Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators

IEC 62047-32:2019 specifies the test method and test condition for the nonlinear vibration of MEMS resonators. The statements made in this document apply to the development and manufacture for MEMS resonators.

Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 32: Méthode d’essai pour la vibration non linéaire des résonateurs MEMS

L’IEC 62047-32:2019 spécifie la méthode d’essai et les conditions d’essai pour la vibration non linéaire des résonateurs MEMS. Les énoncés du présent document s’appliquent au développement et à la fabrication des résonateurs MEMS.

General Information

Status
Published
Publication Date
23-Jan-2019
Current Stage
PPUB - Publication issued
Start Date
08-Feb-2019
Completion Date
24-Jan-2019
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IEC 62047-32:2019 - Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
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IEC 62047-32 ®
Edition 1.0 2019-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 32: Test method for the nonlinear vibration of MEMS resonators

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 32: Méthode d’essai pour la vibration non linéaire des résonateurs MEMS

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IEC 62047-32 ®
Edition 1.0 2019-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –

Part 32: Test method for the nonlinear vibration of MEMS resonators

Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –

Partie 32: Méthode d’essai pour la vibration non linéaire des résonateurs MEMS

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-6455-3

– 2 – IEC 62047-32:2019 © IEC 2019
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test parameters of nonlinear vibration of the resonators . 5
5 Test method for the amplitude-frequency response and phase-frequency response
of the nonlinear vibration . 6
5.1 Test system . 6
5.2 Test conditions . 6
5.3 Test procedures . 7
6 Test method for the bending factor of the nonlinear vibrating frequency response . 7
7 Test method for the amplitude threshold for the nonlinear jump . 7
8 Test method for the frequency deviation as a result of the nonlinear vibration . 8
8.1 Frequency deviation of the self-excitation closed-loop system. 8
8.2 Frequency deviation of the phase-locked closed-loop system . 8
8.3 Frequency deviation of the burst-excited system . 9
Annex A (normative)  Model of nonlinear vibration of MEMS resonators and bending
factor . 10
A.1 Model of nonlinear vibration of MEMS resonators . 10
A.2 Solution of the nonlinear vibration model . 11
A.3 Bending factor of the amplitude-frequency response . 11
Annex B (informative) Nonlinear jump of the frequency response of MEMS resonators . 14
Annex C (normative) Frequency deviation of MEMS resonators in the closed-loop
system . 16
C.1 Effect of the frequency deviation of the MEMS resonator on the accuracy of
the resonant sensor . 16
C.2 Frequency deviation of the self-exciting closed-loop system . 16
C.3 Frequency deviation of the phase-locked closed-loop system . 16
C.4 Oscillation frequency deviation of the burst-excited closed-loop system . 18

Figure 1 – Test system . 6
Figure 2 – 3 dB bandwidth of the linear amplitude-frequency response . 8
Figure A.1 – Typical amplitude-frequency response of the nonlinear vibration of the
MEMS resonator . 12
Figure A.2 – Change of the amplitude-frequency response with the bending factor . 13
Figure B.1 – Jump phenomenon of the frequency response of a clamped-clamped
MEMS bridge resonator . 14
Figure B.2 – Three nonlinear amplitude-frequency responses with various amplitude level . 15

INTERNATIONAL ELECTROTECHNICAL COMMISSION
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SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 32: Test method for the nonlinear vibration of MEMS resonators

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International Standard IEC 62047-32 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47F/322/FDIS 47F/325/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – IEC 62047-32:2019 © IEC 2019
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
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