED WITH THE SPECIFICATION A
PARTY MUST EXECUTE THE USB 3.0 ADOPTERS AGREEMENT. NOTE: BY USING THE
SPECIFICATION, YOU ACCEPT THESE LICENSE TERMS ON YOUR OWN BEHALF AND, IN THE CASE
WHERE YOU ARE DOING THIS AS AN EMPLOYEE, ON BEHALF OF YOUR EMPLOYER.
INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER,
INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY
PARTICULAR PURPOSE. THE AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY,
INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR
IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS
SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.
Please send comments via electronic mail to techsup@usb.org.
For industry information, refer to the USB Implementers Forum web page at http://www.usb.org.
® ®
USB Type-C and USB4 are trademarks of the Universal Serial Bus Implementers Forum (USB-IF). Thunderbolt™ is
a trademark of Intel Corporation.
You may only use the Thunderbolt™ trademark or logo in conjunction with products designed to this specification
that complete proper certification and executing a Thunderbolt™ trademark license – see http://usb.org/compliance
for further information.
All product names are trademarks, registered trademarks, or service marks of their respective owners.
Corporation, Renesas, STMicroelectronics, and Texas Instruments.
All rights reserved.
USB Power Delivery Specification Revision 3.2, Version 1.0, 2023-10 Page 5
– 6 – IEC 62680-1-2:2024
© USB-IF 2023
Editors
Bob Dunstan
Richard Petrie
Contributors
Charles Wang ACON, Advanced-Connectek, Inc. Sameer Kelkar Apple
Conrad Choy ACON, Advanced-Connectek, Inc. Sasha Tietz Apple
Dennis Chuang ACON, Advanced-Connectek, Inc. Scott Jackson Apple
Steve Sedio ACON, Advanced-Connectek, Inc. Sree Raman Apple
Sunney Yang ACON, Advanced-Connectek, Inc. William Ferry Apple
Vicky Chuang ACON, Advanced-Connectek, Inc. Zaki Moussaoui Apple
Joseph Scanlon Advanced Micro Devices Jeff Liu ASMedia Technology Inc.
Sujan Thomas Advanced Micro Devices Kuo Lung Li ASMedia Technology Inc.
Caspar Lin Allion Labs, Inc. Ming-Wei Hsu ASMedia Technology Inc.
Casper Lee Allion Labs, Inc. PS Tseng ASMedia Technology Inc.
Danny Shih Allion Labs, Inc. Sam Tzeng ASMedia Technology Inc.
Howard Chang Allion Labs, Inc. Thomas Hsu ASMedia Technology Inc.
Greg Stewart Analogix Semiconductor, Inc. Weikao Chang ASMedia Technology Inc.
Mehran Badii Analogix Semiconductor, Inc. Yang Cheng ASMedia Technology Inc.
Alexei Kosut Apple Aaron Hou Bizlink Technology Inc.
Bill Cornelius Apple Shawn Meng Bizlink Technology Inc.
Carlos Colderon Apple Bernard Shyu Bizlink Technology, Inc.
Chris Uiterwijk Apple Eric Wu Bizlink Technology, Inc.
Colin Whitby-Strevens Apple Morphy Hsieh Bizlink Technology, Inc.
Corey Axelowitz Apple Sean O'Neal Bizlink Technology, Inc.
Corey Lange Apple Tiffany Hsiao Bizlink Technology, Inc.
Dave Conroy Apple Weichung Ooi Bizlink Technology, Inc.
David Sekowski Apple Rahul Bhushan Broadcom Corp.
Girault Jones Apple Asila nahas Cadence Design Systems, Inc.
James Orr Apple Claire Ying Cadence Design Systems, Inc.
Jason Chung Apple Jie min Cadence Design Systems, Inc.
Jay Kim Apple Mark Summers Cadence Design Systems, Inc.
Jeff Wilcox Apple Michal Staworko Cadence Design Systems, Inc.
Jennifer Tsai Apple Sathish Kumar Ganesan Cadence Design Systems, Inc.
