SIST EN 50310:2016/A2:2026

• Abstract:

  This document specifies requirements and provides recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information or telecommunications technology equipment is intended to be installed in order to:; a) minimise the d.c. and a.c. potential differences in order to reduce the risk of malfunction of that equipment and interconnecting cabling due to electromagnetic disturbance;; b) provide the telecommunications installation with a reliable signal reference – which may improve immunity from electromagnetic interference (EMI).; The requirements of this European Standard are applicable to the buildings and other structures within premises addressed by EN 50174-2 (e.g. residential, office, industrial and data centres) but information given in this European Standard may be of assistance for other types of buildings and structures.; NOTE Telecommunications centres (operator buildings) are addressed by ETSI/EN 300 253.; This European Standard does not apply to power supply distribution of voltages over AC 1 000 V.; Electromagnetic compatibility (EMC) requirements and safety requirements for power supply installation are outside the scope of this European Standard and are covered by other standards and regulations. However, information given in this European Standard may be of assistance in meeting the requirements of these standards and regulations.

• Status: Not Published
• Public Enquiry End Date: 30-Mar-2026
• ICS: 29.120.50 - Fuses and other overcurrent protection devices
• ICS: 35.020 - Information technology (IT) in general
• ICS: 91.140.50 - Electricity supply systems
• Technical Committee: ELI - Electrical and communication installations
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 24-Jul-2026
• Due Date: 28-Sep-2026
• Ref Project: EN 50310:2016/A2:2026 - Telecommunications bonding networks for buildings and other structures

• Amends: SIST EN 50310:2016 - Telecommunications bonding networks for buildings and other structures
• Effective Date: 13-Aug-2024

Overview

SIST EN 50310:2016/A2:2026 is a European standard that specifies the requirements and provides recommendations for the design and installation of telecommunications bonding networks in buildings and other structures. Developed by SIST in collaboration with CENELEC, this standard focuses on methods to minimize d.c. and a.c. potential differences, reducing electromagnetic disturbances that could affect telecommunications and IT equipment. It supports the establishment of a reliable signal reference, improving immunity to electromagnetic interference (EMI) in various building types, including residential, office, industrial, and data centers.

This standard is relevant when information or telecommunications technology equipment is installed during either new construction or refurbishment projects. The guidelines assist in supporting proper bonding and grounding to protect the functionality and safety of interconnected telecommunications systems.

Key Topics

• Bonding and Grounding Requirements

  • Guidance for connecting electrically conductive elements to minimize potential differences.
  • Recommendations for integrating bonding networks into building infrastructure at design and installation phases.

• Reduction of Electromagnetic Disturbance

  • Strategies for lowering the risk of malfunction in equipment and cabling due to EMI.
  • Establishment of a reliable signal reference for telecommunications installations.

• Types of Bonding Networks

  • Identification and application of different network types: star, ring, local mesh, and mesh configurations.
  • Selection criteria based on sensitivity and operational requirements.

• Documentation and Compliance

  • Emphasis on comprehensive documentation (technical drawings, layouts, schematics) for bonding systems.
  • Encouragement to use electronic and AIM-compliant documentation platforms.

• Applicable Building Types

  • Application in residential, office, industrial, and data centers, with adaptability for other structures.

• Normative References and Integration

  • Alignment and cross-reference with related standards (for example, EN 50174-2 for cabling installation).

Applications

The implementation of SIST EN 50310:2016/A2:2026 delivers practical value in multiple contexts:

• Commercial Properties: Ensures that office buildings and data centers have robust bonding and grounding, vital for stable telecommunications networks and IT system operations.
• Industrial Facilities: Supports EMI management in environments with high levels of electrical activity, helping to maintain equipment functionality and safety.
• Residential Developments: Increases the reliability of telecommunications services, which is especially important for smart home technologies.
• Data Centers: Provides a foundation for enhanced uptime and operational continuity by mitigating potential differences and EMI.
• Refurbishments and Retrofits: Guidance can be leveraged during system upgrades or rebuilds, minimizing disruptions to ongoing IT services.

