SIST-TP CEN/CLC/TR 17603-31-10:2021

Space engineering - Thermal design handbook - Part 10: Phase - Change Capacitor

Solid-liquid phase-change materials (PCM) are a favoured approach to spacecraft passive thermal control for incident orbital heat fluxes or when there are wide fluctuations in onboard equipment.
The PCM thermal control system consists of a container which is filled with a substance capable of undergoing a phase-change. When there is an the increase in surface temperature of spacecraft the PCM absorbs the excess heat by melting. If there is a temperature decrease, then the PCM can provide heat by solidifying.
Many types of PCM systems are used in spacecrafts for different types of thermal transfer control.
Characteristics and performance of phase control materials are described in this Part. Existing PCM systems are also described.
The Thermal design handbook is published in 16 Parts
TR 17603-31-01 Part 1
Thermal design handbook – Part 1: View factors
TR 17603-31-01 Part 2
Thermal design handbook – Part 2: Holes, Grooves and Cavities
TR 17603-31-01 Part 3
Thermal design handbook – Part 3: Spacecraft Surface Temperature
TR 17603-31-01 Part 4
Thermal design handbook – Part 4: Conductive Heat Transfer
TR 17603-31-01 Part 5
Thermal design handbook – Part 5: Structural Materials: Metallic and Composite
TR 17603-31-01 Part 6
Thermal design handbook – Part 6: Thermal Control Surfaces
TR 17603-31-01 Part 7
Thermal design handbook – Part 7: Insulations
TR 17603-31-01 Part 8
Thermal design handbook – Part 8: Heat Pipes
TR 17603-31-01 Part 9
Thermal design handbook – Part 9: Radiators
TR 17603-31-01 Part 10
Thermal design handbook – Part 10: Phase – Change Capacitors
TR 17603-31-01 Part 11
Thermal design handbook – Part 11: Electrical Heating
TR 17603-31-01 Part 12
Thermal design handbook – Part 12: Louvers
TR 17603-31-01 Part 13
Thermal design handbook – Part 13: Fluid Loops
TR 17603-31-01 Part 14
Thermal design handbook – Part 14: Cryogenic Cooling
TR 17603-31-01 Part 15
Thermal design handbook – Part 15: Existing Satellites
TR 17603-31-01 Part 16
Thermal design handbook – Part 16: Thermal Protection System

Raumfahrttechnik - Handbuch für thermisches Design - Teil 10: Kondensatoren mit Phasenübergängen

Ingénierie spatiale - Manuel de conception thermique - Partie 10: Réservoirs de matériaux à changement de phase

Vesoljska tehnika - Priročnik o toplotni zasnovi - 10. del: Kondenzatorji s faznimi prehodi

General Information

• Status: Published
• Public Enquiry End Date: 19-May-2021
• Publication Date: 23-Aug-2021
• ICS: 31.060.99 - Other capacitors
• ICS: 49.140 - Space systems and operations
• Technical Committee: I13 - Imaginarni 13
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 19-Aug-2021
• Due Date: 24-Oct-2021
• Completion Date: 24-Aug-2021
• Mandate: M/496 - Mandate addressed to CEN, CENELEC and ETSI to develop standardisation regarding space industry (Phase 3 of the process)
• Ref Project: CEN/CLC/TR 17603-31-10:2021 - Space engineering - Thermal design handbook - Part 10: Phase - Change Capacitor

Standards Content (sample)

SLOVENSKI STANDARD
SIST-TP CEN/CLC/TR 17603-31-10:2021
01-oktober-2021

Vesoljska tehnika - Priročnik o toplotni zasnovi - 10. del: Kondenzatorji s faznimi

prehodi
Space engineering - Thermal design handbook - Part 10: Phase - Change Capacitor
Raumfahrttechnik - Handbuch für thermisches Design - Teil 10: Kondensatoren mit
Phasenübergängen
Ingénierie spatiale - Manuel de conception thermique - Partie 10: Réservoirs de
matériaux à changement de phase
Ta slovenski standard je istoveten z: CEN/CLC/TR 17603-31-10:2021
ICS:
31.060.99 Drugi kondenzatorji Other capacitors
49.140 Vesoljski sistemi in operacije Space systems and
operations
SIST-TP CEN/CLC/TR 17603-31-10:2021 en,fr,de

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST-TP CEN/CLC/TR 17603-31-10:2021
TECHNICAL REPORT
CEN/CLC/TR 17603-31-
RAPPORT TECHNIQUE
TECHNISCHER BERICHT
August 2021
ICS 49.140
English version
Space engineering - Thermal design handbook - Part 10:
Phase - Change Capacitor

Ingénierie spatiale - Manuel de conception thermique - Raumfahrttechnik - Handbuch für thermisches Design -

Partie 10 : Réservoirs de matériaux à changement de Teil 10: Kondensatoren mit Phasenübergängen

phase

This Technical Report was approved by CEN on 21 June 2021. It has been drawn up by the Technical Committee CEN/CLC/JTC 5.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,

Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,

Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,

Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels

© 2021 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. CEN/CLC/TR 17603-31-10:2021 E

reserved worldwide for CEN national Members and for
CENELEC Members.
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Table of contents

European Foreword ................................................................................................... 8

1 Scope ....................................................................................................................... 9

2 References ............................................................................................................ 10

3 Terms, definitions and symbols .......................................................................... 11

3.1 Terms and definitions ............................................................................................. 11

3.2 Abbreviated terms................................................................................................... 11

3.3 Symbols .................................................................................................................. 12

4 Introduction ........................................................................................................... 14

5 PC working materials ........................................................................................... 15

5.1 General ................................................................................................................... 15

5.1.1 Supercooling ............................................................................................. 15

5.1.2 Nucleation ................................................................................................. 19

5.1.3 The effect of gravity on melting and freezing of the pcm ........................... 20

5.1.4 Bubble formation ....................................................................................... 21

5.2 Possible candidates ................................................................................................ 21

