SIST EN 60191-6-4:2005

Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Mechanische Normung von Halbleiterbauelementen -- Teil 6-4: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren für Gehäusemaße von Ball Grid Array (BGA)

Normalisation mécanique des dispositifs à semiconducteurs -- Partie 6-4: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Méthodes de mesure pour les dimensions des boîtiers matriciels à billes

Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Standardizacija mehanskih lastnosti polprevodniških elementov – 6-4. del: Splošna pravila za pripravo tehničnih risb okrovov polprevodniških elementov za površinsko montažo - Merjenje okrovov z mrežo krogličnih priključkov (BGA) (IEC 60191-6-4:2003)

General Information

• Status: Published
• Publication Date: 28-Feb-2005
• ICS: 01.100.25 - Electrical and electronics engineering drawings
• ICS: 31.080.01 - Semiconductor devices in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Mar-2005
• Due Date: 01-Mar-2005
• Completion Date: 01-Mar-2005
• Ref Project: EN 60191-6-4:2003 - Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 60191-6-4:2005
01-marec-2005
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Mechanical standardization of semiconductor devices -- Part 6-4: General rules for the
preparation of outline drawings of surface mounted semiconductor device packages -
Measuring methods for package dimensions of ball grid array (BGA)
Mechanische Normung von Halbleiterbauelementen -- Teil 6-4: Allgemeine Regeln für
die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Messverfahren
für Gehäusemaße von Ball Grid Array (BGA)
Normalisation mécanique des dispositifs à semiconducteurs -- Partie 6-4: Règles
générales pour la préparation des dessins d'encombrement des dispositifs à
semiconducteurs à montage en surface - Méthodes de mesure pour les dimensions des
boîtiers matriciels à billes
Ta slovenski standard je istoveten z: EN 60191-6-4:2003
ICS:
01.100.25 5LVEHVSRGURþMD Electrical and electronics
HOHNWURWHKQLNHLQHOHNWURQLNH engineering drawings
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
SIST EN 60191-6-4:2005 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 60191-6-4:2005

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SIST EN 60191-6-4:2005
EUROPEAN STANDARD EN 60191-6-4
NORME EUROPÉENNE
EUROPÄISCHE NORM July 2003

ICS 31.080.01


English version


Mechanical standardization of semiconductor devices
Part 6-4: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages -
Measuring methods for package dimensions of ball grid array (BGA)
(IEC 60191-6-4:2003)


Normalisation mécanique  Mechanische Normung von
des dispositifs à semiconducteurs Halbleiterbauelementen
Partie 6-4: Règles générales Teil 6-4: Allgemeine Regeln für die
pour la préparation des dessins Erstellung von Gehäusezeichnungen von
d'encombrement des dispositifs SMD-Halbleitergehäusen -
à semiconducteurs à montage en surface - Messverfahren für Gehäusemaße von
Méthodes de mesure pour les dimensions Ball Grid Array (BGA)
des boîtiers matriciels à billes (IEC 60191-6-4:2003)
(CEI 60191-6-4:2003)



This European Standard was approved by CENELEC on 2003-07-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Lithuania, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2003 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 60191-6-4:2003 E

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SIST EN 60191-6-4:2005
EN 60191-6-4:2003 - 2 -
Foreword
The text of document 47D/531/FDIS, future edition 1 of IEC 60191-6-4, prepared by SC 47D,
Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was
submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-4 on
2003-07-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2004-04-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2006-07-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60191-6-4:2003 was approved by CENELEC as a
European Standard without any modification.
__________

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SIST EN 60191-6-4:2005
- 3 - EN 60191-6-4:2003
Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60191-6 1990 Mechanical standardization of - -
semiconductor devices
Part 6: General rules for the preparation
of outline drawings of surface mounted
semiconductor device packages

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SIST EN 60191-6-4:2005

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SIST EN 60191-6-4:2005
INTERNATIONAL IEC
STANDARD
60191-6-4
First edition
2003-06
Mechanical standardization of
semiconductor devices –
Part 6-4:
General rules for the preparation of
outline drawings of surface mounted
semiconductor device packages –
Measuring methods for package
dimensions of ball grid array (BGA)
Normalisation mécanique des dispositifs
à semiconducteurs –
Partie 6-4:
Règles générales pour la préparation des dessins
d'encombrement des dispositifs à semiconducteurs
à montage en surface –
Méthodes de mesure pour les dimensions des boîtiers
matriciels à billes
 IEC 2003  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail]  Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale
P
International Electrotechnical Commission
Международная Электротехническая Комиссия
For price, see current catalogue

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SIST EN 60191-6-4:2005
– 2 – 60191-6-4  IEC:2003(E)
CONTENTS
FOREWORD . 3
1 Scope . 4
2 Normative references. 4
3 Terms and definitions. 4
4 Reference character and drawings. 5
4.1 Ball grid array package (BGA) Type 1 – Ball datum . 5
4.2 Ball grid array package (BGA) Type 2 – Body datum . 6
Measuring method. 7
5.1 Datum S as pertaining to ball coplanarity. 7
5.2 Datum A, B . 7
5.3 Definition of specified dimensions and measuring method . 9
5.4 Profile of a package edge surface v .11
5.5 Mounting height A.12
5.6 First stand-off A1 .12
5.7 Second stand-off A4 .13
5.8 Ball diameter b .14
5.9 Ball centre position X.14
5.10 Ball coplanarity y .16
5.11 Package top flatness y1.16
Figure 1 – BGA package Type 1 – Ball datum . 5
Figure 2 – BGA package Type 2 – Body datum . 6
Figure 3 – Datum S . 7
Figure 4 – Datum A, B – Type 1 . 8
Figure 5 – Centre of ball centres (for an even number). 8
Figure 6 – Centre of ball centres (for an odd number) . 8
Figure 7 – Datum A – Type 2. 9
Figure 8 – Datum B – Type 2. 9
Figure 9 – Tolerance w.10
Figure 10 – Measuring method of tolerance w .10
Figure 11 – Profile of a package edge surface v.11
Figure 12 – Measuring method of package edge surface v .11
Figure 13 – Mounting height A .12
Figure 14 – First stand-off A1.12
Figure 15 – Measuring method of stand-off A1 .13
Figure 16 – Second stand-off A4 .13
Figure 17 – Measuring method of stand-off A4 .14
Figure 18 – Ball diameter b .14
Figure 19 – Ball centre position X .15
Figure 20 – Theoretically correct ball centre.15
Figure 21 – Measuring method of ball centre position X .15
Figure 22 – Ball coplanarity y .16
Figure 23 – Package top flatness y1.16

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SIST EN 60191-6-4:2005
60191-6-4  IEC:2003(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION
OF SEMICONDUCTOR DEVICES –
Part 6-4: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Measuring methods for package dimensions of ball grid array (BGA)
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fiel
...