SIST EN 62132-8:2012

Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method

This part of IEC 62132 specifies a method for measuring the immunity of an integrated circuit (IC) to radio frequency (RF) radiated electromagnetic disturbances over the frequency range of 150 kHz to 3 GHz.

Integrierte Schaltungen - Messung der elektromagnetischen Störfestigkeit - Teil 8: Messung der Störfestigkeit bei Einstrahlungen - IC-Streifenleiterverfahren

Circuits intégrés - Mesure de l'immunité électromagnétique - Partie 8: Mesure de l'immunité rayonnée - Méthode de la ligne à ruban pour circuit intégré

La CEI 62132-8:2012 définit une méthode de mesure de l'immunité d'un circuit intégré (CI) aux perturbations électromagnétiques rayonnées aux fréquences radioélectriques sur la gamme de fréquences comprise entre 150 kHz et 3 GHz.

Integrirana vezja - Meritve elektromagnetne odpornosti - 8. del: Meritev odpornosti proti sevanju - Metoda z IC na tračnem valovodu

Ta del standarda IEC 62132 določa metodo za merjenje imunosti integriranega vezja (IC) na sevane elektromagnetne motnje radijske frekvence (RF) čez frekvenčni razpon od 150 kHz do 3 GHz.

General Information

• Status: Published
• Publication Date: 25-Oct-2012
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 15-Oct-2012
• Due Date: 20-Dec-2012
• Completion Date: 26-Oct-2012
• Directive: 2004/108/EU - DIRECTIVE 2004/108/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 15 December 2004 on the approximation of the laws of the Member States relating to electromagnetic compatibility and repealing Directive 89/336/EEC
• Ref Project: EN 62132-8:2012 - Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62132-8:2012
01-december-2012
,QWHJULUDQDYH]MD0HULWYHHOHNWURPDJQHWQHRGSRUQRVWLGHO0HULWHYRGSRUQRVWL
SURWLVHYDQMX0HWRGD],&QDWUDþQHPYDORYRGX
Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of
radiated immunity - IC stripline method
Circuits intégrés - Mesure de l'immunité électromagnétique - Partie 8: Mesure de
l'immunité rayonnée - Méthode de la ligne à ruban pour circuit intégré
Ta slovenski standard je istoveten z: EN 62132-8:2012
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
SIST EN 62132-8:2012 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62132-8:2012

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SIST EN 62132-8:2012

EUROPEAN STANDARD
EN 62132-8

NORME EUROPÉENNE
September 2012
EUROPÄISCHE NORM

ICS 31.200


English version


Integrated circuits -
Measurement of electromagnetic immunity -
Part 8: Measurement of radiated immunity -
IC stripline method
(IEC 62132-8:2012)


Circuits intégrés -  Integrierte Schaltungen -
Mesure de l'immunité électromagnétique - Messung der elektromagnetischen
Partie 8: Mesure de l'immunité rayonnée - Störfestigkeit -
Méthode de la ligne TEM à plaques pour Teil 8: Messung der Störfestigkeit bei
circuit intégré Einstrahlungen -
(CEI 62132-8:2012) IC-Streifenleiterverfahren
(IEC 62132-8:2012)





This European Standard was approved by CENELEC on 2012-08-10. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the CEN-CENELEC Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,
Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels


© 2012 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62132-8:2012 E

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SIST EN 62132-8:2012
EN 62132-8:2012 - 2 -
Foreword
The text of document 47A/882/FDIS, future edition 1 of IEC 62132-8, prepared by SC 47A, "Integrated
circuits", of IEC TC 47, "Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 62132-8:2012.

The following dates are fixed:
(dop) 2013-05-10
• latest date by which the document has
to be implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2015-08-10
• latest date by which the national
standards conflicting with the
document have to be withdrawn

This standard is to be used in conjunction with EN 62132-1.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such patent
rights.

Endorsement notice
The text of the International Standard IEC 62132-8:2012 was approved by CENELEC as a European
Standard without any modification.

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SIST EN 62132-8:2012
- 3 - EN 62132-8:2012

Annex ZA
(normative)

Normative references to international publications
with their corresponding European publications

The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.

