IEC 60317-2:2012

Specifications for particular types of winding wires - Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer

IEC 60317-2:2012 specifies the requirements of solderable enamelled round copper winding wire of class 130 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. This edition includes the following significant technical changes with respect to the previous edition:
- addition of requirements for appearance, new subclause 3.3 and
- addition of pin hole test requirements, Clause 23: Pin hole test. Keywords: copper winding wire
This publication is to be read in conjunction with IEC 60317-0-1:2008.

Spécifications pour types particuliers de fils de bobinage - Partie 2: Fil de section circulaire en cuivre émaillé avec polyuréthane brasable, classe 130, avec une couche adhérente

La CEI 60317-2:2012 spécifie les exigences relatives au fil de bobinage en cuivre émaillé brasable de classe 130 disposant d'un double revêtement. La sous-couche est à base de résine polyuréthane, qui peut être modifiée; elle doit, dans ce cas, conserver l'identité chimique de la résine initiale et répondre à toutes les exigences du fil indiquées. La surcouche est une couche adhérente à base de résine thermoplastique. Une résine modifiée est une résine qui a subi une modification chimique, ou qui contient un ou plusieurs additifs pour améliorer certaines performances ou les caractéristiques d'utilisation. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- ajout d'exigences sur l'aspect, paragraphe 3.3 et
- ajout d'exigences sur la détection des microfissures, Article 23: Détection des microfissures. Mots clé: fil de bobinage en cuivre
Cette publication doit être lue conjointement avec la CEI 60317-0-1:2008.

General Information

• Status: Published
• Publication Date: 11-Jul-2012
• ICS: 29.060.10 - Wires
• ICS: 33.160.40 - Video systems
• Technical Committee: TC 55 - Winding wires
• Drafting Committee: WG 1 - TC 55/WG 1
• Current Stage: DELPUB - Deleted Publication
• Start Date: 10-Nov-2017
• Completion Date: 08-Aug-2019

Relations

• Revised: IEC 60317-2:2019 - Specifications for particular types of winding wires - Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60317-2


®


Edition 4.0 2012-07



INTERNATIONAL



STANDARD



NORME
INTERNATIONALE


Specifications for particular types of winding wires –
Part 2: Solderable polyurethane enamelled round copper wire, class 130,
with a bonding layer

Spécifications pour types particuliers de fils de bobinage –
Partie 2: Fil de section circulaire en cuivre émaillé avec polyuréthane brasable,
classe 130, avec une couche adhérente


IEC 60317-2:2012

---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 60317-2



®



Edition 4.0 2012-07







INTERNATIONAL





STANDARD







NORME



INTERNATIONALE











Specifications for particular types of winding wires –

Part 2: Solderable polyurethane enamelled round copper wire, class 130,

with a bonding layer




Spécifications pour types particuliers de fils de bobinage –

Partie 2: Fil de section circulaire en cuivre émaillé avec polyuréthane brasable,


classe 130, avec une couche adhérente














INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX M


ICS 29.060.10 ISBN 978-2-83220-186-2



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 3 ----------------------
– 2 – 60317-2  IEC:2012



CONTENTS


FOREWORD . 3

INTRODUCTION . 5

1 Scope . 6

2 Normative references . 6

3 Terms, definitions, general notes and appearance . 6


3.1 Terms and definitions . 6

3.2 General notes . 6
3.2.1 Methods of test . 6
3.2.2 Winding wire . 6
3.3 Appearance . 7
4 Dimensions . 7
5 Electrical resistance . 7
6 Elongation . 7
7 Springiness . 7
8 Flexibility and adherence . 7
9 Heat shock . 7
10 Cut-through . 7
11 Resistance to abrasion (nominal conductor diameters from 0,250 mm up to and
including 2,000 mm) . 7
12 Resistance to solvents . 8
13 Breakdown voltage . 8
14 Continuity of insulation . 8
15 Temperature index . 8
16 Resistance to refrigerant . 8
17 Solderability . 8
17.1 Nominal conductor diameters up to and including 0,050 mm. 8
17.2 Nominal conductor diameters over 0,050 mm up to and including 0,100 mm . 9
17.3 Nominal conductor diameter over 0,100 mm . 9
18 Heat or solvent bonding . 9
18.1 Heat bonding . 9