Karl Bowers Apple Alessandro Ingrassia Canova Tech
Keith Porthouse Apple Andrea Colognese Canova Tech
Kevin Hsiue Apple Antonio Orzelli Canova Tech
Matt Mora Apple Davide Ghedin Canova Tech
Paul Baker Apple Matteo Casalin Canova Tech
Reese Schreiber Apple Michael Marioli Canova Tech
Ricardo Janezic Pregitzer Apple Nicola Scantamburlo Canova Tech
Ruchi Chaturvedi Apple Paolo Pilla Canova Tech
Page 6 USB Power Delivery Speci�ication Revision 3.2, Version 1.0, 2023-10
IEC 62680-1-2:2024 – 7 –
© USB-IF 2023
Ray Huang Canyon Semiconductor KE Hong Dialog Semiconductor (UK) Ltd
Yi-Feng Lin Canyon Semiconductor Kevin Mori Dialog Semiconductor (UK) Ltd
YuHung Lin Canyon Semiconductor Larry Ping Dialog Semiconductor (UK) Ltd
David Tsai Chrontel, Inc. Mengfei Liu Dialog Semiconductor (UK) Ltd
Anshul Gulati Cypress Semiconductor Scott Brown Dialog Semiconductor (UK) Ltd
Anup Nayak Cypress Semiconductor Yimin Chen Dialog Semiconductor (UK) Ltd
Benjamin Kropf Cypress Semiconductor Yong Li Dialog Semiconductor (UK) Ltd
Dhanraj Rajput Cypress Semiconductor Justin Lee Diodes Incorporated
Ganesh Subramaniam Cypress Semiconductor Dan Ellis DisplayLink (UK) Ltd.
Jagadeesan Raj Cypress Semiconductor Jason Young DisplayLink (UK) Ltd.
Junjie cui Cypress Semiconductor Kevin Jacobs DisplayLink (UK) Ltd.
Manu Kumar Cypress Semiconductor Paulo Alcobia DisplayLink (UK) Ltd.
Muthu M Cypress Semiconductor Peter Burgers DisplayLink (UK) Ltd.
Nicholas Bodnaruk Cypress Semiconductor Richard Petrie DisplayLink (UK) Ltd.
Pradeep Bajpai Cypress Semiconductor Chien-Cheng Kuo eEver Technology, Inc.
Rajaram R Cypress Semiconductor Shyanjia Chen eEver Technology, Inc.
Rama Vakkantula Cypress Semiconductor Abel Astley Ellisys
Rushil Kadakia Cypress Semiconductor Chuck Trefts Ellisys
Simon Nguyen Cypress Semiconductor Emmanuel Durin Ellisys
Steven Wong Cypress Semiconductor Mario Pasquali Ellisys
Subu Sankaran Cypress Semiconductor Tim Wei Ellisys
Sumeet Gupta Cypress Semiconductor Chien-Cheng Kuo Etron Technology, Inc.
Tejender Sheoran Cypress Semiconductor Jack Yang Etron Technology, Inc.
Venkat Mandagulathar Cypress Semiconductor Richard Crisp Etron Technology, Inc.
Xiaofeng Shen Cypress Semiconductor Shyanjia Chen Etron Technology, Inc.
Zeng Wei Cypress Semiconductor TsungTa Lu Etron Technology, Inc.
Adie Tan Dell Inc. Christian Klein Fairchild Semiconductor
Adolfo Montero Dell Inc. Oscar Freitas Fairchild Semiconductor
Bruce Montag Dell Inc. Souhib Harb Fairchild Semiconductor
Gary Verdun Dell Inc. Amanda Ying Feature Integration Technology Inc.
Ken Nicholas Dell Inc. Jacky Chan Feature Integration Technology Inc.
Marcin Nowak Dell Inc. Kenny Hsieh Feature Integration Technology Inc.
Merle Wood Dell Inc. KungAn Lin Feature Integration Technology Inc.
Mohammed Hijazi Dell Inc. Paul Yang Feature Integration Technology Inc.
Siddhartha Reddy Dell Inc. Su Jaden Feature Integration Technology Inc.
Terry Matula Dell Inc. Yu-Lin Chu Feature Integration Technology Inc.
Jay Hu Derun Semiconductor Yulin Lan Feature Integration Technology Inc.