Publication Year Title EN/HD Year

IEC 60050 Series International Electrotechnical Vocabulary - -


IEC 61000-4-20 2010 Electromagnetic compatibility (EMC) - EN 61000-4-20 2010
Part 4-20: Testing and measurement
techniques - Emission and immunity testing in
transverse electromagnetic (TEM)
waveguides


IEC 62132-1 2006 Integrated circuits - Measurement of EN 62132-1 2006
electromagnetic immunity, + corr. November 2006
150 kHz to 1 GHz -
Part 1: General conditions and definitions

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SIST EN 62132-8:2012

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SIST EN 62132-8:2012




IEC 62132-8

®


Edition 1.0 2012-07




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










Integrated circuits – Measurement of electromagnetic immunity –

Part 8: Measurement of radiated immunity – IC stripline method




Circuits intégrés – Mesure de l'immunité électromagnétique –

Partie 8: Mesure de l’immunité rayonnée – Méthode de la ligne TEM à plaques

pour circuit intégré















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX T


ICS 31.200 ISBN 978-2-83220-206-7



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62132-8:2012
– 2 – 62132-8  IEC:2012

CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General . 7
5 Test conditions . 7
5.1 General . 7
5.2 Supply voltage. 8
5.3 Frequency range . 8
6 Test equipment . 8
6.1 General . 8
6.2 Cables . 8
6.3 Shielding . 8
6.4 RF disturbance generator . 8
6.5 IC stripline . 8
6.6 50 Ω termination . 8
6.7 DUT monitor . 8
7 Test setup . 9
7.1 General . 9
7.2 Test configuration . 9
7.3 EMC test board (PCB) . 9
8 Test procedure . 9
8.1 General . 9
8.2 Operational check . 10
8.3 Immunity measurement . 10
8.3.1 General . 10
8.3.2 RF disturbance signal . 10
8.3.3 Test frequency steps and ranges . 10
8.3.4 Test levels and dwell time . 10
8.3.5 DUT monitoring . 10
8.3.6 Detail procedure . 11
9 Test report. 11
10 RF immunity acceptance level . 11
Annex A (normative) Field strength determination . 12
Annex B (normative) IC stripline descriptions . 15
Annex C (informative) Closed stripline geometrical limitations . 18
Bibliography . 22

Figure 1 – IC stripline test setup . 9
Figure A.1 – Definition of height (h) and width (w) of IC stripline . 12
Figure A.2 – EM field distribution . 13
Figure B.1 – Cross section view of an example of an open IC stripline . 15
Figure B.2 – Cross section view of an example of a closed IC stripline . 16

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SIST EN 62132-8:2012
62132-8  IEC:2012 – 3 –
Figure B.3 – Example of IC stripline with housing . 17
Figure C.1 – Calculated H-field reduction of closed version referenced to referring
open version as a function of portion of active conductor width of closed version to
open version . 20
Figure C.2 – Location of currents and mirrored currents at grounded planes used for
calculation of fields . 21

Table 1 – Frequency step size versus frequency range . 10
Table B.1 – Maximum DUT dimensions for 6,7 mm IC stripline (Open version) . 16
Table B.2 – Maximum DUT dimensions for 6,7 mm IC stripline (Closed version) . 16
Table C.1 – Height of shielding, simulated at h = 6,7mm to achieve practically
bottom
50 Ω system . 19

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SIST EN 62132-8:2012
– 4 – 62132-8  IEC:2012
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC IMMUNITY –

Part 8: Measurement of radiated immunity –
IC stripline method


FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62132-8 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47A/882/FDIS 47A/886/RVD

Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
This part of IEC 62132 is to be read in conjunction with IEC 62132-1.

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SIST EN 62132-8:2012
62132-8  IEC:2012 – 5 –
A list of all the parts in the IEC 62132 series, published under the general title Integrated
circuits – Measurement of electromagnetic immunity, can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.

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SIST EN 62132-8:2012
– 6 – 62132-8  IEC:2012
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC IMMUNITY –