18.1.1 Heat bonding strength of a helical coil . 9
18.1.2 Bond strength of a twisted coil . 10
18.2 Solvent bonding . 10
19 Dielectric dissipation factor . 10
20 Resistance to transformer oil . 11
21 Loss of mass . 11
23 Pin hole test . 11
30 Packaging . 11
Bibliography . 12

Table 1 – Resistance to abrasion . 8
Table 2 – Loads . 10

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60317-2  IEC:2012 – 3 –


INTERNATIONAL ELECTROTECHNICAL COMMISSION

______________



SPECIFICATIONS FOR PARTICULAR

TYPES OF WINDING WIRES –



Part 2: Solderable polyurethane enamelled round copper wire,

class 130, with a bonding layer





FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard 60317-2 has been prepared by IEC technical committee 55: Winding
wires.
This fourth edition cancels and replaces the third edition, published in 1990, amendment
1:1997 and amendment 2:1999. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
– addition of requirements for appearance, new subclause 3.3;
– addition of pin hole test requirements, Clause 23: Pin hole test.

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– 4 – 60317-2  IEC:2012


The text of this standard is based on the following documents:

FDIS Report on voting


55/1325/FDIS 55/1338/RVD



Full information on the voting for the approval of this standard can be found in the report on

voting indicated in the above table.


This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.


This International Standard is to be read in conjunction with the IEC 60317-0-1:2008.
The numbering of clauses in this standard is not continuous from Clauses 23 and 30 in order
to reserve space for possible future wire requirements prior to those for wire packaging.
A list of all the parts in the IEC 60317 series, published under the general title Specifications
for particular types of winding wires can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

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60317-2  IEC:2012 – 5 –


INTRODUCTION


This part of IEC 60317 is one of a series which deals with insulated wires used for windings in

electrical equipment. The series has three groups describing:


1) Winding wires – Test methods (IEC 60851);

2) Specifications for particular types of winding wires (IEC 60317);


3) Packaging of winding wires (IEC 60264).

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– 6 – 60317-2  IEC:2012


SPECIFICATIONS FOR PARTICULAR

TYPES OF WINDING WIRES –



Part 2: Solderable polyurethane enamelled round copper wire,

class 130, with a bonding layer








1 Scope

This part of IEC 60317 specifies the requirements of solderable enamelled round copper
winding wire of class 130 with a dual coating. The underlying coating is based on
polyurethane resin, which may be modified providing it retains the chemical identity of the
original resin and meets all specified wire requirements. The superimposed coating is a
bonding layer based on a thermoplastic resin.
NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to
enhance certain performance or application characteristics.
The range of nominal conductor diameters covered by this standard is:
– Grade 1B: 0,020 mm up to and including 2,000 mm;
– Grade 2B: 0,020 mm up to and including 2,000 mm.
The nominal conductor diameters are specified in Clause 4 of IEC 60317-0-1:2008.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60317-0-1:2008, Specifications for particular types of winding wires – Part 0-1: General
requirements – Enamelled round copper wire
3 Terms, definitions, general notes and appearance
3.1 Terms and definitions

For the purposes of this document, the terms and definitions given in 3.1 of IEC 60317-0-
1:2008 apply.
3.2 General notes
3.2.1 Methods of test
Subclause 3.2 of IEC 60317-0-1:2008 applies.
In case of inconsistencies between IEC 60317-0-1 and this standard, IEC 60317-2 shall
prevail.
3.2.2 Winding wire
Class 130 is a thermal class that requires a minimum temperature index of 130 and a heat
shock temperature of at least 155 °C.

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60317-2  IEC:2012 – 7 –


The temperature in degrees Celsius corresponding to the temperature index is not necessarily

that at which it is recommended that the wire be operated and this will depend on many

factors, including the type of equipment involved.


3.3 Appearance


Subclause 3.3 of IEC 60317-0-1:2008 applies.


4 Dimensions


Clause 4 of IEC 60317-0-1:2008 applies.