Shelly Liu Derun Semiconductor AJ Yang Foxconn / Hon Hai
Bindhu Vasu Dialog Semiconductor (UK) Ltd Bob Hall Foxconn / Hon Hai
Chanchal Gupta Dialog Semiconductor (UK) Ltd Chihyin Kan Foxconn / Hon Hai
Dipti Baheti Dialog Semiconductor (UK) Ltd Fred Fons Foxconn / Hon Hai
Duc Doan Dialog Semiconductor (UK) Ltd Jie Zheng Foxconn / Hon Hai
Holger Petersen Dialog Semiconductor (UK) Ltd Patrick Casher Foxconn / Hon Hai
Jianming Yao Dialog Semiconductor (UK) Ltd Shruti Deore Foxconn / Hon Hai
John Shi Dialog Semiconductor (UK) Ltd Steve Sedio Foxconn / Hon Hai
USB Power Delivery Specification Revision 3.2, Version 1.0, 2023-10 Page 7
– 8 – IEC 62680-1-2:2024
© USB-IF 2023
Terry Little Foxconn / Hon Hai Vishal Kakade Granite River Labs
Bob McVay Fresco Logic Inc. Yogeshwaran Venkatesan Granite River Labs
Christopher Meyers Fresco Logic Inc. Jerry Qin GuangDong OPPO Mobile
Dian Kurniawan Fresco Logic Inc. Alan Berkema Hewlett Packard
Tom Burton Fresco Logic Inc. Lee Atkinson Hewlett Packard
Abraham Levkoy Google Inc. Rahul Lakdawala Hewlett Packard
Adam Rodriguez Google Inc. Robin Castell Hewlett Packard
Alec Berg Google Inc. Ron Schooley Hewlett Packard
Benson Leung Google Inc. Steve Chen Hewlett Packard
Chao Fei Google Inc. Suketa Partiwala Hewlett Packard
Dave Bernard Google Inc. Vaibhav Malik Hewlett Packard
David Schneider Google Inc. Walter Fry Hewlett Packard
Diana Zigterman Google Inc. Hideyuki HAYAFUJI Hosiden Corporation
Eric Herrmann Google Inc. Keiji Mine Hosiden Corporation
Jameson Thies Google Inc. Masaki Yamaoka Hosiden Corporation
Jim Guerin Google Inc. Takashi Muto Hosiden Corporation
Juan Fantin Google Inc. Yasunori Nishikawa Hosiden Corporation
Ken Wu Google Inc. Alan Berkema HP Inc.
Kyle Tso Google Inc. Kenneth Chan HP Inc.
Mark Hayter Google Inc. Lee Atkinson HP Inc.
Nathan Kolluru Google Inc. Lee Leppo HP Inc.
Nithya Jagannathan Google Inc. Rahul Lakdawala HP Inc.
Srikanth Lakshmikanthan Google Inc. Robin Castell HP Inc.
Todd Broch Google Inc. Roger Benson HP Inc.
Toshak Singhal Google Inc. Steve Chen HP Inc.
Vincent Palatin Google Inc. Bai Sean Huawei Technologies Co., Ltd.
Xuelin Wu Google Inc. Chunjiang Zhao Huawei Technologies Co., Ltd.
Zhenxue Xu Google Inc. JianQuan Wu Huawei Technologies Co., Ltd.
Alan Kinningham Granite River Labs Li Zongjian Huawei Technologies Co., Ltd.
Anand Murugan Granite River Labs Liansheng Zheng Huawei Technologies Co., Ltd.
Balamurugan Manialagan Granite River Labs Lihua Duan Huawei Technologies Co., Ltd.
Medipalli Sowmya Granite River Labs Min Chen Huawei Technologies Co., Ltd.
Mike Engbretson Granite River Labs Wang Feng Huawei Technologies Co., Ltd.
Mike Wu Granite River Labs Wei Haihong Huawei Technologies Co., Ltd.
Mukesh Tatiya Granite River Labs Zhenning Shi Huawei Technologies Co., Ltd.