Part 8: Measurement of radiated immunity –
IC stripline method



1 Scope
This part of IEC 62132 specifies a method for measuring the immunity of an integrated circuit
(IC) to radio frequency (RF) radiated electromagnetic disturbances over the frequency range
of 150 kHz to 3 GHz.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050 (all parts), International Electrotechnical Vocabulary (available at
http://www.electropedia.org)
IEC 62132-1:2006, Integrated circuits – Measurement of electromagnetic immunity, 150 kHz
to 1 GHz – Part 1: General conditions and definitions
IEC 61000-4-20, Electromagnetic compatibility (EMC) – Part 4-20: Testing and measurement
techniques – Emission and immunity testing in transverse electromagnetic (TEM) waveguides
3 Terms and definitions
For the purpose of this document, the terms and definitions given in IEC 62132-1:2006,
Clause 3, IEC 60050-131 and IEC 60050-161, and the following, apply.
3.1
transverse electromagnetic mode
TEM
waveguide mode in which the components of the electric and magnetic fields in the
propagation direction are much less than the primary field components across any transverse
cross-section
Note 1 to entry: This note only applies to the French language.
3.2
TEM waveguide
open or closed transmission line system, in which a wave is propagating in the transverse
electromagnetic mode to produce a specified field for testing purposes
3.3
IC stripline
TEM waveguide, consisting of an active conductor placed on a defined spacing over an
enlarged ground plane, connected to a port structure on each end and an optional shielded
enclosure

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SIST EN 62132-8:2012
62132-8  IEC:2012 – 7 –
Note 1 to entry: This arrangement guides a wave propagation in the transverse electromagnetic mode to produce a
specific field for testing purposes between the active conductor and the enlarged ground plane. The ground plane
of the standard EMC test board according to IEC 62132-1:2006, Annex B, should be used. An optional shielding
enclosure may be used for fixing the IC stripline configuration and for shielding purposes. This leads to a closed
version of the IC stripline in opposite to the open version without shielding enclosure. For further information see
Annex A.
3.4
two-port TEM waveguide
TEM waveguide with input/output measurement ports at both ends
3.5
characteristic impedance
magnitude of the ratio of the voltage between the active conductor and the corresponding
ground plane to the current on either conductor for any constant phase wave-front
Note 1 to entry: The characteristic impedance is independent of the voltage/current magnitudes and depends only
on the cross sectional geometry of the transmission line. TEM waveguides are typically designed to have a 50 Ω
characteristic impedance. For further information and equation to stripline arrangements see Annex A.
3.6
primary field component
primary component
electric field component aligned with the intended test polarization
Note 1 to entry: For example, in IC stripline, the active conductor is parallel to the horizontal floor, and the primary
mode electric field vector is vertical at the transverse centre of the IC stripline.
4 General
An IC to be evaluated for EMC performance is referred to as a device under test (DUT). The
DUT should be mounted on an EMC test board according to IEC 62132-1. The EMC test
board is provided with the appropriate measurement or monitoring points at which the DUT
response parameters can be measured. It controls the geometry and orientation of the DUT
relative to the active conductor and eliminates in the case of a closed version of the IC
stripline any connecting leads within the housing (these are on the backside of the board,
which is outside the housing).
For the IC stripline, one of the 50 Ω ports is terminated with a 50 Ω load. The other 50 Ω port
is connected to the output of an RF disturbance generator. The injected RF disturbance signal
exposes the DUT to an electromagnetic field determined by the injected power, the typical
impedance and the distance between the ground plane of the EMC test board and the active
conductor of the IC stripline. The relationship is given in Annex A.
Rotating the EMC test board in the four possible orientations in the aperture to accept EMC
test board of the IC stripline will affect the sensitivity of the DUT. Dependent upon the DUT,
the response parameters of the DUT may vary (e.g. a change of current consumption,
deterioration in function performance, waveform jitter). The intent of this test method is to
provide a quantitative measure of the RF immunity of DUTs for comparison or other purposes.
For further information see Annex A.
5 Test conditions
5.1 General
The test conditions shall meet the requirements as described in IEC 62132-1:2006, Clause 4.
In addition, the following test conditions shall apply.

