Semiconductor devices - Mechanical and climatic test methods

EN following parallel vote * Superseded by EN 60749 series

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren

Dispositifs à semiconducteurs - Essais mécaniques et climatiques

Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996)

General Information

Status
Withdrawn
Publication Date
16-Nov-2000
Withdrawal Date
31-Aug-2003
Drafting Committee
Parallel Committee
Current Stage
9960 - Withdrawal effective - Withdrawal
Completion Date
01-Jan-2008

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Standard
EN 60749:2002 + A1:2002
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Standards Content (Sample)


2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Semiconductor devices - Mechanical and climatic test methods (IEC 60749:1996)Halbleiterbauelemente - Mechanische und klimatische PrüfverfahrenDispositifs à semiconducteurs - Essais mécaniques et climatiquesSemiconductor devices - Mechanical and climatic test methods31.080.01Polprevodniški elementi (naprave) na splošnoSemiconductor devices in generalICS:Ta slovenski standard je istoveten z:EN 60749:1999/A1:2000SIST EN 60749:2002 + A1:2002en01-september-2002SIST EN 60749:2002 + A1:2002SLOVENSKI
STANDARD
SIST EN 60749:2002 + A1:2
...

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