5.3 Selected candidates ............................................................................................... 28

6 PCM technology ................................................................................................... 52

6.1 Containers .............................................................................................................. 52

6.2 Fillers ...................................................................................................................... 52

6.3 Containers and fillers .............................................................................................. 53

6.3.1 Materials and corrosion ............................................................................. 53

6.3.2 Exixting containers and fillers .................................................................... 56

7 PCM performances ............................................................................................... 60

7.1 Analytical predictions .............................................................................................. 60

7.1.1 Introduction ............................................................................................... 60

7.1.2 Heat transfer relations ............................................................................... 61

8 Existing systems .................................................................................................. 67

8.1 Introduction ............................................................................................................. 67

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8.2 Dornier system ....................................................................................................... 68

8.3 Ike .......................................................................................................................... 81

8.4 B&k engineering ................................................................................................... 101

8.5 Aerojet electrosystems ......................................................................................... 106

8.6 Trans temp ........................................................................................................... 116

Bibliography ........................................................................................................... 126

Figures

Figure 5-1: Temperature, T, vs. time, t, curves for heating and cooling of several PCMs.

From DORNIER SYSTEM (1971) [9]. ................................................................. 18

Figure 5-2: Temperature, T, vs. time, t, curves for heating and cooling of several PCMs.

From DORNIER SYSTEM (1971) [9]. ................................................................. 19

Figure 5-3: Density, ρ, vs. temperature T, for several PCMs. From DORNIER System

(1971) [9]. ........................................................................................................... 47

Figure 5-4: Specific heat, c, vs. temperature T, for several PCMs. From DORNIER

System (1971) [9]. .............................................................................................. 48

Figure 5-5: Thermal conductivity, k, vs. temperature T, for several PCMs. From

DORNIER System (1971) [9]. ............................................................................. 49

Figure 5-6: Vapor pressure, p , vs. temperature T, for several PCMs. From DORNIER

System (1971) [9]. .............................................................................................. 50

Figure 5-7: Viscosity, µ, vs. temperature T, for several PCMs. From DORNIER System

(1971) [9]. ........................................................................................................... 51

Figure 5-8: Isothermal compressibility, χ, vs. temperature T, for several PCMs. From

DORNIER System (1971) [9]. ............................................................................. 51

Figure 6-1: Container with machined wall profile and welded top and bottom.
Honeycomb filler with heat conduction fins. All the dimensions are in mm.

From DORNIER SYSTEM (1972) [10]. ............................................................... 57

Figure 6-2: Fully machined container with welded top. Honeycomb filler. All the

dimensions are in mm. From DORNIER SYSTEM (1972) [10]. .......................... 58

Figure 6-3: Machined wall container profile with top and bottom adhesive bonded.
Alternative filler types are honeycomb or honeycomb plus fins. All the

dimensions are in mm. From DORNIER SYSTEM (1972) [10]. .......................... 59

Figure 7-1: Sketch of the PCM package showing the solid-liquid interface. .......................... 61

Figure 7-2: PCM mass, M , filler mass, M , package thickness, L, temperature
PCM F
excursion, ∆T, and total conductivity, k , as functions of the ratio of filler

area to total area, A /A . Calculated by the compiler. ......................................... 65

F T
Figure 7-3: PCM mass, M , filler mass, M , package thickness, L, temperature
PCM F
excursion, ∆T, and total conductivity, k , as functions of the ratio of filler

area to total area, A /A . Calculated by the compiler. ......................................... 66

F T
Figure 8-1: PCM capacitor for eclipse temperature control developed by Dornier

System. .............................................................................................................. 71

Figure 8-2: 30 W.h PCM capacitors developed by Dornier System. a) Complete PCM
capacitor. b) Container and honeycomb filler with cells normal to the heat
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input/output face. c) Container, honeycomb filler with cells parallel to the

heat input/output face, and cover sheets. ........................................................... 71

Figure 8-3: PCM mounting panels developed by Dornier Syatem. b) Shows the

arrangement used for thermal control of four different heat sources. .................. 72

Figure 8-4: Thermal control system formed by, from right to left, a: PCM capacitor, b:

axial heat pipe and, c: flat plate heat pipe. This system was developed by

Dornier System for the GfW-Heat Pipe Experiment. October 1974. .................... 76

Figure 8-5: PCM capacitor shown in the above figure........................................................... 76

Figure 8-6: Temperature, T, as selected points in the complete system vs. time, t,

during heat up. a) Ground tests. Symmetry axis in horizontal position. Q =
28 W. b) Ground tests. Symmetry axis in vertical position. Q = 28 W. The
high temperatures which appear at start-up are due to pool boiling in the
evaporator of the axial heat pipe. c) Flight experiment under microgravity

conditions. Q not given. notice time scale. .......................................................... 77

Figure 8-7: PCM capacitor developed by Dornier System for temperature control of two

rate gyros onboard the Sounding Rocket ESRO "S-93". .................................... 79

Figure 8-8: Test model of the above PCM capacitor. In the figure are shown, from right

to left, the two rate gyros, the filler and the container.......................................... 79

Figure 8-9: Temperature, T, at the surface of the rate gyros, vs. time, t . Ambient

temperature, T = 273 K. Ambient temperature, T = 273 K.
R R
Ambient temperature changing between 273 K and 333 K. This
curve shows the history of the ambient temperature used as input for the
last curve above. References: DORNIER SYSTEM (1972) [10], Striimatter

(1972) [22]. ......................................................................................................... 80

Figure 8-10: Location of the thermocouples in the input/output face. The thermocouples

placed on the opposite face do not appear in the figure since they are
projected in the same positions as those in the input/output face. All the

dimensions are in mm. ....................................................................................... 83

Figure 8-11: Prototype PCM capacitor developed by IKE. All the dimensions are in mm.