Naresh Botsa Granite River Labs James Xie Hynetek Semiconductor Co., Ltd
PoornaKumar M. Granite River Labs Yingyang Ou Hynetek Semiconductor Co., Ltd
Prajwal Rathod Granite River Labs Robert Heaton Indie Semiconductor
Rajaraman V Granite River Labs Vincent Wang Indie Semiconductor
Saai Ghoutham Revathi Granite River Labs Benjamin Kropf In�ineon Technologies
Sivan Perumal Granite River Labs Sie Boo Chiang In�ineon Technologies
Sivaram Murugesan Granite River Labs Tue Fatt David Wee In�ineon Technologies
Tim Lin Granite River Labs Wee Tar Richard Ng In�ineon Technologies
Wolfgang Furtner In�ineon Technologies
Vijay S. Granite River Labs
Vijayakumar P Granite River Labs Aruni Nelson Intel Corporation
Page 8 USB Power Delivery Speci�ication Revision 3.2, Version 1.0, 2023-10
IEC 62680-1-2:2024 – 9 –
© USB-IF 2023
Bob Dunstan Intel Corporation Babu Mailachalam Lattice Semiconductor Corp
Brad Saunders Intel Corporation Gianluca Mariani Lattice Semiconductor Corp
Chee Lim Nge Intel Corporation Joel Coplen Lattice Semiconductor Corp
Christine Krause Intel Corporation Thomas Watza Lattice Semiconductor Corp
Chuen Ming Tan Intel Corporation Vesa Lauri Lattice Semiconductor Corp
Dan Froelich Intel Corporation Bruce Chuang Leadtrend
David Harriman Intel Corporation Eilian Liu Leadtrend
David Hines Intel Corporation Chetan Kopalle LeCroy Corporation
David Thompson Intel Corporation Daniel H Jacobs LeCroy Corporation
Guobin Liu Intel Corporation Jake Jacobs LeCroy Corporation
Harry Skinner Intel Corporation Kimberley McKay LeCroy Corporation
Henrik Leegaard Intel Corporation Mike Engbretson LeCroy Corporation
Jenn Chuan Cheng Intel Corporation Mike Micheletti LeCroy Corporation
Jervis Lin Intel Corporation Roy Chestnut LeCroy Corporation
John Howard Intel Corporation Tyler Joe LeCroy Corporation
Karthi Vadivelu Intel Corporation Phil Jakes Lenovo
Leo Heiland Intel Corporation Do Kyun Kim LG electronics
Maarit Harkonen Intel Corporation Won-Jong Choi LG electronics
Nge Chee Lim Intel Corporation Won-Jong Choi LG Electronics Ltd.
Paul Durley Intel Corporation Aaron Melgar Lion Semiconductor
Rahman Ismail Intel Corporation Chris Zhou Lion Semiconductor
Rajaram Regupathy Intel Corporation Sehyung Jeon Lion Semiconductor
Ronald Swartz Intel Corporation Wonyoung Kim Lion Semiconductor
Sarah Sharp Intel Corporation Yongho Kim Lion Semiconductor
Scott Brenden Intel Corporation Dave Thompson LSI Corporation
Sridharan Ranganathan Intel Corporation Alan Kinningham Luxshare-ICT
Steve McGowan Intel Corporation Alan Liu Luxshare-ICT
Tim McKee Intel Corporation Daniel Chen Luxshare-ICT
Eric Wen Luxshare-ICT
Toby Opferman Intel Corporation
Uma Medepalli Intel Corporation James Kirk Luxshare-ICT
Venkataramani Intel Corporation James Stevens Luxshare-ICT
Gopalakrishnan
Josue Castillo Luxshare-ICT
Ziv Kabiry Intel Corporation
Pat Young Luxshare-ICT
Jia Wei Intersil Corporation
Scott Shuey Luxshare-ICT
Weijie Huang iST - Integrated Service Technology Inc.
Stone Lin Luxshare-ICT
Al Hsiao ITE Tech. Inc.
Chikara Kakizawa Maxim Integrated Products
Greg Song ITE Tech. Inc.
Jacob Scott Maxim Integrated Products
Richard Guo ITE Tech. Inc.
Ken Helfrich Maxim Integrated Products
Victor Lin ITE Tech. Inc.
Michael Miskho Maxim Integrated Products
Y.C. Chou ITE Tech. Inc.
Chris Yokum MCCI Corporation
Kenta Minejima Japan Aviation Electronics Industry Ltd.
Geert Knapen MCCI Corporation
Mark Saubert Japan Aviation Electronics Industry Ltd.
Terry Moore MCCI Corporation
Toshio Shimoyama Japan Aviation Electronics Industry Ltd.
Velmurugan Selvaraj MCCI Corporation
Brian Fetz Keysight Technologies Inc.
Tung-Sheng Lin
MediaTek Inc.
Jit Lim Keysight Technologies Inc.
Tung-Sheng Lin MediaTek Inc.
Koji Asakawa Kinetic Technologies Inc.
