SIST EN 60191-6-1:2007

Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)

Mechanische Normung von Halbleiterbauelementen -- Teil 6-1: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden für Gehäuse mit Gullwing-Anschlüssen

Normalisation mécanique des dispositifs à semi-conducteurs -- Partie 6-1: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers à broches en forme d'ailes de mouette

Mehanska standardizacija polprevodniških elementov - 6-1. del: Splošna pravila za pripravo tehničnih risb okrovov polprevodniških elementov za površinsko montažo - Vodilo za oblikovanje priključkov v obliki golobjega krila (IEC 60191-6-1:2001)

General Information

• Status: Published
• Publication Date: 31-Dec-2006
• ICS: 01.100.25 - Electrical and electronics engineering drawings
• ICS: 31.080.01 - Semiconductor devices in general
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: SS EIT - Technical Board for the electrotechnical, information technology and telecommunications fields
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 01-Jan-2007
• Due Date: 01-Jan-2007
• Completion Date: 01-Jan-2007
• Ref Project: EN 60191-6-1:2001 - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Overview

SIST EN 60191-6-1:2007 is a crucial European standard established by the CLC (European Committee for Electrotechnical Standardization) that addresses the mechanical standardization of semiconductor devices. This part 6-1 standard provides general rules for preparing outline drawings of surface-mounted semiconductor device packages, focusing specifically on the design guide for gull-wing lead terminals. Gull-wing leads are widely used in plastic packages such as QFP (Quad Flat Package), SOP (Small Outline Package), SSOP (Shrink Small Outline Package), and TSOP (Thin Small Outline Package), classified under Form E packages according to IEC 60191-4.

The standard aims to unify terminal shape design rules and prevent a proliferation of terminal shapes across various semiconductor package families. By following these defined guidelines, designers and manufacturers can ensure compatibility, reliability, and ease of assembly in electronic equipment.

---

Key Topics

• Scope and Purpose
  EN 60191-6-1 details specifications for designing gull-wing lead terminals on plastic semiconductor packages, which are crucial for surface mounting. It sets common terminal shapes, dimensions, and tolerances, facilitating global harmonization.

• Terminal Dimensions and Design
  The guideline specifies dimensions for key terminal features such as:

  • Terminal width and thickness ranges based on terminal pitch values (e.g., 0.3mm to 1.27mm pitch).
  • Terminal shape parameters including lengths of soldered parts, angles, and terminal height.
  • Package height and stand-off height relationships, critical for assembly and solder joint reliability.

• Tolerance Requirements
  It defines strict tolerances for terminal center positions and coplanarity, ensuring proper alignment and soldering during the manufacturing process.

• Outline Drawings Preparation
  The standard sets rules for preparing clear and uniform outline drawings of device packages with gull-wing leads, aiding in consistent communication between designers, manufacturers, and users.

---

Practical Applications

• Semiconductor Package Design
  Electronic component designers leverage EN 60191-6-1 to develop standardized gull-wing lead configurations, which facilitate automated placement and soldering on printed circuit boards (PCBs).

• Manufacturing and Quality Control
  Manufacturers use the standard as a reference to maintain dimensional accuracy, promote interchangeability of semiconductor devices, and reduce defects related to lead misalignment or poor solder joints.

• Assembly Process Optimization
  OEMs (Original Equipment Manufacturers) and EMS (Electronics Manufacturing Services) providers rely on adherence to the standard to optimize assembly throughput and reduce rework.

• Supply Chain Consistency
  Adopting the design guide allows component suppliers and customers worldwide to have a common understanding of package dimensions and leads, simplifying sourcing and integration.

---

Related Standards

• IEC 60191-4 (1999)
  Classification of semiconductor device packages into forms, including Form E for gull-wing lead terminals.

• IEC 60191-6 (1990)
  General rules for preparing outline drawings of surface-mounted semiconductor device packages.

• ISO/IEC Directives Part 3
  Guidelines for drafting international standards, ensuring consistency and clarity.

• Additional Semiconductor Packaging Standards
  Other IEC and CENELEC standards complementing mechanical and electrical parameters for surface-mounted devices.