5 Electrical resistance
Clause 5 of IEC 60317-0-1:2008 applies.
6 Elongation
Clause 6 of IEC 60317-0-1:2008 applies.
7 Springiness
Clause 7 of IEC 60317-0-1:2008 applies.
8 Flexibility and adherence
Clause 8 of IEC 60317-0-1:2008 applies. The constant K used for the calculation of the
number of revolutions for the peel test shall be 150 mm.
9 Heat shock
Clause 9 of IEC 60317-0-1:2008 applies. The minimum heat shock temperature shall be
155 °C.
10 Cut-through

No failure shall occur within 2 min at 170 °C.
11 Resistance to abrasion (nominal conductor diameters from 0,250 mm up to
and including 2,000 mm)
The wire shall meet the requirements given in Table 1.
For intermediate nominal conductor diameters, the value of the next largest nominal
conductor diameter applies.

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– 8 – 60317-2  IEC:2012


Table 1 – Resistance to abrasion


Grade 1 Grade 2

Nominal
Minimum Minimum Minimum Minimum

conductor
average force to average force to

diameter
force failure of each force failure of each
to failure measurement to failure measurement


mm N N N N

0,250 2,30 1,95 4,10 3,50
0,280 2,50 2,10 4,40 3,70
4,00
0,315 2,70 2,30 4,75

0,355 2,90 2,50 5,10 4,30

0,400 3,15 2,70 5,45 4,60
0,450 3,40 2,90 5,80 4,90
0,500 3,65 3,10 6,20 5,25
3,30 6,65 5,60
0,560 3,90
0,630 4,20 3,55 7,10 6,00
0,710 4,50 3,80 7,60 6,45
0,800 4,80 4,10 8,10 6,90
0,900 5,20 4,40 8,70 7,40
1,000 5,60 4,75 9,30 7,90
1,120 6,00 5,15 10,0 8,50
1,250 6,50 5,55 10,7 9,10
1,400 7,00 5,95 11,4 9,70
1,600 7,50 6,35 12,2 10,4
13,1 11,1
1,800 8,00 6,80
2,000 8,60 7,30 14,0 11,9

12 Resistance to solvents
Test inappropriate.
13 Breakdown voltage
Clause 13 of IEC 60317-0-1:2008 applies. The elevated temperature shall be 130 °C.
14 Continuity of insulation
Clause 14 of IEC 60317-0-1:2008 applies.

15 Temperature index
Clause 15 of IEC 60317-0-1:2008 applies. The minimum temperature index shall be 130.
16 Resistance to refrigerant
Test inappropriate.
17 Solderability
17.1 Nominal conductor diameters up to and including 0,050 mm
The temperature of the solder bath shall be (375 ±5) °C. The maximum immersion time shall
be 2 s.

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60317-2  IEC:2012 – 9 –


The surface of the tinned wire shall be smooth and free from holes and enamel residues.


17.2 Nominal conductor diameters over 0,050 mm up to and including 0,100 mm


The temperature of the solder bath shall be (375 ±5) °C. The maximum immersion time shall

be 2 s.


The surface of the tinned wire shall be smooth and free from holes and enamel residues.


17.3 Nominal conductor diameter over 0,100 mm


The temperature of the solder bath shall be (375 ± 5) °C. The maximum immersion (in seconds)
shall be the following multiple of the nominal conductor diameter (in millimetres) with a
minimum of 2 s.
Grade 1B Grade 2B
12 s/mm 16 s/mm

The surface of the tinned wire shall be smooth and free from holes and enamel residues.
18 Heat or solvent bonding
18.1 Heat bonding
18.1.1 Heat bonding strength of a helical coil
18.1.1.1 At room temperature
The specimens shall be prepared according to the test method, and the temperature of the
oven for bonding shall be fixed as agreed between purchaser and supplier for the different
types of bonding enamels. The suggested temperature for polyamide bonding enamel is
(200 ±2) °C and the suggested temperature for polyvinyl butyral bonding enamel is
(170 ±2) °C.
Results: when testing the specimens according to the test method, under the action of load
specified in Table 2, no turns (other than possibly the first and the last) shall be separated.
For nominal conductor diameters up to and including 0,050 mm, the test method and
requirements are based upon agreement between purchaser and supplier.
18.1.1.2 At elevated temperature

The specimens shall be prepared and shall be conditioned as described in the test method.
The elevated temperature shall be fixed as agreed between purchaser and supplier for the
different types of bonding enamels. The suggested temperature for polyamide bonding
enamel is (155 ±2) °C and the suggested temperature for polyvinyl butyral bonding enamel is
(90 ±2) °C.
Results: when testing the specimens according to the test method, under the action of load
specified in Table 2, no turns (other than possibly the first and the last) shall be separated.
For nominal conductor diameters up to and including 0,050 mm, the test method and
requirements are based upon agreement between purchaser and supplier.

