SIST-TS ES 59008-3:2007
(Main)Data requirements for semiconductor die -- Part 3: Mechanical, material and connectivity requirements
Data requirements for semiconductor die -- Part 3: Mechanical, material and connectivity requirements
This part has been developed to facilitate the production, supply and use of semiconductor die products, including- wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers.This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including- product identity, - product data, - die mechanical information, - test, quality, assembly and reliability information, - handling, shipping and storage information.
Zahtevani podatki za polprevodniška integrirana vezja - 3. del: Mehanske zahteve ter zahteve za materiale in povezljivost
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST-TS ES 59008-3:2007
01-januar-2007
Zahtevani podatki za polprevodniška integrirana vezja - 3. del: Mehanske zahteve
ter zahteve za materiale in povezljivost
Data requirements for semiconductor die -- Part 3: Mechanical, material and connectivity
requirements
Ta slovenski standard je istoveten z: ES 59008-3:1999
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST-TS ES 59008-3:2007 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------
SIST-TS ES 59008-3:2007
---------------------- Page: 2 ----------------------
SIST-TS ES 59008-3:2007
---------------------- Page: 3 ----------------------
SIST-TS ES 59008-3:2007
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.