IEC 61191-4:2017

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

IEC 61191-4:2017 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
This edition includes the following significant technical changes with respect to the previous edition:
The requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F.

Ensembles de cartes imprimées – Partie 4: Spécification intermédiaire – Exigences relatives à l’assemblage de bornes par brasage

L’IEC 61191-4:2017 donne des exigences relatives à l'assemblage de bornes par brasage. Les exigences de la présente spécification s'appliquent aux ensembles entièrement constitués d'après des structures d'interconnexion borne/fil et aux portions borne/fil de ces ensembles incluant d'autres techniques associées (par exemple montage en surface, montage par trous traversants, montage à puce).
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
Mise à jour des exigences pour satisfaire aux critères d’acceptation décrits dans l’IPC‑A‑610F.

General Information

• Status: Published
• Publication Date: 25-Jul-2017
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 2 - TC 91/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 29-Aug-2017
• Completion Date: 26-Jul-2017

Relations

• Revises: IEC 61191-4:1998 - Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 61191-4 ®
Edition 2.0 2017-07
INTERNATIONAL
STANDARD
Printed board assemblies –
Part 4: Sectional specification – Requirements for terminal soldered assemblies
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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International Standards for all electrical, electronic and related technologies.

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IEC 61191-4 ®
Edition 2.0 2017-07
INTERNATIONAL
STANDARD
Printed board assemblies –
Part 4: Sectional specification – Requirements for terminal soldered assemblies

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.240 ISBN 978-2-8322-4657-3

– 2 – IEC 61191-4:2017 © IEC 2017

CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General requirements . 6
5 General terminal and part mounting requirements. 6
5.1 General . 6
5.2 Wire and cable preparation . 7
5.2.1 General . 7
5.2.2 Tinning of stranded wire . 7
5.3 Terminal installation . 7
5.3.1 General . 7
5.3.2 Terminal mounting (mechanical) . 7
5.3.3 Terminal shank discontinuities . 8
5.3.4 Flange discontinuities . 8
5.3.5 Terminal mounting (electrical) . 8
5.3.6 Flange angles . 9
5.3.7 Shank discontinuities . 9
5.3.8 Flared flange discontinuities . 9
5.4 Mounting to terminals . 10
5.4.1 General . 10
5.4.2 Wire and lead wrap-around . 10
5.4.3 Side route connection . 10
5.4.4 Top and bottom route connection . 11
5.4.5 Continuous runs . 12
5.4.6 Service loops . 13
5.4.7 Insulation clearance . 13
5.4.8 Orientation of wire wrap . 14
5.4.9 Stress relief . 14
5.4.10 Pierced or perforated terminals . 14
5.4.11 Cup and hollow cylindrical terminal soldering . 15
6 Acceptance requirements . 16
6.1 General . 16
6.2 Control and corrective actions . 16
6.3 Terminal soldering . 16
6.3.1 General . 16
6.3.2 Wire-terminal attachment . 16
6.4 Part marking and reference designations . 16
7 Rework of unsatisfactory soldered connections. 16
Bibliography . 18

Figure 1 – Rolled flange terminal . 8
Figure 2 – Rolled flange discontinuities . 8
Figure 3 – Flared flange terminals. 9
Figure 4 – Flared angles . 9

Figure 5 – Wire and lead wrap around . 10
Figure 6 – Side route connections and wrap on bifurcated terminal . 11
Figure 7 – Top and bottom route terminal connection . 12
Figure 8 – Continuous run wire wraps . 13
Figure 9 – Service loop for lead wiring . 13
Figure 10 – Insulation clearance measurement (c) . 14
Figure 11 – Stress relief examples . 14
Figure 12 – Pierced or perforated terminal wire wrap . 15

Table 1 – Nicked or broken strand limits . 7
Table 2 – Plated through-holes with terminals, minimum acceptance conditions . 16
Table 3 – Defects for terminal attachment and soldering defects . 17

– 4 – IEC 61191-4:2017 © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARD ASSEMBLIES –
Part 4: Sectional specification –
Requirements for terminal soldered assemblies

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
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International Standard IEC 61191-4 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition published in 1998. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
• The requirements have been updated to be compliant with the acceptance criteria in
IPC-A-610F.
The text of this International Standard is based on the following documents:
CDV Report on voting
91/1399/CDV 91/1434/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61191 series, published under the general title Printed board
assemblies, can be found on the IEC website.
The com
...

IEC 61191-4 ®
Edition 2.0 2017-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 4: Sectional specification – Requirements for terminal soldered assemblies

Ensembles de cartes imprimées –
Partie 4: Spécification intermédiaire – Exigences relatives à l’assemblage de
bornes par brasage
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
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IEC 61191-4 ®
Edition 2.0 2017-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 4: Sectional specification – Requirements for terminal soldered assemblies

Ensembles de cartes imprimées –

Partie 4: Spécification intermédiaire – Exigences relatives à l’assemblage de

bornes par brasage
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.240 ISBN 978-2-8322-1099-6

– 2 – IEC 61191-4:2017 © IEC 2017
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General requirements . 6
5 General terminal and part mounting requirements. 6
5.1 General . 6
5.2 Wire and cable preparation . 7
5.2.1 General . 7
5.2.2 Tinning of stranded wire . 7
5.3 Terminal installation . 7
5.3.1 General . 7
5.3.2 Terminal mounting (mechanical) . 7
5.3.3 Terminal shank discontinuities . 8
5.3.4 Flange discontinuities . 8
5.3.5 Terminal mounting (electrical) . 8
5.3.6 Flange angles . 9
5.3.7 Shank discontinuities . 9
5.3.8 Flared flange discontinuities . 9
5.4 Mounting to terminals . 10
5.4.1 General . 10
5.4.2 Wire and lead wrap-around . 10
5.4.3 Side route connection . 10
5.4.4 Top and bottom route connection . 11
5.4.5 Continuous runs . 12
5.4.6 Service loops . 13
5.4.7 Insulation clearance . 13
5.4.8 Orientation of wire wrap . 14
5.4.9 Stress relief . 14
5.4.10 Pierced or perforated terminals . 14
5.4.11 Cup and hollow cylindrical terminal soldering . 15
6 Acceptance requirements . 16
6.1 General . 16
6.2 Control and corrective actions . 16
6.3 Terminal soldering . 16
6.3.1 General . 16
6.3.2 Wire-terminal attachment . 16
6.4 Part marking and reference designations . 16
7 Rework of unsatisfactory soldered connections. 16
Bibliography . 18

Figure 1 – Rolled flange terminal . 8
Figure 2 – Rolled flange discontinuities . 8
Figure 3 – Flared flange terminals. 9
Figure 4 – Flared angles . 9

Figure 5 – Wire and lead wrap around . 10
Figure 6 – Side route connections and wrap on bifurcated terminal . 11
Figure 7 – Top and bottom route terminal connection . 12
Figure 8 – Continuous run wire wraps . 13
Figure 9 – Service loop for lead wiring . 13
Figure 10 – Insulation clearance measurement (c) . 14
Figure 11 – Stress relief examples . 14
Figure 12 – Pierced or perforated terminal wire wrap . 15

Table 1 – Nicked or broken strand limits . 7
Table 2 – Plated through-holes with terminals, minimum acceptance conditions . 16
Table 3 – Defects for terminal attachment and soldering defects . 17

– 4 – IEC 61191-4:2017 © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARD ASSEMBLIES –
Part 4: Sectional specification –
Requirements for terminal soldered assemblies

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
tran
...