a: Box. b: Honeycomb half layer. c: Perforations in compartment walls. d:

pinch tube. e: Extension of the pinch tube. ......................................................... 85

Figure 8-12: Time, t, for nominal heat storage and temperature, T of the heat transfer

face vs. heat input rate, Q . Time for nominal heat storage. Measured
average wall temperature at time t . Measured temperature at the center

of the heat transfer face at time t. ....................................................................... 86

Figure 8-13: Time, t , for complete melting and temperature, T, of the heat transfer

max
face vs. heat input rate, Q. Time for complete melting: measured.
calculated by model A. Calculated by models B or C. Average wall
temperature at time t : measured. calculated by model A.
max
Calculated by models B or C. Measured temperature at the center of the

heat transfer face at t . .................................................................................... 86

max

Figure 8-14: Location of the thermocouples in the heat input/output face (f) and within

the box (b). The thermocouples placed on the opposite face do not appear
in the figure since they are projected on the same positions as those in the

input/output face. All the dimensions are in mm. ................................................ 89

Figure 8-15: PCM capacitors with several fillers developed by IKE. All the dimensions

are in mm. a: Model 1. b: Model 2. c: Model 3. d: Model 4. ................................ 91

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Figure 8-16: Measured temperature, T, at several points of the PCM capacitor vs. time

t. Model 2. Heat up with a heat transfer rate Q = 30,6 W. Points are placed
as follows (Figure 8-14): Upper left corner of the heat input/output
face. Center of the insulated face. Center of the box,
immersed in the PCM. Time for complete melting t , is shown by means
max

of a vertical trace intersecting the curves............................................................ 92

Figure 8-17: Time for complete melting, tmax, vs. heat input rate Q . Model 1.
Measured. Model 2. Measured. Calculated by using model A.
Model 3. Measured. Calculated by using model A.

Calculated by using model B. Model 4. Measured. ......................................... 92

Figure 8-18: Largest measured temperature, T, of the heat input/output face vs. heat

input rate, Q .Model 1. Measured. Model 2. Measured.
Calculated by using model A. Model 3. Measured. Calculated by
using model A. Calculated by using model B. Model 4. Measured. ...... 93
Figure 8-19: Location of the thermocouples in the heat input/output face. The
thermocouples placed on the opposite face do not appear in the figure
since they are projected on the same positions as those in the input/output
face. Thermocouples are numbered for later reference. All the dimensions

are in mm. .......................................................................................................... 96

Figure 8-20: PCM capacitor developed by IKE for ESA (ESTEC). All the dimensions
are in mm. a: Box. b: Honeycomb calls. c: Perforations in compartment

walls. d: Pinch tube. ........................................................................................... 98

Figure 8-21: Measured temperature, T at several points in either of the large faces of

the container vs. time, t. Heat up with a heat transfer rate Q = 86,4 W.
Points 1 to 5 are placed in the heat input/output face as indicated in Figure
8-19. Circled points are in the same positions at the insulated face. Time for
complete melting, t , is shown by means of a vertical trace intersecting
max

the curves. ......................................................................................................... 99

Figure 8-22: Time for complete melting, t vs. heat input rate, Q . Measured.
max
Calculated by using the 26 nodes model. Overall thermal conductances in
−1 −1

the range 1,4 W.K to 5,6 W.K . ....................................................................... 99

Figure 8-23: Average temperature, T of either of the large faces vs. heat input rate, Q. t

= t . Heat input/output face. Measured. Calculated by the 26
max
− 1
nodes model. Overall thermal conductance 5,6 W.K . Calculated
as above. Overall thermal conductance 6,7 W.K . Insulated face.
Measured. Calculated as above. Overall thermal conductance 5,6
−1 −1

W.K and 6,7 W.K . ........................................................................................ 100

Figure 8-24: Set-up used for component tests. ................................................................... 103

Figure 8-25: PCM capacitor developed by B & K Engineering for NASA. All the

dimensions are in mm. ..................................................................................... 104

Figure 8-26: Schematic of the PCM capacitor in the TIROS-N cryogenic heat pipe

experiment package (HEPP). From Ollendorf (1976) [20]. ............................... 104

Figure 8-27: Average temperature, T of the container vs. time, t , during heat up for two

different heat transfer rates. Q = 25 W. Q = 45 W. Component tests

data. ................................................................................................................. 105

Figure 8-28: Average temperature, T, of the container vs. time, t, during cool down.

Data from either component or system tests. Component tests, Q = 6,1
W. Freezing interval ∆t≅ 4,5 h. System tests, Q = 5,2 W. Freezing
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interval ∆t≅ 5 h. Time for complete melting, tmax, is shown by means of a

vertical trace intersecting the curves. ............................................................... 105

Figure 8-29: Set up used for the “Beaker” tests. ................................................................. 108

Figure 8-30: Set up used for the "Canteen" tests. Strain gage.

Temperature sensor. ........................................................................................ 109

Figure 8-31: PCM capacitor developed by Aerojet ElectroSystems Company. The outer

diameter is given in mm. .................................................................................. 109

Figure 8-32: "Canteen" simulation of the S day. a) Heat transfer rate, Q vs. time, t. b)

PCM temperature, T, vs. time t. Data in the insert table estimated by the
compiler through area integration and the value of h in Tables 8-9 and 8-

10. .................................................................................................................... 110

Figure 8-33: Maximum diurnal temperature, T of the radiator vs. orbital time, t.
Predicted with no-phase change. Measured. Phase-change attenuated
the warming trend of the radiator for eleven months (performance

extension). ....................................................................................................... 110

Figure 8-34: Location of the thermocouples and strain gages in the test unit.
Thermocouples 12, 17 and 14 are placed on the base; 6, 7 and 8 on the
upper face; 9 and 10 on the lateral faces; 11 on the rim, and 26 on the

mounting hub interface. Strain gages are placed on his upper face.................. 114

Figure 8-35: PCM capacitor developed by Aerojet. All the dimensions are in mm. ............. 114