By following this standard, property owners, facility managers, electrical engineers, and installers can minimize service disruptions, improve safety, and future-proof facilities for evolving telecommunications needs.

Related Standards

Implementing SIST EN 50310:2016/A2:2026 is often part of a broader approach to telecommunications infrastructure, typically used in conjunction with:

• EN 50174-2:2018 - Cabling installation planning and best practices inside buildings
• EN 50173 series - General requirements for information technology cabling
• EN IEC 62368-1 - Safety requirements for audio/video, information, and communication technology equipment
• EN 50667 - Automated infrastructure management (AIM) systems requirements and applications

Other relevant references include standards for power distribution and electromagnetic compatibility (EMC), though these topics are addressed separately.

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Keywords: telecommunications bonding network, building grounding, potential equalization, electromagnetic interference mitigation, IT equipment installation, structured cabling standards, telecommunications infrastructure, SIST EN 50310

SLOVENSKI STANDARD
SIST EN 50310:2016/oprA2:2026
01-marec-2026
Izenačitev potencialov in ozemljevanje v stavbah z opremo informacijske
tehnologije - Dopolnilo A2
Telecommunications bonding networks for buildings and other structures
Anwendung von Maßnahmen für Erdung und Potentialausgleich in Gebäuden mit
Einrichtungen der Informationstechnik
Application de liaison équipotentielle et de la mise à la terre dans les locaux avec
équipement de technologie de l'information
Ta slovenski standard je istoveten z: EN 50310:2016/prA2:2026
ICS:
35.020 Informacijska tehnika in Information technology (IT) in
tehnologija na splošno general
91.140.50 Sistemi za oskrbo z elektriko Electricity supply systems
SIST EN 50310:2016/oprA2:2026 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

SIST EN 50310:2016/oprA2:2026
SIST EN 50310:2016/oprA2:2026
EUROPEAN STANDARD DRAFT
EN 50310:2016
NORME EUROPÉENNE
EUROPÄISCHE NORM
prA2
January 2026
ICS 29.120.50; 91.140.50 -
English Version
Telecommunications bonding networks for buildings and other
structures
Application de liaison équipotentielle et de la mise à la terre Anwendung von Maßnahmen für Erdung und
dans les locaux avec équipement de technologie de Potentialausgleich in Gebäuden mit Einrichtungen der
l'information Informationstechnik
This draft amendment prA2, if approved, will modify the European Standard EN 50310:2016; it is submitted to CENELEC members for
enquiry.
Deadline for CENELEC: 2026-04-10.

It has been drawn up by CLC/TC 215.

If this draft becomes an amendment, CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which
stipulate the conditions for giving this amendment the status of a national standard without any alteration.

This draft amendment was established by CENELEC in three official versions (English, French, German).
A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to
the CEN-CENELEC Management Centre has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Türkiye and the United Kingdom.

Recipients of this draft are invited to submit, with their comments, notification of any relevant patent rights of which they are aware and to
provide supporting documentation.

Warning : This document is not a European Standard. It is distributed for review and comments. It is subject to change without notice and
shall not be referred to as a European Standard.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2026 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Project: 80515 Ref. No. EN 50310:2016/prA2:2026 E