USB Power Delivery Specification Revision 3.2, Version 1.0, 2023-10 Page 9
– 10 – IEC 62680-1-2:2024
© USB-IF 2023
Satoru Kumashiro MegaChips Corporation Ben Crowe MQP Electronics Ltd.
Brian Marley Microchip Technology Inc. Pat Crowe MQP Electronics Ltd.
Dave Perchlik Microchip Technology Inc. Sten Carlsen MQP Electronics Ltd.
Don Perkins Microchip Technology Inc. Kenji Oguma NEC Corporation
Fernando Gonzalez Microchip Technology Inc. ChinJui Lin Nexperia B.V.
John Sisto Microchip Technology Inc. Max Guan Nexperia B.V.
Josh Averyt Microchip Technology Inc. Frank Borngräber Nokia Corporation
Kiet Tran Microchip Technology Inc. Kai Inha Nokia Corporation
Mark Bohm Microchip Technology Inc. Pekka Leinonen Nokia Corporation
Matthew Kalibat Microchip Technology Inc. Richard Petrie Nokia Corporation
Mick Davis Microchip Technology Inc. Sten Carlsen Nokia Corporation
Prasanna Vengateshan Microchip Technology Inc. Abhijeet Kulkarni NXP Semiconductors
Rich Wahler Microchip Technology Inc. Ahmad Yazdi NXP Semiconductors
Bart Vertenten NXP Semiconductors
Richard Petrie Microchip Technology Inc.
Ronald Kunin Microchip Technology Inc. Dennis Ha NXP Semiconductors
Shannon Cash Microchip Technology Inc. Dong Nguyen NXP Semiconductors
Thomas Farkas Microchip Technology Inc. Guru Prasad NXP Semiconductors
Venkataraman Microchip Technology Inc. Ken Jaramillo NXP Semiconductors
Andrew Yang Microsoft Corporation Krishnan TN NXP Semiconductors
Anthony Chen Microsoft Corporation Michael Joehren NXP Semiconductors
Arvind Murching Microsoft Corporation Robert de Nie NXP Semiconductors
Dave Perchlik Microsoft Corporation Rod Whitby NXP Semiconductors
David Voth Microsoft Corporation Vijendra Kuroodi NXP Semiconductors
Geoff Shew Microsoft Corporation Winston Langeslag NXP Semiconductors
Jayson Kastens Microsoft Corporation Robert Heaton Obsidian Technology
Kai Inha Microsoft Corporation Andrew Yoo ON Semiconductor
Marwan Kadado Microsoft Corporation Brady Maasen ON Semiconductor
Michelle Bergeron Microsoft Corporation Bryan McCoy ON Semiconductor
Nathan Sherman Microsoft Corporation Christian Klein ON Semiconductor
Rahul Ramadas Microsoft Corporation Cor Voorwinden ON Semiconductor
Randy Aull Microsoft Corporation Edward Berrios ON Semiconductor
Shiu Ng Microsoft Corporation Michael Smith ON Semiconductor
Tieyong Yin Microsoft Corporation Oscar Freitas ON Semiconductor
Timo Toivola Microsoft Corporation Tom Duffy ON Semiconductor
Toby Nixon Microsoft Corporation Brian Collins Parade Technologies Inc.
Vahid Vassey Microsoft Corporation Craig Wiley Parade Technologies Inc.
Vivek Gupta Microsoft Corporation Hung-Chih Chiu Power Forest Technology Corporation
Yang You Microsoft Corporation Jay Tu Power Forest Technology Corporation
Adib Al Abaji Molex LLC Adel Lahham Power Integrations
Aaron Xu Monolithic Power Systems Inc. Aditya Kulkarni Power Integrations
Bo Zhou Monolithic Power Systems Inc. Akshay Nayaknur Power Integrations
Christian Sporck Monolithic Power Systems Inc. Amruta Patra Power Integrations
Di Han Monolithic Power Systems Inc. K R Rahul Raj Power Integrations
Zhihong Yu Monolithic Power Systems Inc. Kaushik Raam Power Integrations
Dan Wagner Motorola Mobility Inc. Rahul Joshi Power Integrations
Page 10 USB Power Delivery Speci�ication Revision 3.2, Version 1.0, 2023-10
IEC 62680-1-2:2024 – 11 –
© USB-IF 2023
Ricardo Pregiteer Power Integrations Hidenori Nishimoto Rohm Co. Ltd.
