SIST-TP CLC/TR 62258-8:2008

Semiconductor die products -- Part 8: EXPRESS model schema for data exchange

This part of IEC 62258, which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers. This Technical Report contains an EXPRESS model schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of the IEC 62258-1, IEC 62258-5 and IEC 62258-6 standards, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC 62258-4.

Halbleiter-Chip-Erzeugnisse - Teil 8: EXPRESS-Modell-Schema für den Datenaustausch

Produits à puce de semiconducteur - Partie 8: Schéma du modèle EXPRESS pour l’échange de données

Izdelki s polprevodniškimi čipi - 8. del: Shema modela EXPRESS za izmenjavo podatkov (IEC/TR 62258-8:2008)

General Information

• Status: Published
• Publication Date: 22-Sep-2008
• ICS: 31.080.99 - Other semiconductor devices
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 15-Sep-2008
• Due Date: 20-Nov-2008
• Completion Date: 23-Sep-2008
• Ref Project: CLC/TR 62258-8:2008 - Semiconductor die products - Part 8: EXPRESS model schema for data exchange

Standards Content (Sample)

SLOVENSKI STANDARD
SIST-TP CLC/TR 62258-8:2008
01-november-2008
,]GHONLVSROSUHYRGQLãNLPLþLSLGHO6KHPDPRGHOD(;35(66]DL]PHQMDYR
SRGDWNRY,(&75
Semiconductor die products -- Part 8: EXPRESS model schema for data exchange
Halbleiter-Chip-Erzeugnisse - Teil 8: EXPRESS-Modell-Schema für den Datenaustausch
Produits à puce de semiconducteur - Partie 8: Schéma du modèle EXPRESS pour
l’échange de données
Ta slovenski standard je istoveten z: CLC/TR 62258-8:2008
ICS:
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST-TP CLC/TR 62258-8:2008 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST-TP CLC/TR 62258-8:2008

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SIST-TP CLC/TR 62258-8:2008

TECHNICAL REPORT
CLC/TR 62258-8

RAPPORT TECHNIQUE
August 2008
TECHNISCHER BERICHT

ICS 31.080.99


English version


Semiconductor die products -
Part 8: EXPRESS model schema for data exchange
(IEC/TR 62258-8:2008)


Produits à puce de semiconducteur -  Halbleiter-Chip-Erzeugnisse -
Partie 8: Schéma du modèle EXPRESS Teil 8: EXPRESS-Modell-Schema
pour l’échange de données für den Datenaustausch
(CEI/TR 62258-8:2008) (IEC/TR 62258-8:2008)






This Technical Report was approved by CENELEC on 2008-06-01.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.





CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2008 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. CLC/TR 62258-8:2008 E

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SIST-TP CLC/TR 62258-8:2008
CLC/TR 62258-8:2008 - 2 -
Foreword
The text of document 47/1927/DTR, future edition 1 of IEC/TR 62258-8, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as CLC/TR 62258-8 on 2008-06-01.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the Technical Report IEC/TR 62258-8:2008 was approved by CENELEC as a Technical
Report without any modification.
__________

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SIST-TP CLC/TR 62258-8:2008
- 3 - CLC/TR 62258-8:2008
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60050 Series International Electrotechnical Vocabulary - -
(IEV)


1) 2)
IEC 62258-1 - Semiconductor die products - EN 62258-1 2005
Part 1: Requirements for procurement and
use


1) 2)
IEC 62258-2 - Semiconductor die products - EN 62258-2 2005
Part 2: Exchange data formats


1) 2)
IEC/TR 62258-4 - Semiconductor die products - CLC/TR 62258-4 2007
Part 4: Questionnaire for die users and
suppliers


1) 2)
IEC 62258-5 - Semiconductor die products - EN 62258-5 2006
Part 5: Requirements for information
concerning electrical simulation


1) 2)
IEC 62258-6 - Semiconductor die products - EN 62258-6 2006
Part 6: Requirements for information
concerning thermal simulation


ISO 10303-11 2004 Industrial automation systems - -
and integration - Product data representation
and exchange -
Part 11: Description methods: The EXPRESS
language reference manual


ISO 10303-21 2002 Industrial automation systems - -
and integration - Product data representation
and exchange -
Part 21: Implementation methods: Clear text
encoding of the exchange structure




1)
Undated reference.
2)
Valid edition at date of issue.