Figure 8-36: Average temperature, T, of the container vs. time, t, either during heat up

or during cool down. a) During heat up with a nominal heat transfer rate Q =
2,5 W. b) During cool down with the same nominal heat transfer rate. With
honeycomb filler. Mounting hub down. Measured. Calculated.
Cooling coils down. Measured. Calculated. Without honeycomb
filler. Cooling coils up. Measured. Calculated with the original
model. Calculated with the modified model. Cooling coils down.
Measured. Times for 90% and complete melting (freezing) are shown in the
figure by means of vertical traces intersecting the calculated curves.
Replotted by the compiler, after Bledjian, Burden & Hanna (1979) [6], by

shifting the time scale in order to unify the initial temperatures. ........................ 115

Figure 8-37: Several TRANS TEMP Containers developed by Royal Industries for
transportation of temperature- sensitive products. a: 205 System. b: 301

System. c: 310 System. 1: Outer insulation. 2: PCM container. ........................ 125

Figure 8-38: Measured ambient and inner temperatures, T vs. time, t, for several
TRANS TEMP Containers holding blood samples. a: 205 System. b: 301
System. c: 310 System. Ambient temperature. Inner

temperature. ..................................................................................................... 125

Tables

Table 5-1: Supercooling Tests .............................................................................................. 17

Table 5-2: PARAFFINS ........................................................................................................ 22

Table 5-3: NON-PARAFFIN ORGANICS ........................................................................... 23

Table 5-4: SALT HYDRATES ............................................................................................... 24

Table 5-5: METALLIC ........................................................................................................... 26

Table 5-6: FUSED SALT EUTECTICS ................................................................................. 27

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Table 5-7: MISCELLANEOUS .............................................................................................. 27

Table 5-8: SOLID-SOLID ...................................................................................................... 28

Table 5-9: PARAFFINS ........................................................................................................ 29

Table 5-10: PARAFFINS ...................................................................................................... 30

Table 5-11: PARAFFINS ...................................................................................................... 32

Table 5-12: NON-PARAFFIN ORGANICS ............................................................................ 34

Table 5-13: NON-PARAFFIN ORGANICS ............................................................................ 35

Table 5-14: NON-PARAFFIN ORGANICS ............................................................................ 37

Table 5-15: NON-PARAFFIN ORGANICS ............................................................................ 39

Table 5-16: NON-PARAFFIN ORGANICS ............................................................................ 40

Table 5-17: SALT HYDRATES ............................................................................................. 42

Table 5-18: METALLIC AND MISCELLANEOUS ................................................................. 45

Table 6-1: Physical Properties of Several Container and Filler Materials .............................. 54

Table 6-2: Compatibility of PCM with Several Container and Filler Materials ........................ 55

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European Foreword

This document (CEN/CLC/TR 17603-31-10:2021) has been prepared by Technical Committee

CEN/CLC/JTC 5 “Space”, the secretariat of which is held by DIN.

It is highlighted that this technical report does not contain any requirement but only collection of data

or descriptions and guidelines about how to organize and perform the work in support of EN 16603-

31.

This Technical report (TR 17603-31-10:2021) originates from ECSS-E-HB-31-01 Part 10A.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CEN [and/or CENELEC] shall not be held responsible for identifying any or all such

patent rights.

This document has been prepared under a mandate given to CEN by the European Commission and

the European Free Trade Association.

This document has been developed to cover specifically space systems and has therefore precedence

over any TR covering the same scope but with a wider domain of applicability (e.g.: aerospace).

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Scope

Solid-liquid phase-change materials (PCM) are a favoured approach to spacecraft passive thermal

control for incident orbital heat fluxes or when there are wide fluctuations in onboard equipment.

The PCM thermal control system consists of a container which is filled with a substance capable of

undergoing a phase-change. When there is an the increase in surface temperature of spacecraft the

PCM absorbs the excess heat by melting. If there is a temperature decrease, then the PCM can provide

heat by solidifying.

Many types of PCM systems are used in spacecrafts for different types of thermal transfer control.

Characteristics and performance of phase control materials are described in this Part. Existing PCM

systems are also described.
The Thermal design handbook is published in 16 Parts
TR 17603-31-01 Thermal design handbook – Part 1: View factors
TR 17603-31-02 Thermal design handbook – Part 2: Holes, Grooves and Cavities
TR 17603-31-03 Thermal design handbook – Part 3: Spacecraft Surface Temperature
TR 17603-31-04 Thermal design handbook – Part 4: Conductive Heat Transfer

TR 17603-31-05 Thermal design handbook – Part 5: Structural Materials: Metallic and

Composite
TR 17603-31-06 Thermal design handbook – Part 6: Thermal Control Surfaces
TR 17603-31-07 Thermal design handbook – Part 7: Insulations
TR 17603-31-08 Thermal design handbook – Part 8: Heat Pipes
TR 17603-31-09 Thermal design handbook – Part 9: Radiators
TR 17603-31-10 Thermal design handbook – Part 10: Phase – Change Capacitors
TR 17603-31-11 Thermal design handbook – Part 11: Electrical Heating
TR 17603-31-12 Thermal design handbook – Part 12: Louvers
TR 17603-31-13 Thermal design handbook – Part 13: Fluid Loops
TR 17603-31-14 Thermal design handbook – Part 14: Cryogenic Cooling
TR 17603-31-15 Thermal design handbook – Part 15: Existing Satellites
TR 17603-31-16 Thermal design handbook – Part 16: Thermal Protection System
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References
EN Reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS System - Glossary of terms
TR 17603-30-06 ECSS-E-HB-31-01 Part 6 Thermal design handbook – Part 6: Thermal
Control Surfaces

TR 17603-30-11 ECSS-E-HB-31-01 Part 11 Thermal design handbook – Part 11: Electrical

Heating

All other references made to publications in this Part are listed, alphabetically, in the Bibliography.