Shruti Anand Power Integrations Kris Bahar Rohm Co. Ltd.
Amit gupta Qualcomm, Inc Manabu Miyata Rohm Co. Ltd.
George Paparrizos Qualcomm, Inc Ruben Balbuena Rohm Co. Ltd.
Giovanni Garcea Qualcomm, Inc Takashi Sato Rohm Co. Ltd.
Jack Pham Qualcomm, Inc Vijendra Kuroodi Rohm Co. Ltd.
James Goel Qualcomm, Inc Yusuke Kondo Rohm Co. Ltd.
Joshua Warner Qualcomm, Inc Kazuomi Nagai ROHM Co., Ltd.
Karyn Vuong Qualcomm, Inc Matti Kulmala Salcomp Plc
Lalan Mishra Qualcomm, Inc Toni Lehimo Salcomp Plc
Nicholas Cadieux Qualcomm, Inc Edward Lee Samsung Electronics Co. Ltd.
Vamsi Samavedam Qualcomm, Inc Tong Kim Samsung Electronics Co. Ltd.
Vatsal Patel Qualcomm, Inc Amit Bouzaglo Scosche Industries
Chris Sporck Qualcomm, Inc. Alvin Cox Seagate Technology LLC
Craig Aiken Qualcomm, Inc. Emmanuel Lemay Seagate Technology LLC
Narendra Mehta Qualcomm, Inc. John Hein Seagate Technology LLC
Terry Remple Qualcomm, Inc. Marc Noblitt Seagate Technology LLC
Will Kun Qualcomm, Inc. Michael Morgan Seagate Technology LLC
Yoram Rimoni Qualcomm, Inc. Ronald Rueckert Seagate Technology LLC
Fan-Hau Hsu Realtek Semiconductor Corp. Tony Priborsky Seagate Technology LLC
Tsung-Peng Chuang Realtek Semiconductor Corp. Chin Chang Semtech Corporation
Atsushi Mitamura Renesas Electronics Corp. Tom Farkas Semtech Corporation
Bob Dunstan Renesas Electronics Corp. Ankit Garg Siemens Industry Software Inc.
Brian Allen Renesas Electronics Corp. Ning Dai Silergy Corp.
Dan Aoki Renesas Electronics Corp. Wanfeng Zhang Silergy Corp.
Fengshuan Zhou Renesas Electronics Corp. Kafai Leung Silicon Laboratories, Inc.
Hajime Nozaki Renesas Electronics Corp. Kok Hong Soh Silicon Laboratories, Inc.
John Carpenter Renesas Electronics Corp. Sorin Badiu Silicon Laboratories, Inc.
Kiichi Muto Renesas Electronics Corp. Steven Ghang Silicon Laboratories, Inc.
Masami Katagiri Renesas Electronics Corp. Abhishek Sardeshpande SiliConch Systems Private Limited
Nobuo Furuya Renesas Electronics Corp. Aniket Mathad SiliConch Systems Private Limited
Patrick Yu Renesas Electronics Corp. Chandana N SiliConch Systems Private Limited
Peter Teng Renesas Electronics Corp. Jaswanth Ammineni SiliConch Systems Private Limited
Philip Leung Renesas Electronics Corp. Jinisha Patel SiliConch Systems Private Limited
Steve Roux Renesas Electronics Corp. Kaustubh Kumar SiliConch Systems Private Limited
Tetsu Sato Renesas Electronics Corp. Nitish SiliConch Systems Private Limited
Toshifumi Yamaoka Renesas Electronics Corp. Pavitra Balasubramanian SiliConch Systems Private Limited
Yimin Chen Renesas Electronics Corp. Rakesh Polasa SiliConch Systems Private Limited
Chunan Kuo Richtek Technology Corporation Satish Anand Verkila SiliConch Systems Private Limited
Heinz Wei Richtek Technology Corporation Shubham Paliwal SiliConch Systems Private Limited
Max Huang Richtek Technology Corporation Vishnu Pusuluri SiliConch Systems Private Limited
TZUHSIEN CHUANG Richtek Technology Corporation John Sisto SMSC
Tatsuya Irisawa Ricoh Company Ltd. Ken Gay SMSC
Akihiro Ono Rohm Co. Ltd. Mark Bohm SMSC
Chris Lin Rohm Co. Ltd. Richard Wahler SMSC
USB Power Delivery Specification Revision 3.2, Version 1.0, 2023-10 Page 11
– 12 – IEC 62680-1-2:2024
© USB-IF 2023
Shannon Cash SMSC Javed Ahmad Texas Instruments
Tim Knowlton SMSC Jean Picard Texas Instruments
William Chiechi SMSC John Perry Texas Instruments
Shigenori Tagami Sony Corporation Kasthuri Annamalai Texas Instruments
Shinichi Hirata Sony Corporation Martin Patoka Texas Instruments
Amanda Hosler Specwerkz Mike Campbell Texas Instruments
Bob Dunstan Specwerkz Scott Jackson Texas Instruments
Brad Saunders Specwerkz Sha�iuddin Mohammed Texas Instruments
Diane Lenox Specwerkz Srinath Hosur Texas Instruments
Michael Munn StarTech.com Ltd. Steven Tom Texas Instruments
Fabien Friess ST-Ericsson Yoon Lee Texas Instruments
Giuseppe Platania ST-Ericsson Tim Wilhelm The Silanna Group Pty. Ltd.