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SIST-TP CLC/TR 62258-8:2008

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SIST-TP CLC/TR 62258-8:2008
IEC/TR 62258-8
Edition 1.0 2008-05
TECHNICAL
REPORT

Semiconductor die products –
Part 8: EXPRESS model schema for data exchange


INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
U
ICS 31.080.99 ISBN 2-8318-9779-3

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SIST-TP CLC/TR 62258-8:2008
– 2 – TR 62258-8 © IEC:2008(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5
1 Scope.6
2 Normative references.6
3 Terms and definitions .7
4 General .7
5 Data exchange .7
Annex A (normative) EXPRESS model schema .8
Annex B (informative) STEP physical file example .25

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SIST-TP CLC/TR 62258-8:2008
TR 62258-8 © IEC:2008(E) – 3–
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DIE PRODUCTS –

Part 8: EXPRESS model schema for data exchange


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a technical report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC 62258-8, which is a technical report, has been prepared by subcommittee 47:
Semiconductor devices.
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
47/1927/DTR 47/1952/RVC

Full information on the voting for the approval of this technical report can be found in the report
on voting indicated in the above table.

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SIST-TP CLC/TR 62258-8:2008
– 4 – TR 62258-8 © IEC:2008(E)
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62258 series, under the general title Semiconductor die products,
can be found on the IEC website. Further parts may be added as required.
The committee has decided that the contents of this publication will remain unchanged until the

maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

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SIST-TP CLC/TR 62258-8:2008
TR 62258-8 © IEC:2008(E) – 5–
INTRODUCTION
th
This technical report is based on the work carried out in the ESPRIT 4 Framework project
GOODDIE which resulted in the publication of the ES 59008 series of European specifications.
Organisations that helped prepare this document included the ESPRIT ENCAST project, the
Die Products Consortium, JEITA, JEDEC and ZVEI.

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SEMICONDUCTOR DIE PRODUCTS –

Part 8: EXPRESS model schema for data exchange



1 Scope
This part of IEC 62258, which is a technical report, has been developed to facilitate the
production, supply and use of semiconductor die products, including
• wafers,
• singulated bare die,
• die and wafers with attached connection structures,
• minimally or partially encapsulated die and wafers.
This Technical Report contains an EXPRESS model schema that describes the elements
needed for data exchange and that will allow the implementation of the requirements of the
IEC 62258-1, IEC 62258-5 and IEC 62258-6 standards, as well as providing an exchange
structure that is complementary to those defined in IEC 62258-2. It is also complementary to
and compatible with the questionnaire in IEC 62258-4.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60050 (all parts), International Electrotechnical Vocabulary
IEC 62258-1, Semiconductor die products – Part 1: Requirements for procurement and use
IEC 62258-2, Semiconductor die products – Part 2: Exchange data formats
IEC/TR 62258-4, Semiconductor die products – Part 4: Questionnaire for die users and
suppliers
IEC 62258-5, Semiconductor die products – Part 5: Requirements for information concerning
electrical simulation
IEC 62258-6, Semiconductor die products – Part 6: Requirements for information concerning
thermal simulation
ISO 10303-11:2004, Industrial automation systems and integration – Product data
representation and exchange – Part 11: Description methods: The EXPRESS language
reference manual
ISO 10303-21:2002, Industrial automation systems and integration – Product data
representation and exchange – Part 21: Implementation methods: Clear text encoding of the
exchange structure