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Terms, definitions and symbols
3.1 Terms and definitions

For the purpose of this Standard, the terms and definitions given in ECSS-S-ST-00-01 apply.

3.2 Abbreviated terms
The following abbreviated terms are defined and used within this Standard.
air traffic control (aerosat)
ATC
Brennan & Kroliczek
B & K
Gessellschaft für Weltraumforschung
GfW
heat pipe experiment package
HEPP
HLS
international heat pipe experiment
IHPE
institut für kernenenergetik (university of Stuttgart)
IKE
long duration exposure facility
LDEF
methyl-ethyl ketone
MEK
multilayer insulation
MLI
phase-change material
PCM
systems improved numerical differencing analyzer
SINDA
stainless steel
second surface mirror
SSM
stoichiometric day, see clause 8.5
S day
tungsten-inert gas
TIG
television and infra-red observation satellite
TIROS
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tag open cup
TOC
tag closed cup
TCC
transporter heat pipe
TPHP

Other Symbols, mainly used to define the geometry of the configuration, are introduced when

required.
3.3 Symbols
cross-sectional area, [m ]
modulus of elasticity, [Pa]
maximum energy stored in the PCM device, [J]
Emax
thickness of the PCM device, one-dimensional model,
[m]
mass, [kg]
heat transfer rate, [W]
temperature, [K]
melting (or freezing) temperature, [K]
temperature of the components being controlled, [K]
reference temperature, [K]
excursion temperature, [K], ∆T = T0−TM
− −
1 1
specific heat, [J.kg .K ]
heat of fusion, [J.kg ]
heat of transition, [J.kg ]
− −
1 1
thermal conductivity, [W.m .K ]
vapor pressure, [Pa]
heat flux to the PCM device, one-dimensional model,
[W.m ]
heat flux from the PCM device to the
...

SLOVENSKI STANDARD
kSIST-TP FprCEN/CLC/TR 17603-31-10:2021
01-maj-2021

Vesoljska tehnika - Priročnik za toplotno zasnovo - 10. del: Kondenzatorji s faznimi

prehodi
Space engineering - Thermal design handbook - Part 10: Phase - Change Capacitor
Raumfahrttechnik - Handbuch für thermisches Design - Teil 10: Kondensatoren mit
Phasenübergängen
Ingénierie spatiale - Manuel de conception thermique - Partie 10: Réservoirs de
matériaux à changement de phase
Ta slovenski standard je istoveten z: FprCEN/CLC/TR 17603-31-10
ICS:
49.140 Vesoljski sistemi in operacije Space systems and
operations
kSIST-TP FprCEN/CLC/TR 17603-31- en,fr,de
10:2021

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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kSIST-TP FprCEN/CLC/TR 17603-31-10:2021
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kSIST-TP FprCEN/CLC/TR 17603-31-10:2021
TECHNICAL REPORT
FINAL DRAFT
FprCEN/CLC/TR 17603-
RAPPORT TECHNIQUE
31-10
TECHNISCHER BERICHT
February 2021
ICS 49.140
English version
Space engineering - Thermal design handbook - Part 10:
Phase - Change Capacitor

Ingénierie spatiale - Manuel de conception thermique - Raumfahrttechnik - Handbuch für thermisches Design -

Partie 10: Réservoirs de matériaux à changement de Teil 10: Kondensatoren mit Phasenübergängen

phase

This draft Technical Report is submitted to CEN members for Vote. It has been drawn up by the Technical Committee

CEN/CLC/JTC 5.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,

Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,

Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia,

Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.

Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are

aware and to provide supporting documentation.

Warning : This document is not a Technical Report. It is distributed for review and comments. It is subject to change without

notice and shall not be referred to as a Technical Report.
CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels

© 2021 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. FprCEN/CLC/TR 17603-31-10:2021 E

reserved worldwide for CEN national Members and for
CENELEC Members.
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Table of contents

European Foreword ................................................................................................... 8

1 Scope ....................................................................................................................... 9

2 References ............................................................................................................ 10

3 Terms, definitions and symbols .......................................................................... 11

3.1 Terms and definitions ............................................................................................. 11

3.2 Abbreviated terms................................................................................................... 11

3.3 Symbols .................................................................................................................. 12

4 Introduction ........................................................................................................... 14

5 PC working materials ........................................................................................... 15

5.1 General ................................................................................................................... 15

5.1.1 Supercooling ............................................................................................. 15

5.1.2 Nucleation ................................................................................................. 19

5.1.3 The effect of gravity on melting and freezing of the pcm ........................... 20

5.1.4 Bubble formation ....................................................................................... 21

5.2 Possible candidates ................................................................................................ 21

5.3 Selected candidates ............................................................................................... 28

6 PCM technology ................................................................................................... 52

6.1 Containers .............................................................................................................. 52

6.2 Fillers ...................................................................................................................... 52

6.3 Containers and fillers .............................................................................................. 53

6.3.1 Materials and corrosion ............................................................................. 53

6.3.2 Exixting containers and fillers .................................................................... 56

7 PCM performances ............................................................................................... 60

7.1 Analytical predictions .............................................................................................. 60

7.1.1 Introduction ............................................................................................... 60

7.1.2 Heat transfer relations ............................................................................... 61

8 Existing systems .................................................................................................. 67

8.1 Introduction ............................................................................................................. 67

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8.2 Dornier system ....................................................................................................... 68

8.3 Ike .......................................................................................................................... 81

8.4 B&k engineering ................................................................................................... 101

8.5 Aerojet electrosystems ......................................................................................... 106

8.6 Trans temp ........................................................................................................... 116

Bibliography ........................................................................................................... 126

Figures

Figure 5-1: Temperature, T, vs. time, t, curves for heating and cooling of several PCMs.

From DORNIER SYSTEM (1971) [9]. ................................................................. 18

Figure 5-2: Temperature, T, vs. time, t, curves for heating and cooling of several PCMs.