Jean-Francois Gatto ST-Ericsson Tod Wolf The Silanna Group Pty. Ltd.
Milan Stamenkovic ST-Ericsson Chris Yokum Total Phase
Nicolas Florenchie ST-Ericsson Dylan Su UL LLC
Patrizia Milazzo ST-Ericsson Eric Wall UL LLC
Christophe Cochard STMicroelectronics Jason Smith UL LLC
Christophe Lorin STMicroelectronics Terry Kao UL LLC
Filippo Bonaccorso STMicroelectronics Steven Chen Unigraf OY
Jessy Guilbot STMicroelectronics Topi Lampiranta Unigraf OY
Joel Huloux STMicroelectronics Brad Cox Ventev Mobile
John Bloom�ield STMicroelectronics Colin Vose Ventev Mobile
Massimo Panzica STMicroelectronics Dydron Lin VIA Technologies, Inc.
Meriem Mersel STMicroelectronics Fong-Jim Wang VIA Technologies, Inc.
Nathalie Ballot STMicroelectronics Jay Tseng VIA Technologies, Inc.
Pascal Legrand STMicroelectronics Rex Chang VIA Technologies, Inc.
Patrizia Milazzo STMicroelectronics Terrance Shih VIA Technologies, Inc.
Richard O’Connor STMicroelectronics Ho Wen Tsai Weltrend Semiconductor
Morten Christiansen Synopsys, Inc. Hung Chiang Weltrend Semiconductor
Nivin George Synopsys, Inc. Jeng Cheng Liu Weltrend Semiconductor
Prishkit Abrol Synopsys, Inc. Priscilla Lee Weltrend Semiconductor
Zongyao Wen Synopsys, Inc. Wayne Lo Weltrend Semiconductor
Joan Marrinan Tektronix Charles Neumann Western Digital Technologies, Inc.
Kimberley McKay Teledyne-LeCroy Curtis Stevens Western Digital Technologies, Inc.
Matthew Dunn Teledyne-LeCroy John Maroney Western Digital Technologies, Inc.
Tony Minchell Teledyne-LeCroy Joe O'Brien Wilder Technologies
Anand Dabak Texas Instruments Will Miller Wilder Technologies
Annamalai Kasthuri Texas Instruments Juejia Zhou Xiaomi Communications Co., Ltd.
Bill Waters Texas Instruments Xiaoxing Yang Xiaomi Communications Co., Ltd.
Bing Lu Texas Instruments Liu Qiong Zhuhai Smartware Technology Co., Ltd.
Deric Waters Texas Instruments Long Zhang Zhuhai Smartware Technology Co., Ltd.
Grant Ley Texas Instruments Yuanchao Liang Zhuhai Smartware Technology Co., Ltd.