SIST EN 50310:2016/oprA2:2026
EN 50310:2016/prA2:2026 (E)
1Cont ents Page
2 European foreword . 3
3 1 Modifications to the Introduction . 4
4 2 Modifications to Clause 1, Scope . 4
5 3 Modifications to Clause 2, Normative references . 5
6 4 Modifications to Clause 3, Terms, definitions and abbreviations . 5
7 5 Modifications to Clause 5, Overview of bonding networks . 5
8 6 Modifications to 6.1, Assessment of the impact of the telecommunications bonding
9 network on the interconnection of telecommunications equipment . 6
10 7 Modifications to 7.4.1.2, Installation . 6
11 8 Modification to 7.4.2, Telecommunications bonding network connections . 7
12 9 Modifications to 7.5.2.2, Rack bonding conductors (RBC) for impedance control . 7
13 10 Modification to 7.5.3, Internal connections . 7
14 11 Modifications to 7.6.3 — Bonding conductors for impedance control . 7
15 12 Modification to 7.7 — Documentation . 7
16 13 Modifications to 8.2.4.1 — Telecommunications bonding backbone (TBB) . 7
17 14 Modifications to 8.3.1 — Primary bonding busbar (PBB) . 8
18 15 Modifications to 8.3.4 — Telecommunications bonding backbone (TBB) . 8
19 16 Modification to 8.3.7 — Bonds to structural metal . 8
20 17 Modifications to 9.2.2 — Bonding conductors for impedance control . 8
21 18 Modifications to 10.2.2 — TEBC for impedance control . 8
22 19 Modification to 11.2.1.1 — Requirements . 8
23 20 Modifications to 11.3 — Bonding conductors of a mesh bonding network . 8
24 21 Modification to A.3.2 — Requirements . 9
25 22 Modifications to the Bibliography . 9
SIST EN 50310:2016/oprA2:2026
EN 50310:2016/prA2:2026 (E)
27 European foreword
28 This document (EN 50310:2016/prA2:2026) has been prepared by CLC/TC 215 “Electrotechnical
29 aspects of telecommunication equipment”.
30 This document is currently submitted to the Enquiry.
31 The following dates are proposed:
• latest date by which the existence of this (doa) dav + 6 months
document has to be announced at national
level
• latest date by which this document has to be (dop) dav + 12 months
implemented at national level by publication of
an identical national standard or by
endorsement
• latest date by which the national standards (dow) dav + 36 months
conflicting with this document have to be (to be confirmed or
withdrawn modified when voting)
SIST EN 50310:2016/oprA2:2026
EN 50310:2016/prA2:2026 (E)
33 1 Modifications to the Introduction
34 Replace Figure 1 with the following figure:
36 Replace Table 1 with the following table:
Building design Generic cabling Specification Installation Operation phase
phase design phase phase phase
EN 50173-2 EN 50174-1
EN 50173-3
Planning phase
EN 50173-4
EN 50173-5
EN 50174-2
EN 50173-6
EN 50174-3
EN 50310 EN 50174-1
EN 50174-4
EN 50173-10 EN 50174-2
EN 50310
EN 50174-3
EN 50173-20
EN 50310
(these ENs
reference general
requirements of
EN 50173-1)
37 2 Modifications to Clause 1, Scope
38 Replace the first paragraph and the list item a) with:
39 This document specifies requirements and provides recommendations for the design and installation of
40 connections (bonds) between various electrically conductive elements in buildings and other structures,
41 during their construction or refurbishment, in which information or telecommunications technology
42 equipment is intended to be installed in order to:
43 a) minimise the d.c. and a.c. potential differences in order to reduce the risk of malfunction of that
44 equipment and interconnecting cabling due to electromagnetic disturbance;
SIST EN 50310:2016/oprA2:2026
EN 50310:2016/prA2:2026 (E)
45 3 Modifications to Clause 2, Normative references
46 Replace the references “EN 50174-2:2009” and “EN 50174-2:2009/A1:2011” with the following:
47 “EN 50174-2:2018, Information technology - Cabling installation - Part 2: Installation planning and
48 practices inside buildings”
49 4 Modifications to Clause 3, Terms, definitions and abbreviations
50 In 3.1, modify the following terms and definitions and add at the end of the list:
51 Replace definition 3.1.1 with:
52 “3.1.1
53 access provider
54 operator or another entity providing the means to enable external telecom
...