SIST EN 16602-60-12:2015

Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs)

This Standard applies to all types of MMIC (monolithic microwave integrated circuit) based on III V compound materials for RF applications (i.e. frequency range ≥ 1 GHz). The requirements for the procurement of components in die form are defined.
It is not within the scope of this Standard to address packaged MMICs and discrete microwave components, these are dealt with in the relevant ESCC specification (ESCC 9010 and ESCC 5010).
This standard may be tailored for the specific characteristic and constraints of a space project in conformance with ECSS-S-ST-00.

Raumfahrtproduktsicherung - Design, Auswahl, Beschaffung und Nutzung von MMIC

Assurance produit des projets spatiaux - Conception, sélection, approvisionnement et utilisation de circuits intégrés monolithique hyperfréquence de forme die

La présente Norme s'applique à tous les types de MMIC (circuit intégré monolithique hyperfréquence) basés sur des matériaux composites de type III V pour les applications RF (par exemple, plage de fréquences ≥ 1 GHz). Elle définit les exigences en matière d'approvisionnement de composants de forme die.
Les MMIC conditionnés en boîtiers et les composants hyperfréquence discrets, qui sont traités dans les spécifications ESCC correspondantes (ESCC 9010 et ESCC 5010) n'entrent pas dans le champ d'application de la présente Norme.
La présente norme peut être adaptée aux caractéristiques et contraintes spécifiques d'un projet spatial conformément à l'ECSS-S-ST-00.

Zagotavljanje varnih proizvodov v vesoljski tehniki - Snovanje, izbiranje, nabava in uporaba monolitnih mikrovalovnih integriranih vezij (MMIC) v obliki čipov

Ta standard se uporablja za vse tipe MMIC (monolitnih mikrovalovnih integriranih vezij) na podlagi sestavljenih materialov III V za radiofrekvenčne uporabe (tj. frekvenčno območje ≥ 1 GHz). Opredeljene so zahteve za naročanje komponent v obliki čipov.  Področje uporabe tega standarda ne zajema pakiranih MMIC in diskretnih mikrovalovnih komponent, ki so obravnavani v ustrezni specifikaciji ESCC (ESCC 9010 in ESCC 5010). Ta standard se lahko prilagodi posameznim lastnostim in omejitvam vesoljskega projekta v skladu s standardom ECSS-S-ST-00.

General Information

• Status: Published
• Publication Date: 01-Dec-2014
• ICS: 31.200 - Integrated circuits. Microelectronics
• ICS: 49.140 - Space systems and operations
• Technical Committee: I13 - Imaginarni 13
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 06-Nov-2014
• Due Date: 11-Jan-2015
• Completion Date: 02-Dec-2014
• Mandate: M/496 - Mandate addressed to CEN, CENELEC and ETSI to develop standardisation regarding space industry (Phase 3 of the process)
• Ref Project: EN 16602-60-12:2014 - Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs)

Standards Content (Sample)

SLOVENSKI STANDARD
01-januar-2015
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Space product assurance - Design, selection, procurement and use of die form
monolithic microwave integrated circuits (MMICs)
Raumfahrtproduktsicherung - Design, Auswahl, Beschaffung und Nutzung von MMIC
Assurance produit des projets spatiaux - Conception, sélection, approvisionnement et
utilisation de circuits intégrés monolithique hyperfréquence de forme die
Ta slovenski standard je istoveten z: EN 16602-60-12:2014
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 16602-60-12
NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2014
ICS 49.140
English version
Space product assurance - Design, selection, procurement and
use of die form monolithic microwave integrated circuits
(MMICs)
Assurance produit des projets spatiaux - Conception, Raumfahrtproduktsicherung - Design, Auswahl,
sélection, approvisionnement et utilisation de circuits Beschaffung und Nutzung von MMIC
intégrés monolithique hyperfréquence de forme die
This European Standard was approved by CEN on 13 March 2014.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.

CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16602-60-12:2014 E
worldwide for CEN national Members and for CENELEC
Members.
Table of contents
Foreword . 6
Introduction . 7
1 Scope . 8
2 Normative references . 9
3 Terms, definitions and abbreviated terms . 10
3.1 Terms from other standards . 10
3.2 Terms specific to the present document . 10
3.3 Abbreviated terms. 12
4 General requirements. 14
4.1 Overview . 14
4.2 Flight model MMIC dies lots procurement . 14
4.3 Minimum quality requirements . 14
5 Selection . 15
5.1 General . 15
5.1.1 Overview . 15
5.1.2 Requirements . 15
5.2 Process selection. 16
5.3 Models, and design tools . 16
6 Responsibilities . 17
7 MMIC design . 18
7.1 Principles of MMIC design . 18
7.1.1 Overview . 18
7.1.2 General . 18
7.1.3 Number of design iterations . 18
7.1.4 Design trade-offs . 19
7.2 Design tasks . 19
7.2.1 Electrical design specification . 19
7.2.2 Design variations . 19
7.2.3 Parasitic effects . 19
7.2.4 Transient simulation . 20
7.2.5 Thermal analysis . 20
7.2.6 Sensitivity to temperature, process variation and supply voltages . 20
7.2.7 Design testability . 21
7.2.8 Design stability analysis . 21
7.2.9 Maximum rating and robustness . 21
7.2.10 Layout optimization . 22
7.2.11 DRC or ERC . 22
7.3 Design reviews . 23
7.3.1 General . 23
7.3.2 MMIC architecture . 23
7.3.3 Schematic . 23
7.3.4 Simulation results . 23
7.3.5 Sensitivity and stability analysis . 24
7.3.6 Derating . 24
7.3.7 Layout . 24
7.3.8 Tests matrix . 24
7.3.9 Assembly . 24
7.3.10 Compliance matrix . 25
7.3.11 MMIC detail specification . 25
7.3.12 Development plan . 25
7.3.13 Design documentation . 25
7.3.14 MMIC summary design sheet . 25
8 Application approval . 26
8.1 General . 26
8.2 Test flow and test procedures . 26
9 Procurement and LAT specification . 28
10 Procurement . 29
10.1 General . 29
10.1.1 Overview . 29
10.1.2 Methodology . 29
10.2 Wafer screening and WAT . 29
10.2.1 General . 29
10.2.2 Wafer screening and WAT flows . 29
10.2.3 Wafer manufacturing and control . 30
10.2.4 Wafer acceptance test . 31
10.2.5 Packaging . 32
10.2.6 Deliverables . 32
10.3 Dies incoming testing . 33
10.3.1 General . 33
10.3.2 Assembly test . 33
10.3.3 Visual inspection . 34
10.3.4 Electrical characterization . 34
10.4 User LAT procurement sequences . 35
10.4.1 General . 35
10.4.2 Sequence A: process, design and application validated . 38
10.4.3 Sequence B: process validated and new design or new application . 38
10.4.4 Sequence C: process, design and application not validated . 39
10.4.5 Sequence D: application approval testing . 40
10.4.6 Destructive physical analysis after user LAT . 40
10.5 Failure criteria and lot failure . 41
Annex A (normative) MMIC electrical design specification - DRD . 42
Annex B (normative) Compliance matrix for custom MMIC design - DRD . 43
Annex C (normative) Design package document - DRD . 44
Annex D (normative) MMIC summary design sheet - DRD . 46
Annex E (normative) MMIC procurement specification - DRD . 47
Annex F (normative) MMIC lot acceptance specification for user LAT -
DRD . 48
Annex G (normative) MMIC visual inspection summary sheet - DRD . 50
Annex H (informative) References . 51
Bibliography . 52

Figures
Figure 10-1: Wafer screening and WAT . 30
Figure 10-2: Dies or die incoming testing . 34
Figure 10-3: Acceptance flow for flight model die lots . 35
Figure 10-4: User LAT flow . 37

Tables
Table 6-1: Customer and supplier responsibilities for the “foundry” and “catalogue”
modes . 17
Table 8-1: CTA tests and procedures for testing in sequence D . 27

Foreword
This document (EN 16602-60-12:2014) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN.
This standard (EN 16602-60-1
...