From DORNIER SYSTEM (1971) [9]. ................................................................. 19

Figure 5-3: Density, , vs. temperature T, for several PCMs. From DORNIER System

(1971) [9]. ........................................................................................................... 47

Figure 5-4: Specific heat, c, vs. temperature T, for several PCMs. From DORNIER

System (1971) [9]. .............................................................................................. 48

Figure 5-5: Thermal conductivity, k, vs. temperature T, for several PCMs. From

DORNIER System (1971) [9]. ............................................................................. 49

Figure 5-6: Vapor pressure, p , vs. temperature T, for several PCMs. From DORNIER

System (1971) [9]. .............................................................................................. 50

Figure 5-7: Viscosity, , vs. temperature T, for several PCMs. From DORNIER System

(1971) [9]. ........................................................................................................... 51

Figure 5-8: Isothermal compressibility, , vs. temperature T, for several PCMs. From

DORNIER System (1971) [9]. ............................................................................. 51

Figure 6-1: Container with machined wall profile and welded top and bottom.
Honeycomb filler with heat conduction fins. All the dimensions are in mm.

From DORNIER SYSTEM (1972) [10]. ............................................................... 57

Figure 6-2: Fully machined container with welded top. Honeycomb filler. All the

dimensions are in mm. From DORNIER SYSTEM (1972) [10]. .......................... 58

Figure 6-3: Machined wall container profile with top and bottom adhesive bonded.
Alternative filler types are honeycomb or honeycomb plus fins. All the

dimensions are in mm. From DORNIER SYSTEM (1972) [10]. .......................... 59

Figure 7-1: Sketch of the PCM package showing the solid-liquid interface. .......................... 61

Figure 7-2: PCM mass, M , filler mass, M , package thickness, L, temperature
PCM F
excursion, T, and total conductivity, k , as functions of the ratio of filler

area to total area, A /A . Calculated by the compiler. ......................................... 65

F T
Figure 7-3: PCM mass, M , filler mass, M , package thickness, L, temperature
PCM F
excursion, T, and total conductivity, k , as functions of the ratio of filler

area to total area, A /A . Calculated by the compiler. ......................................... 66

F T
Figure 8-1: PCM capacitor for eclipse temperature control developed by Dornier

System. .............................................................................................................. 71

Figure 8-2: 30 W.h PCM capacitors developed by Dornier System. a) Complete PCM
capacitor. b) Container and honeycomb filler with cells normal to the heat
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input/output face. c) Container, honeycomb filler with cells parallel to the

heat input/output face, and cover sheets. ........................................................... 71

Figure 8-3: PCM mounting panels developed by Dornier Syatem. b) Shows the

arrangement used for thermal control of four different heat sources. .................. 72

Figure 8-4: Thermal control system formed by, from right to left, a: PCM capacitor, b:

axial heat pipe and, c: flat plate heat pipe. This system was developed by

Dornier System for the GfW-Heat Pipe Experiment. October 1974. .................... 76

Figure 8-5: PCM capacitor shown in the above figure........................................................... 76

Figure 8-6: Temperature, T, as selected points in the complete system vs. time, t,

during heat up. a) Ground tests. Symmetry axis in horizontal position. Q =
28 W. b) Ground tests. Symmetry axis in vertical position. Q = 28 W. The
high temperatures which appear at start-up are due to pool boiling in the
evaporator of the axial heat pipe. c) Flight experiment under microgravity

conditions. Q not given. notice time scale. .......................................................... 77

Figure 8-7: PCM capacitor developed by Dornier System for temperature control of two

rate gyros onboard the Sounding Rocket ESRO "S-93". .................................... 79

Figure 8-8: Test model of the above PCM capacitor. In the figure are shown, from right

to left, the two rate gyros, the filler and the container.......................................... 79

Figure 8-9: Temperature, T, at the surface of the rate gyros, vs. time, t . Ambient

temperature, T = 273 K. Ambient temperature, T = 273 K.
R R
Ambient temperature changing between 273 K and 333 K. This
curve shows the history of the ambient temperature used as input for the
last curve above. References: DORNIER SYSTEM (1972) [10], Striimatter

(1972) [22]. ......................................................................................................... 80

Figure 8-10: Location of the thermocouples in the input/output face. The thermocouples

placed on the opposite face do not appear in the figure since they are
projected in the same positions as those in the input/output face. All the

dimensions are in mm. ....................................................................................... 83

Figure 8-11: Prototype PCM capacitor developed by IKE. All the dimensions are in mm.

a: Box. b: Honeycomb half layer. c: Perforations in compartment walls. d:

pinch tube. e: Extension of the pinch tube. ......................................................... 85

Figure 8-12: Time, t, for nominal heat storage and temperature, T of the heat transfer

face vs. heat input rate, Q . Time for nominal heat storage. Measured
average wall temperature at time t . Measured temperature at the center

of the heat transfer face at time t. ....................................................................... 86

Figure 8-13: Time, t , for complete melting and temperature, T, of the heat transfer

max
face vs. heat input rate, Q. Time for complete melting: measured.
calculated by model A. Calculated by models B or C. Average wall
temperature at time t : measured. calculated by model A.
max
Calculated by models B or C. Measured temperature at the center of the

heat transfer face at t . .................................................................................... 86

max

Figure 8-14: Location of the thermocouples in the heat input/output face (f) and within

the box (b). The thermocouples placed on the opposite face do not appear
in the figure since they are projected on the same positions as those in the

input/output face. All the dimensions are in mm. ................................................ 89

Figure 8-15: PCM capacitors with several fillers developed by IKE. All the dimensions

are in mm. a: Model 1. b: Model 2. c: Model 3. d: Model 4. ................................ 91

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Figure 8-16: Measured temperature, T, at several points of the PCM capacitor vs. time

t. Model 2. Heat up with a heat transfer rate Q = 30,6 W. Points are placed
as follows (Figure 8-14): Upper left corner of the heat input/output
face. Center of the insulated face. Center of the box,
immersed in the PCM. Time for complete melting t , is shown by means
max

of a vertical trace intersecting the curves............................................................ 92

Figure 8-17: Time for complete melting, t , vs. heat input rate Q . Model 1.
max
Measured. Model 2. Measured. Calculated by using model A.
Model 3. Measured. Calculated by using model A.

