SIST EN IEC 62680-1-2:2021
(Main)Universal serial bus interfaces for data and power - Part 1-2: Common components - USB Power Delivery specification (IEC 62680-1-2:2021)
Universal serial bus interfaces for data and power - Part 1-2: Common components - USB Power Delivery specification (IEC 62680-1-2:2021)
This specification is intended as an extension to the existing [USB 2.0], [USB 3.2], [USB Type-C 2.0] and
[USBBC 1.2] specifications. It addresses only the elements required to implement USB Power Delivery. It
is targeted at power supply vendors, manufacturers of [USB 2.0], [USB 3.2], [USB Type-C 2.0] and [USBBC
1.2] Platforms, Devices and cable assemblies.
Normative information is provided to allow interoperability of components designed to this specification.
Informative information, when provided, illustrates possible design implementation.
Schnittstellen des Universellen Seriellen Busses für Daten und Energie - Teil 1-2: Gemeinsame Komponenten - Festlegung für die USB-Stromversorgung (IEC 62680-1-2:2021)
Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie 1-2: Composants communs - Spécification de l'alimentation électrique par port USB (IEC 62680-1-2:2021)
IEC 62680-1-2:2021 définit un système d'alimentation électrique par port USB qui couvre tous les éléments d'un système USB, y compris: hôtes, dispositifs, hubs, chargeurs et assemblages de câbles. La présente spécification décrit l'architecture, les protocoles, le comportement de l'alimentation électrique, les connecteurs et le câblage nécessaires à la gestion de l'alimentation électrique sur USB jusqu'à 100W. Cette spécification est destinée à être entièrement compatible avec les infrastructures USB existantes et à en assurer une extension. Il est prévu que cette spécification offre aux OEM de systèmes, ainsi qu'aux développeurs d'alimentations électriques et de périphériques, une souplesse appropriée pour une polyvalence des produits et leur différenciation sur le marché, sans perdre en compatibilité ascendante.
IEC 62680-1-2:2021 annule et remplace la quatrième édition publiée en 2019, dont elle constitue une révision technique.
Vmesniki univerzalnega serijskega vodila za prenos podatkov in napajanje - 1-2. del: Skupne komponente - Specifikacija za zagotavljanje napajanja prek USB (IEC 62680-1-2:2021)
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN IEC 62680-1-2:2021
01-december-2021
Nadomešča:
SIST EN IEC 62680-1-2:2020
Vmesniki univerzalnega serijskega vodila za prenos podatkov in napajanje - 1-2.
del: Skupne komponente - Specifikacija za zagotavljanje napajanja prek USB (IEC
62680-1-2:2021)
Universal serial bus interfaces for data and power - Part 1-2: Common components -
USB Power Delivery specification (IEC 62680-1-2:2021)
Schnittstellen des Universellen Seriellen Busses für Daten und Energie - Teil 1-2:
Gemeinsame Komponenten - Festlegung für die USB-Stromversorgung (IEC 62680-1-
2:2021)
Interfaces de bus universel en série pour les données et l'alimentation électrique - Partie
1-2: Composants communs - Spécification de l'alimentation électrique par port USB (IEC
62680-1-2:2021)
Ta slovenski standard je istoveten z: EN IEC 62680-1-2:2021
ICS:
35.200 Vmesniška in povezovalna Interface and interconnection
oprema equipment
SIST EN IEC 62680-1-2:2021 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN IEC 62680-1-2:2021
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SIST EN IEC 62680-1-2:2021
EUROPEAN STANDARD EN IEC 62680-1-2
NORME EUROPÉENNE
EUROPÄISCHE NORM
April 2021
ICS 29.220; 33.120; 35.200 Supersedes EN IEC 62680-1-2:2020 and all of its
amendments and corrigenda (if any)
English Version
Universal serial bus interfaces for data and power - Part 1-2:
Common components - USB Power Delivery specification
(IEC 62680-1-2:2021)
Interfaces de bus universel en série pour les données et Schnittstellen des Universellen Seriellen Busses für Daten
l'alimentation électrique - Partie 1-2: Composants communs und Energie - Teil 1-2: Gemeinsame Komponenten -
- Spécification de l'alimentation électrique par port USB Festlegung für die USB-Stromversorgung
(IEC 62680-1-2:2021) (IEC 62680-1-2:2021)
This European Standard was approved by CENELEC on 2021-04-20. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2021 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62680-1-2:2021 E
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SIST EN IEC 62680-1-2:2021
EN IEC 62680-1-2:2021 (E)
European foreword
The text of document 100/3440/CDV, future edition 5 of IEC 62680-1-2, prepared by IEC/TC 100
"Audio, video and multimedia systems and equipment" was submitted to the IEC-CENELEC parallel
vote and approved by CENELEC as EN IEC 62680-1-2:2021.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2022-01-20
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2024-04-20
document have to be withdrawn
This document supersedes EN IEC 62680-1-2:2020 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62680-1-2:2021 was approved by CENELEC as a
European Standard without any modification.