Gregory Watkins Texas Instruments
Ingolf Frank Texas Instruments
Ivo Huber Texas Instruments
Page 12 USB Power Delivery Speci�ication Revision 3.2, Version 1.0, 2023-10
IEC 62680-1-2:2024 – 13 –
© USB-IF 2023
Revision History
Revision Version Comments Issue Date
1.0 1.0 Initial release Revision 1.0 5 July, 2012
1.0 1.1 Including errata through 31-October-2012 31 October 2012
1.0 1.2 Including errata through 26-June-2013 26 June, 2013
1.0 1.3 Including errata through 11-March-2014 11 March 2014
2.0 1.0 Initial release Revision 2.0 11 August 2014
2.0 1.1 Including errata through 7-May 2015 7 May 2015
2.0 1.2 Including errata through 25-March-2016 25 March 2016
2.0 1.3 Including errata through 11-January-2017 11 January 2017
3.0 1.0 Initial release Revision 3.0 11 December 2015
3.0 1.0a Including errata through 25-March-2016 25 March 2016
3.0 1.1 Including errata through 12-January-2017 12 January 2017
3.0 1.2 Including errata through 21-June-2018 21 June 2018
3.0 2.0 Including errata through 29-August-2019 29 August 2019
3.1 1.0 Including errata through May 2021 May 2021
3.1 1.1 Including errata through July 2021 July 2021
This version incorporates the following ECNs:
• EPR Clari�ications
• De�ine AMS starting point
3.1 1.2 Including errata through October 2021 October 2021
This version incorporates the following ECNs:
• Clarify use of Retries
• Battery Capabilities
• FRS timing problem
• PPS power rule clari�ications
• Peak current support for EPR AVS APDO
3.1 1.3 This version incorporates the following ECNs: January 2022
• Robust EPR Source Operation
• EPR Source Caps Editorial
• SRC PPS behavior in low current request
• Enter USB
USB Power Delivery Specification Revision 3.2, Version 1.0, 2023-10 Page 13
– 14 – IEC 62680-1-2:2024
© USB-IF 2023
3.1 1.4 Editorial changes April 2022
This version incorporates the following ECNs:
• Capabilities Mismatch Update
• Chunking Timing Issue
• OT Mitigation
3.1 1.5 Editorial changes July 2022
This version incorporates the following ECNs:
• Timer Description Corrections
• Change Source_Info Requirements
• AMS Update
3.1 1.6 Editorial changes October 2022
This version incorporates the following ECNs:
• USB4® V2 Updates
• Data Reset Issues
• Increase tSenderResponse
• PPS Power Limit Bit Update
• Support for Asymmetric Mode
• Timer Description Corrections Revisited
3.1 1.7 Editorial Changes January 2023
This version incorporates the following ECNs:
• Data Reset Invalid Reject Handling
• Source request
• Source Transition
• EPR Entry
3.1 1.8 Editorial Changes April 2023
This version incorporates the following ECNs:
• Slew rate exemption for Power Role Swap.
• EUDO cable speed clari�ication.
• Update to PPS Requirements.
• Deprecate Interruptibility.
• Section 7.3 restructure and update.
Page 14 USB Power Delivery Speci�ication Revision 3.2, Version 1.0, 2023-10
IEC 62680-1-2:2024 – 15 –
© USB-IF 2023
October 2023
����
3.2 1.0 Editorial Changes
This version incorporates the following ECNs:
• VDM use conditions
• tTypeCSinkWaitCap
• tFirstSourceCap clari�ication
• Hard Reset clari�ication
• Unrecognized Country Code
• EPR Entry Process
• SPR AVS De�inition
• EPR Power Rules Clari�ications
USB Power Delivery Specification Revision 3.2, Version 1.0, 2023-10 Page 15
– 16 – IEC 62680-1-2:2024
© USB-IF 2023
Table of Contents
Contents
Universal Serial Bus . 2
Power Delivery Specification . 4
LIMITED COPYRIGHT LICENSE . 5
INTELLECTUAL PROPERTY DISCLAIMER . 5
Editors . 6
Contributors . 6
Revision History . 13
Table of Contents . 16
List of Tables . 23
List of Figures . 30
1. Introduction . 38
1.1 Overview . 38
1.2 Purpose . 39
1.2.1 Scope . 40
1.3 Section Overview . 40
1.4 Conventions . 41
1.4.1 Precedence . 41
1.4.2 Keywords . 41
1.4.3 Numbering . 42
1.5 Related Documents. 43
1.6 Terms and Abbreviations . 45
1.7 Parameter Values. 55
1.8 Changes from Revision 3.0 . 55
1.9 Compatibility with Revision 2.0 . 55
2. Overview . 56
2.1 Introduction . 56
2.1.1 Power Delivery Source Operational Contracts . 56
2.1.2 Power Delivery Contracts . 56
2.1.3 Other Uses for Power Delivery .
...
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