Calculated by using model B. Model 4. Measured. ......................................... 92

Figure 8-18: Largest measured temperature, T, of the heat input/output face vs. heat

input rate, Q .Model 1. Measured. Model 2. Measured.
Calculated by using model A. Model 3. Measured. Calculated by
using model A. Calculated by using model B. Model 4. Measured. ...... 93
Figure 8-19: Location of the thermocouples in the heat input/output face. The
thermocouples placed on the opposite face do not appear in the figure
since they are projected on the same positions as those in the input/output
face. Thermocouples are numbered for later reference. All the dimensions

are in mm. .......................................................................................................... 96

Figure 8-20: PCM capacitor developed by IKE for ESA (ESTEC). All the dimensions
are in mm. a: Box. b: Honeycomb calls. c: Perforations in compartment

walls. d: Pinch tube. ........................................................................................... 98

Figure 8-21: Measured temperature, T at several points in either of the large faces of

the container vs. time, t. Heat up with a heat transfer rate Q = 86,4 W.
Points 1 to 5 are placed in the heat input/output face as indicated in Figure
8-19. Circled points are in the same positions at the insulated face. Time for
complete melting, t , is shown by means of a vertical trace intersecting
max

the curves. ......................................................................................................... 99

Figure 8-22: Time for complete melting, t vs. heat input rate, Q . Measured.
max
Calculated by using the 26 nodes model. Overall thermal conductances in
1 1

the range 1,4 W.K to 5,6 W.K . ....................................................................... 99

Figure 8-23: Average temperature, T of either of the large faces vs. heat input rate, Q. t

= t . Heat input/output face. Measured. Calculated by the 26
max
 1
nodes model. Overall thermal conductance 5,6 W.K . Calculated
as above. Overall thermal conductance 6,7 W.K . Insulated face.
Measured. Calculated as above. Overall thermal conductance 5,6
1 1

W.K and 6,7 W.K . ........................................................................................ 100

Figure 8-24: Set-up used for component tests. ................................................................... 103

Figure 8-25: PCM capacitor developed by B & K Engineering for NASA. All the

dimensions are in mm. ..................................................................................... 104

Figure 8-26: Schematic of the PCM capacitor in the TIROS-N cryogenic heat pipe

experiment package (HEPP). From Ollendorf (1976) [20]. ............................... 104

Figure 8-27: Average temperature, T of the container vs. time, t , during heat up for two

different heat transfer rates. Q = 25 W. Q = 45 W. Component tests

data. ................................................................................................................. 105

Figure 8-28: Average temperature, T, of the container vs. time, t, during cool down.

Data from either component or system tests. Component tests, Q = 6,1
W. Freezing interval t 4,5 h. System tests, Q = 5,2 W. Freezing
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interval t 5 h. Time for complete melting, t , is shown by means of a
max

vertical trace intersecting the curves. ............................................................... 105

Figure 8-29: Set up used for the “Beaker” tests. ................................................................. 108

Figure 8-30: Set up used for the "Canteen" tests. Strain gage.

Temperature sensor. ........................................................................................ 109

Figure 8-31: PCM capacitor developed by Aerojet ElectroSystems Company. The outer

diameter is given in mm. .................................................................................. 109

Figure 8-32: "Canteen" simulation of the S day. a) Heat transfer rate, Q vs. time, t. b)

PCM temperature, T, vs. time t. Data in the insert table estimated by the
compiler through area integration and the value of h in Tables 8-9 and 8-

10. .................................................................................................................... 110

Figure 8-33: Maximum diurnal temperature, T of the radiator vs. orbital time, t.
Predicted with no-phase change. Measured. Phase-change attenuated
the warming trend of the radiator for eleven months (performance

extension). ....................................................................................................... 110

Figure 8-34: Location of the thermocouples and strain gages in the test unit.
Thermocouples 12, 17 and 14 are placed on the base; 6, 7 and 8 on the
upper face; 9 and 10 on the lateral faces; 11 on the rim, and 26 on the

mounting hub interface. Strain gages are placed on his upper face.................. 114

Figure 8-35: PCM capacitor developed by Aerojet. All the dimensions are in mm. ............. 114

Figure 8-36: Average temperature, T, of the container vs. time, t, either during heat up

or during cool down. a) During heat up with a nominal heat transfer rate Q =
2,5 W. b) During cool down with the same nominal heat transfer rate. With
honeycomb filler. Mounting hub down. Measured. Calculated.
Cooling coils down. Measured. Calculated. Without honeycomb
filler. Cooling coils up. Measured. Calculated with the original
model. Calculated with the modified model. Cooling coils down.
Measured. Times for 90% and complete melting (freezing) are shown in the
figure by means of vertical traces intersecting the calculated curves.
Replotted by the compiler, after Bledjian, Burden & Hanna (1979) [6], by

shifting the time scale in order to unify the initial temperatures. ........................ 115

Figure 8-37: Several TRANS TEMP Containers developed by Royal Industries for
transportation of temperature- sensitive products. a: 205 System. b: 301

System. c: 310 System. 1: Outer insulation. 2: PCM container. ........................ 125

Figure 8-38: Measured ambient and inner temperatures, T vs. time, t, for several
TRANS TEMP Containers holding blood samples. a: 205 System. b: 301
System. c: 310 System. Ambient temperature. Inner

temperature. ..................................................................................................... 125

Tables

Table 5-1: Supercooling Tests .............................................................................................. 17

Table 5-2: PARAFFINS ........................................................................................................ 22