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– 10 – 60317-2  IEC:2012


Table 2 – Loads


Nominal conductor diameter

mm Room temperature Elevated temperature

Load Load
Over Up to and including
N N

– 0,050 * *

0,05 0,04
0,050 0,071

0,08 0,06
0,071 0,100
0,12 0,08
0,100 0,160
0,25 0,19

0,160 0,200
0,35 0,25
0,200 0,315
0,70 0,55
0,315 0,400
1,10 0,80
0,400 0,500
1,60 1,20
0,500 0,630
2,20 1,70
0,710
0,630
2,80 2,10
0,710 0,800
3,40 2,60
0,800 0,900
4,20 3,20
0,900 1,000
5,00 3,80
1,000 1,120
5,80 4,40
1,120 1,250
6,50 4,90
1,250 1,400
8,50 6,40
1,400 1,600
10,00 7,90
1,600 1,800
12,00 7,90
1,800 2,000

18.1.2 Bond strength of a twisted coil
18.1.2.1 At room temperature
A test specimen of diameter 0,315 mm shall be prepared according to the test method. The
time shall be 30 s and the current shall be fixed as agreed between purchaser and supplier.
The suggested value for polyamide or polyvinyl butyral bonding enamel is (2,7 ± 0,1) A.
Results: when testing the specimens according to the test method, under the action of the
deflection force of 100 N, the specimen shall not be broken.
18.1.2.2 At elevated temperature
Specimens of diameter 0,315 mm shall be prepared according to the test method using the
parameters listed in 18.1.2.1 and shall then be conditioned as described in the test method.

The elevated temperature shall be fixed as agreed between purchaser and supplier. The
suggested temperature for polyamide bonding enamel is (155 ±2) °C and the suggested
temperature for polyvinyl butyral bonding enamel is (90 ±2) °C.
Results: when testing the specimens according to the test method, under the action of the
deflection force of 10 N, the specimen shall not be broken.
18.2 Solvent bonding
Requirements not yet under consideration.
19 Dielectric dissipation factor
Test inappropriate.

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60317-2  IEC:2012 – 11 –


20 Resistance to transformer oil


Test inappropriate.



21 Loss of mass


Test inappropriate.


23 Pin hole test

Test requirements under consideration.
30 Packaging
Clause 30 of IEC 60317-0-1:2008 applies.

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– 12 – 60317-2  IEC:2012


Bibliography


IEC 60264 (all parts), Packaging of winding wires


IEC 60317 (all parts), Specifications for particular types of winding wires


IEC 60851 (all parts), Winding wires – Test methods





_____________

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– 14 – 60317-2  CEI:2012



SOMMAIRE

AVANT-PROPOS . 15


INTRODUCTION . 17

1 Domaine d’application . 18

2 Références normatives . 18


3 Termes, définitions, notes générales et aspect . 18

3.1 Termes et définitions . 18

3.2 Notes générales . 18

3.2.1 Méthodes d’essai . 18
3.2.2 Fils de bobinage . 19
3.3 Aspect . 19
4 Dimensions . 19
5 Résistance électrique . 19
6 Allongement . 19
7 Effet de ressort . 19
8 Souplesse et adhérence . 19
9 Choc thermique . 19
10 Thermoplasticité . 19
11 Résistance à l'abrasion (diamètres nominaux des conducteurs compris entre 0,250
mm et 2,000 mm) . 19
12 Résistance aux solvants . 20
13 Tension de claquage . 20
14 Continuité de l'isolant . 20
15 Indice de température . 20
16 Résistance aux réfrigérants . 20
17 Brasabilité .
...