---

Keywords: EN 60191-6-1, gull-wing lead terminals, semiconductor device packages, surface-mounted devices, packaging design guide, QFP, SOP, SSOP, TSOP, terminal dimensions, mechanical standardization, outline drawings, coplanarity tolerance, package height, electronic component manufacturing, CENELEC standards.

Standards Content (Sample)

SLOVENSKI STANDARD
01-januar-2007
0HKDQVNDVWDQGDUGL]DFLMDSROSUHYRGQLãNLKHOHPHQWRYGHO6SORãQDSUDYLOD]D
SULSUDYRWHKQLþQLKULVERNURYRYSROSUHYRGQLãNLKHOHPHQWRY]DSRYUãLQVNR
PRQWDåR9RGLOR]DREOLNRYDQMHSULNOMXþNRYYREOLNLJROREMHJDNULOD,(&

Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the
preparation of outline drawings of surface mounted semiconductor device packages -
Design guide for gull-wing lead terminals
Mechanische Normung von Halbleiterbauelementen -- Teil 6-1: Allgemeine Regeln für
die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen -
Konstruktionsleitfaden für Gehäuse mit Gullwing-Anschlüssen
Normalisation mécanique des dispositifs à semi-conducteurs -- Partie 6-1: Règles
générales pour la préparation des dessins d'encombrement des dispositifs à
semiconducteurs pour montage en surface - Guide de conception pour les boîtiers à
broches en forme d'ailes de mouette
Ta slovenski standard je istoveten z: EN 60191-6-1:2001
ICS:
01.100.25 5LVEHVSRGURþMD Electrical and electronics
HOHNWURWHKQLNHLQHOHNWURQLNH engineering drawings
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
31.240 Mehanske konstrukcije za Mechanical structures for
elektronsko opremo electronic equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 60191-6-1
NORME EUROPÉENNE
EUROPÄISCHE NORM December 2001
ICS 31.080.01
English version
Mechanical standardization of semiconductor devices
Part 6-1: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages -
Design guide for gull-wing lead terminals
(IEC 60191-6-1:2001)
Normalisation mécanique des dispositifs à Mechanische Normung von
semi-conducteurs Halbleiterbauelementen
Partie 6-1: Règles générales Teil 6-1: Allgemeine Regeln für die
pour la préparation des dessins Erstellung von Gehäusezeichnungen
d'encombrement des dispositifs à von SMD-Halbleitergehäusen -
semiconducteurs pour montage en Konstruktionsleitfaden für Gehäuse mit
surface - Gullwing-Anschlüssen
Guide de conception pour les boîtiers à (IEC 60191-6-1:2001)
broches en forme d'ailes de mouette
(CEI 60191-6-1:2001)
This European Standard was approved by CENELEC on 2001-12-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands,
Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2001 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60191-6-1:2001 E
Foreword
The text of document 47D/459/FDIS, future edition 1 of IEC 60191-6-1, prepared by SC 47D,
Mechanical standardization of semiconductor devices, of IEC TC 47, Semiconductor devices, was
submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-1 on
2001-12-01.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2002-09-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2004-12-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60191-6-1:2001 was approved by CENELEC as a
European Standard without any modification.
__________
- 3 - EN 60191-6-1:2001
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60191-6 1990 Mechanical standardization of --
semiconductor devices
Part 6: General rules for the preparation
of outline drawings of surface mounted
semiconductor device packages
INTERNATIONAL IEC
STANDARD
60191-6-1
First edition
2001-10
Mechanical standardization of semiconductor
devices –
Part 6-1:
General rules for the preparation of outline
drawings of surface mounted semiconductor
device packages –
Design guide for gull-wing lead terminals
Normalisation mécanique des dispositifs à semi-conducteurs –
Partie 6-1:
Règles générales pour la préparation des dessins
d'encombrement des dispositifs à semiconducteurs pour
montage en surface –
Guide de conception pour les boîtiers à broches
en forme d'ailes de mouette
 IEC 2001  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission 3, rue de Varembé Geneva, Switzerland
Telefax: [phone] e-mail: [e-mail] IEC web site http://www.iec.ch
Commission Electrotechnique Internationale
PRICE CODE
G
International Electrotechnical Commission
For price, see current catalogue

– 2 – 60191-6-1  IEC:2001(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –
Part 6-1: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guide for gull-wing lead terminals
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Thei
...