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SIST EN 62132-8:2012
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5.2 Supply voltage
The supply voltage shall be as specified by the IC manufacturer. If the users of this procedure
agree to other values, they shall be documented in the test report.
5.3 Frequency range
The effective frequency range of this radiated immunity procedure is 150 kHz to 3 GHz.
6 Test equipment
6.1 General
The test equipment shall meet the requirements described in IEC 62132-1:2006, Clause 5. In
addition, the following test equipment requirements shall apply.
6.2 Cables
Double shielded or semi-rigid coaxial cable may be required depending on the local ambient
conditions.
6.3 Shielding
Testing in a shielded room is only necessary for the open IC stripline version. The closed
version of the IC stripline is shielded by its housing.
6.4 RF disturbance generator
An RF disturbance generator with sufficient power handling capabilities shall be used. The RF
disturbance generator may comprise an RF signal source with a modulation function, an RF
power amplifier. The voltage standing wave ratio (VSWR) at the output of the RF disturbance
generator shall be less than 1,5 over the frequency range being measured.
The gain (or attenuation) of the RF disturbance generating equipment, without the IC stripline,
shall be known with an accuracy ±0,5 dB.
6.5 IC stripline
The IC stripline (open or closed version) used for this test procedure shall be fitted with an
aperture to mate with the EMC test board. The IC stripline shall not exhibit higher order
modes over the frequency range being measured. For this procedure, the IC stripline
frequency range is 150 kHz to 3 GHz. The VSWR over the frequency range of the empty IC
stripline being measured shall be less than 1,25.
For further information as to field strength determination, IC stripline designs and the
limitation of geometrical dimensions of closed version, see Annexes A, B and C.
Ω termination
6.6 50
A 50 Ω termination with a VSWR less than 1,1 and sufficient power handling capabilities over
the frequency range of measurement is recommended for the IC stripline 50 Ω port not
connected to the RF disturbance generator.
6.7 DUT monitor
The performance of the DUT shall be monitored for indications of performance degradation.
The monitoring equipment shall not be adversely affected by the injected RF disturbance
signal.

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SIST EN 62132-8:2012
62132-8  IEC:2012 – 9 –
7 Test setup
7.1 General
A test setup shall meet the requirements described in IEC 62132-1:2006, Clause 6. In
addition, the following test setup requirements shall apply.
7.2 Test configuration
See Figure 1 for IC stripline test configurations. One of the IC stripline 50 Ω ports is
terminated with a 50 Ω load. The other IC stripline 50 Ω port is connected to the output port of
the RF disturbance generator.


DUT monitor/
RF generator Power supply
stimulation
RF amplifier
P
forward
Power meter EMC test
board
P Port 2
reverse
(RF connector)
Directional

coupler
Port 1
(RF connector) 50 Ω
termination
DUT
IC stripline
IEC  1181/12

Figure 1 – IC stripline test setup
For further information and cross section view of IC stripline see Annex B.
7.3 EMC test board (PCB)
The EMC test board shall be designed in accordance with the requirements in IEC 62132-1.
8 Test procedure
8.1 General
Test procedure shall be in accordance with IEC 62132-1:2006, Clause 7, except as modified
herein. These default test conditions are intended to assure a consistent test environment.
The following steps shall be performed:
a) Operational check (see 8.2)
b) Immunity measurement (see 8.3)
If the users of this procedure agree to other conditions, they shall be documented in the test
report.

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8.2 Operational check
Energize the DUT and complete an operational check to verify proper function of the device
(i.e. run DUT test code) in the ambient test condition. During the operational check, the RF
disturbance generator and any monitoring equipment shall be powered; however, the output
of the RF disturbance generator shall be disabled. The performance of the DUT shall not be
degraded by ambient conditions.
8.3 Immunity measurement
8.3.1 General
With the EMC test board energized and the DUT operated in the intended test mode, measure
the immunity to the injected RF disturbance signal over the desired frequency range.
8.3.2 RF disturbance signal
The RF disturbance signal may be:
• CW (continuous wave, no modulation)
• sinusoidal modulated with 80 % amplitude modulated by a 1 kHz sine wave, and
• pulse modulated with 50 % duty cycle and 1 kHz pulse repetition rate.
8.3.3 Test frequency steps and ranges
The RF immunity of the DUT is generally evaluated in the frequency range from 150 kHz to
3 GHz. The frequencies to be tested shall be generated from the requirements specified in
Table 1.
Table 1 – Frequency step size versus frequency range
Frequency range (MHz) 0,15 – 1 1 – 100 100 – 1000 1000-3000
Linear steps (MHz)
≤0,1 ≤1 ≤10 ≤20
Logarithmic steps
≤5 % increment

In addition, the RF immunity of the DUT shall be evaluated at critical frequencies. Critical
frequencies are frequencies that are generated by, received by, or operated on by the DUT.
Critical frequencies include but are not limited to crystal frequencies, oscillator frequencies,
clock frequencies, data frequencies, etc.
8.3.4 Test levels and dwell time
The applied test level shall be increased in steps until a malfunction is observed or the
maximum signal generator setting (test level) is reached. The step size and test level shall be
documented in the test report.
At each test level and frequency, the RF disturbance signal shall be applied for the time
necessary for the DUT to respond and the monitoring system to detect any performance
degradation (typically 1 s).
8.3.5 D
...