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SIST-TP CLC/TR 62258-8:2008
TR 62258-8 © IEC:2008(E) – 7–
3 Terms and definitions
For the purposes of this document, relevant terms, which are defined in IEC 60050 together
with additional terms and acronyms as given in IEC 62258-1 apply.
4 General
The EXPRESS model schema given in this Technical Report complies with ISO 10303-11 and
allows for exchange of data on die devices using the STEP Physical File format (SPF) as
defined in ISO 10303-21.
To comply with IEC 62258-1, that standard requires that suppliers of die devices shall furnish
information that is necessary and sufficient for users of die devices at all stages of design,
procurement, manufacture and test of products containing them. The EXPRESS model schema
at Annex A defines an exchange mechanism for structuring such information using a
representation that complies with the schema and as such is intended as an aid to compliance
with the standard.
Whilst it is expected that much of the information supplied will be in the public domain and
available from such sources as manufacturers’ data sheets, neither the standard nor the
schema places an obligation on a supplier to make information public. Any information that a
supplier considers to be proprietary or commercially sensitive may be supplied under the terms
of a non-disclosure agreement.
5 Data exchange
The EXPRESS model schema at Annex A implements all the entities as defined by
IEC 62258-2 for the DDX format. In addition, it includes additional entities extending the range
of that data as follows:
• Expansion of data on organisations (manufacturer, supplier etc.) to include addresses and
contacts
• Sub-division of some entities to make their values clearer.
Annex B contains an example of a STEP Physical File based on the model schema using a
fictitious example similar to that employed in IEC 62258-2, extended to cover additional data
requirements. It is possible that software may be available for conversion of data produced
using the spreadsheet associated with IEC 62258-4 into this format. In any case, a wide range
of tools is available commercially for handling and processing STEP files.
The electronic form of the schema contained in this Technical Report may be downloaded from
the IEC website. The copyright conditions applying to the use of the electronic file are those
that apply to IEC database standards, which permit the use of such information in electronic
form for bona-fide e-commerce but do not permit its sale to third parties or other commercial
use.

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SIST-TP CLC/TR 62258-8:2008
– 8 – TR 62258-8 © IEC:2008(E)
Annex A
(normative)

EXPRESS model schema

A.1 General
This Annex contains the full EXPRESS listing of the schema, annotated with comments and
explanatory text. The order of text in this clause is determined primarily by the order imposed
by the EXPRESS language, secondarily by importance.
*)
SCHEMA ddx_schema_version_2_0;
(*
A.2 Type definitions
This clause contains definitions for the types used within this EXPRESS model.
*)
TYPE date_type = STRING(10) FIXED;
END_TYPE;

TYPE text_type = STRING(255);
END_TYPE;

TYPE geometric_unit_type
= ENUMERATION OF (micron, metre, millimetre, inch, mil);
END_TYPE;

TYPE geometric_view_value
= ENUMERATION OF (top,bottom);
END_TYPE;

(*
** A distance in the corresponding "geometric_unit".
*)
TYPE geometric_value = REAL;
END_TYPE;

TYPE integer_value = INTEGER;
WHERE
 non_negative: SELF >= 0;
END_TYPE;
(*

Formal propositions:
non_negative: The integer is non-negative.
*)
TYPE angle_value
= INTEGER;
WHERE
 valid_value: {0 <= SELF <= 359};
END_TYPE;
(*

Formal propositions:
valid_value: The angle can take values from 0 to 359 degrees.

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SIST-TP CLC/TR 62258-8:2008
TR 62258-8 © IEC:2008(E) – 9–
*)
TYPE celsius_value
= REAL;
END_TYPE;

TYPE time_value
= REAL;
END_TYPE;

TYPE watt_value
= REAL;
END_TYPE;

TYPE device_name_type
= TEXT_TYPE;
END_TYPE;

TYPE standards_compliance_type
= text_type;
END_TYPE;

TYPE additional_screening_type
= text_type;
END_TYPE;

TYPE reliability_calculation_type
= text_type;
END_TYPE;

TYPE product_status_type
= text_type;
END_TYPE;

TYPE testability_features_type
= text_type;
END_TYPE;