Table 5-3: NON-PARAFFIN ORGANICS ........................................................................... 23

Table 5-4: SALT HYDRATES ............................................................................................... 24

Table 5-5: METALLIC ........................................................................................................... 26

Table 5-6: FUSED SALT EUTECTICS ................................................................................. 27

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Table 5-7: MISCELLANEOUS .............................................................................................. 27

Table 5-8: SOLID-SOLID ...................................................................................................... 28

Table 5-9: PARAFFINS ........................................................................................................ 29

Table 5-10: PARAFFINS ...................................................................................................... 30

Table 5-11: PARAFFINS ...................................................................................................... 32

Table 5-12: NON-PARAFFIN ORGANICS ............................................................................ 34

Table 5-13: NON-PARAFFIN ORGANICS ............................................................................ 35

Table 5-14: NON-PARAFFIN ORGANICS ............................................................................ 37

Table 5-15: NON-PARAFFIN ORGANICS ............................................................................ 39

Table 5-16: NON-PARAFFIN ORGANICS ............................................................................ 40

Table 5-17: SALT HYDRATES ............................................................................................. 42

Table 5-18: METALLIC AND MISCELLANEOUS ................................................................. 45

Table 6-1: Physical Properties of Several Container and Filler Materials .............................. 54

Table 6-2: Compatibility of PCM with Several Container and Filler Materials ........................ 55

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European Foreword

This document (FprCEN/CLC/TR 17603-31-10:2021) has been prepared by Technical Committee

CEN/CLC/JTC 5 “Space”, the secretariat of which is held by DIN.
This document is currently submitted to the Vote on TR.

It is highlighted that this technical report does not contain any requirement but only collection of data

or descriptions and guidelines about how to organize and perform the work in support of EN 16603-

31.

This Technical report (FprCEN/CLC/TR 17603-31-10:2021) originates from ECSS-E-HB-31-01 Part 10A.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CEN [and/or CENELEC] shall not be held responsible for identifying any or all such

patent rights.

This document has been prepared under a mandate given to CEN by the European Commission and

the European Free Trade Association.

This document has been developed to cover specifically space systems and has therefore precedence

over any TR covering the same scope but with a wider domain of applicability (e.g.: aerospace).

This document is currently submitted to the CEN CONSULTATION.
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Scope

Solid-liquid phase-change materials (PCM) are a favoured approach to spacecraft passive thermal

control for incident orbital heat fluxes or when there are wide fluctuations in onboard equipment.

The PCM thermal control system consists of a container which is filled with a substance capable of

undergoing a phase-change. When there is an the increase in surface temperature of spacecraft the

PCM absorbs the excess heat by melting. If there is a temperature decrease, then the PCM can provide

heat by solidifying.

Many types of PCM systems are used in spacecrafts for different types of thermal transfer control.

Characteristics and performance of phase control materials are described in this Part. Existing PCM

systems are also described.
The Thermal design handbook is published in 16 Parts
TR 17603-31-01 Thermal design handbook – Part 1: View factors
TR 17603-31-02 Thermal design handbook – Part 2: Holes, Grooves and Cavities
TR 17603-31-03 Thermal design handbook – Part 3: Spacecraft Surface Temperature
TR 17603-31-04 Thermal design handbook – Part 4: Conductive Heat Transfer

TR 17603-31-05 Thermal design handbook – Part 5: Structural Materials: Metallic and

Composite
TR 17603-31-06 Thermal design handbook – Part 6: Thermal Control Surfaces
TR 17603-31-07 Thermal design handbook – Part 7: Insulations
TR 17603-31-08 Thermal design handbook – Part 8: Heat Pipes
TR 17603-31-09 Thermal design handbook – Part 9: Radiators
TR 17603-31-10 Thermal design handbook – Part 10: Phase – Change Capacitors
TR 17603-31-11 Thermal design handbook – Part 11: Electrical Heating
TR 17603-31-12 Thermal design handbook – Part 12: Louvers
TR 17603-31-13 Thermal design handbook – Part 13: Fluid Loops
TR 17603-31-14 Thermal design handbook – Part 14: Cryogenic Cooling
TR 17603-31-15 Thermal design handbook – Part 15: Existing Satellites
TR 17603-31-16 Thermal design handbook – Part 16: Thermal Protection System
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References
EN Reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS System - Glossary of terms
TR 17603-30-06 ECSS-E-HB-31-01 Part 6 Thermal design handbook – Part 6: Thermal
Control Surfaces

TR 17603-30-11 ECSS-E-HB-31-01 Part 11 Thermal design handbook – Part 11: Electrical

Heating

All other references made to publications in this Part are listed, alphabetically, in the Bibliography.

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Terms, definitions and symbols
3.1 Terms and definitions

For the purpose of this Standard, the terms and definitions given in ECSS-S-ST-00-01 apply.

3.2 Abbreviated terms
The following abbreviated terms are defined and used within this Standard.
air traffic control (aerosat)
ATC
Brennan & Kroliczek
B & K
Gessellschaft für Weltraumforschung
GfW
heat pipe experiment package
HEPP
HLS
international heat pipe experiment
IHPE
institut für kernenenergetik (university of Stuttgart)
IKE
long duration exposure facility
LDEF
methyl-ethyl ketone
MEK
multilayer insulation
MLI
phase-change material
PCM
systems improved numerical differencing analyzer
SINDA
stainless steel
second surface mirror
SSM
stoichiometric day, see clause 8.5
S day
tungsten-inert gas
TIG
television and infra-red observation satellite
TIROS
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tag open cup
TOC
tag closed cup
TCC
transporter heat pipe
TPHP

Other Symbols, mainly used to define the geometry of the configuration, are introduced when

required.
3.3 Symbols
cross-sectional area, [m ]
modulus of elasticity, [Pa]
maximum energy stored in the PCM device, [J]
Emax
thickness of the PCM device
...