EN 61760-2:2007
(Main)Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and 'popcorning'. This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.
Oberflächenmontagetechnik - Teil 2: Transport- und Lagerungsbedingungen von oberflächenmontierbaren Bauelementen (SMD) - Anwendungsleitfaden
Technique du montage en surface - Partie 2: Conditions de transport et de stockage des composants pour montage en surface (CMS) - Guide d'application
La CEI 61760-2:2007 décrit les conditions de transport et de stockage qui sont prises en compte afin de permettre la mise en uvre sans problème des composants pour montage en surface (CMS), tant actifs que passifs (Les conditions pour les cartes à circuits imprimés ne sont pas prises en compte). L'objet de la présente norme est de s'assurer que l'utilisateur de composants pour montage en surface reçoit et emmagasine des produits qui pourront être utilisés (par exemple placés, brasés) sans problème de qualité et de fiabilité. Des conditions de transport et de stockage impropres peuvent provoquer une détérioration des CMS et il en résulte des problèmes d'assemblage tels qu'une mauvaise brasabilité, la séparation des couches métallisées des terminaisons et l'effet 'pop-corn'. Cette deuxième édition annule et remplace la première édition, parue en 1998, et constitue une révision technique. La mise à jour et la révision rédactionnelle de la norme.
Tehnologija površinske montaže – 2. del: Pogoji pri prevažanju in shranjevanju sestavov za površinsko montažo (SMD) – Vodilo za uporabo (IEC 61760-2:2007)
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Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guideTehnologija površinske montaže – 2. del: Pogoji pri prevažanju in shranjevanju sestavov za površinsko montažo (SMD) – Vodilo za uporaboTechnique du montage en surface -- Partie 2: Transport et stockage des composants pour montage en surface (CSM) - Guide d'applicationOberflächenmontagetechnik -- Teil 2: Transport- und Lagerungsbedingungen von oberflächenmontierbaren Bauelementen (SMD) - AnwendungsleitfadenTa slovenski standard je istoveten z:EN 61760-2:2007SIST EN 61760-2:2007en,de31.020Elektronske komponente na splošnoElectronic components in generalICS:SIST EN 61760-2:20011DGRPHãþDSLOVENSKI
STANDARDSIST EN 61760-2:200701-oktober-2007
EUROPEAN STANDARD EN 61760-2 NORME EUROPÉENNE
EUROPÄISCHE NORM June 2007
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2007 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61760-2:2007 E
ICS 31.020 Supersedes EN 61760-2:1998
English version
Surface mounting technology -
Part 2: Transportation and storage conditions
of surface mounting devices (SMD) -
Application guide (IEC 61760-2:2007)
Technique du montage en surface -
Partie 2: Transport et stockage
des composants pour montage
en surface (CSM) -
Guide d'application (CEI 61760-2:2007)
Oberflächenmontagetechnik -
Teil 2: Transport- und Lagerungsbedingungen
von oberflächenmontierbaren Bauelementen (SMD) -
Anwendungsleitfaden (IEC 61760-2:2007)
This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
EN 61760-2:2007
- 2 -
Foreword The text of document 91/569/CDV, future edition 2 of IEC 61760-2, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel Unique Acceptance Procedure and was approved by CENELEC as EN 61760-2 on 2007-05-01. This European Standard supersedes EN 61760-2:1998. The main changes with regard to EN 61760-2:1998 concern: EN 61760-2:2007 was updated and editorially revised. Specific reference is made to: – EN 61340-5-1: Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements – EN 61340-5-2: Electrostatics – Part 5-2: Protection of electronic devices from electrostatic
phenomena – User guide For convenience of the reader, an informative Annex A was added, which contains information about the climatic and mechanical conditions during transportation and storage (extracted from EN 60721-3-1 and EN 60721-3-2). The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2008-02-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2010-05-01 Annex ZA has been added by CENELEC. __________ Endorsement notice The text of the International Standard IEC 61760-2:2007 was approved by CENELEC as a European Standard without any modification. __________
- 3 - EN 61760-2:2007 Annex ZA
(normative)
Normative references to international publications with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE
When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
Publication Year Title EN/HD Year
IEC 60286-3 -1) Packaging of components for automatic handling -
Part 3: Pa
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