TYPE additional_test_type
= text_type;
END_TYPE;

TYPE form_of_supply_type
= text_type;
END_TYPE;

TYPE packing_code_type
= text_type;
END_TYPE;

TYPE wafer_die_step_size_type
= size_value;
END_TYPE;

TYPE wafer_gross_die_count_type
= integer_value;
END_TYPE;

TYPE wafer_index_type
= ENUMERATION OF (flat, notch);
END_TYPE;

TYPE wafer_index_orientation_type
= angle_value;
END_TYPE;

TYPE wafer_reticule_step_size_type
= size_value;

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– 10 – TR 62258-8 © IEC:2008(E)
END_TYPE;

TYPE wafer_reticule_gross_die_count_type
= integer_value;
END_TYPE;

TYPE ic_technology_type
= text_type;
END_TYPE;

TYPE data_source_type
= text_type;
END_TYPE;

TYPE data_version_type
= text_type;
END_TYPE;

TYPE block_version_type
= text_type;
END_TYPE;

TYPE function_type
= text_type;
END_TYPE;

TYPE manufacturer_type
= text_type;
END_TYPE;

TYPE pad_metallisation_type
= text_type;
END_TYPE;

TYPE die_passivation_material_type
= text_type;
END_TYPE;

TYPE terminal_material_type
= text_type;
END_TYPE;

TYPE terminal_structure_type
= text_type;
END_TYPE;

TYPE type_number_type
= text_type;
END_TYPE;

TYPE die_name_type
= text_type;
END_TYPE;

TYPE die_semiconductor_material_type
= text_type;
END_TYPE;

TYPE die_back_detail_type
= text_type;
END_TYPE;

TYPE die_substrate_material_type
= text_type;
END_TYPE;

TYPE die_mask_revision_type

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SIST-TP CLC/TR 62258-8:2008
TR 62258-8 © IEC:2008(E) – 11–
= text_type;
END_TYPE;

TYPE bump_material_type
= text_type;
END_TYPE;

TYPE simulator_compliance_type
= text_type;
END_TYPE;

TYPE simulator_version_type
= text_type;
END_TYPE;

TYPE simulator_name_type
= text_type;
END_TYPE;

TYPE simulator_model_file_type
= text_type;
END_TYPE;

TYPE die_substrate_connection_type
= ENUMERATION OF (CONN, ISOL, OPT, NA, NK);
END_TYPE;

TYPE ellipse_type
= ENUMERATION OF (E);
END_TYPE;

TYPE io_type
  = ENUMERATION OF (I, O, B, G, V, A, N, U, T, X, H, L);
END_TYPE;

TYPE moisture_sensitivity_level_type
  = ENUMERATION OF (1, 2, 2a, 3, 4, 5, 5a, 6);
END_TYPE;
(*
A.3 File structure
This subclause contains the two structures defined for the DDX language, DEVICE and
DEVICE_BLOCK.
EXPRESS specification:
*)
ENTITY ddx_file;
 devices: SET [1:?] OF device;
 device_blocks: SET [1:?] OF device_block;
END_ENTITY;
(*
Attribute definitions:
devices: a set of device names.
device_blocks: a set of device blocks containing the die data.

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A.4 Device names
This subclause contains the name of a device for inclusion in a set of devices.
EXPRESS specification:
*)
ENTITY device;
 device_name: device_name_type;
INVERSE
 containing_file: ddx_file FOR devices;
END_ENTITY;
(*

Attribute definitions:
device_name: a name by which a device can be identified.
A.5 Device block
This subclause contains the definition of the contents of a device block.
EXPRESS specification:
*)
ENTITY device_block
 ABSTRACT SUPERTYPE OF (ONEOF (bare_die, bumped_die,
  lead_frame_die, minimally_packaged_device));
 described_device: device; -- reference
 block_creation_date: date_type;
 block_version: block_version_type;
 type_number: type_number_type;
 die_packaged_part_name: OPTIONAL type_number_type;
 manufacturer
...