2
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SIST EN IEC 62680-1-2:2021
IEC 62680-1-2
®
Edition 5.0 2021-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Universal serial bus interfaces for data and power
Part 1-2: Common components – USB Power Delivery specification
Interfaces de bus universel en série pour les données et l'alimentation électrique
Partie 1-2: Composants communs – Spécification de l'alimentation électrique
par port USB
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.220; 33.120; 35.200 ISBN 978-2-8322-9288-4
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN IEC 62680-1-2:2021
– 2 – IEC 62680-1-2:2021 © IEC 2021
© USB 3.0 Promoter Group: 2010-2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER
Part 1-2: Common components – USB Power Delivery specification
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62680-1-2 has been prepared by technical area 18: Multimedia
home systems and applications for end-user networks, of IEC technical committee 100: Audio,
video and multimedia systems and equipment.
The text of this standard was prepared by the USB Implementers Forum (USB-IF). The structure
and editorial rules used in this publication reflect the practice of the organization which
submitted it.
The text of this International Standard is based on the following documents:
CDV Report on voting
100/3440/CDV 100/3505/RVC
Full information on the voting for the approval of this International Standard can be found in the
report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
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SIST EN IEC 62680-1-2:2021
IEC 62680-1-2:2021 © IEC 2021 – 3 –
© USB 3.0 Promoter Group: 2010-2019
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.
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SIST EN IEC 62680-1-2:2021
– 4 – IEC 62680-1-2:2021 © IEC 2021
© USB 3.0 Promoter Group: 2010-2019
INTRODUCTION
The IEC 62680 series is based on a series of specifications that were originally developed by the USB
Implementers Forum (USB-IF). These specifications were submitted to the IEC under the auspices of
a special agreement between the IEC and the USB-IF.
This standard is the USB-IF publication Universal Serial Bus Power Delivery Specification Revision
3.0, Version 2.0.
The USB Implementers Forum, Inc.(USB-IF) is a non-profit corporation founded by the group of
companies that developed the Universal Serial Bus specification. The USB-IF was formed to provide a
support organization and forum for the advancement and adoption of Universal Serial Bus technology.
The Forum facilitates the development of high-quality compatible USB peripherals (devices), and
promotes the benefits of USB and the quality of products that have passed compliance testing.
ANY USB SPECIFICATIONS ARE PROVIDED TO YOU "AS IS, "WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT,
OR FITNESS FOR ANY PARTICULAR PURPOSE. THE USB IMPLEMENTERS FORUM AND THE
AUTHORS OF ANY USB SPECIFICATIONS DISCLAIM ALL LIABILITY, INCLUDING LIABILITY
FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR
IMPLEMENTATION OR INFORMATION IN THIS SPECIFICAITON.
THE PROVISION OF ANY USB SPECIFICATIONS TO YOU DOES NOT PROVIDE YOU WITH ANY
LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS.
Entering into USB Adopters Agreements may, however, allow a signing company to participate in a
reciprocal, RAND-Z licensing arrangement for compliant products. For more information, please see:
https://www.usb.org/documents
IEC DOES NOT TAKE ANY POSITION AS TO WHETHER IT IS ADVISABLE FOR YOU TO ENTER
INTO ANY USB ADOPTERS AGREEMENTS OR TO PARTICIPATE IN THE USB IMPLEMENTERS
FORUM.
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SIST EN IEC 62680-1-2:2021
IEC 62680-1-2:2021 © IEC 2021 – 5 –
© USB 3.0 Promoter Group: 2010-2019
Universal Serial Bus
Power Delivery Specification
Revision: 3.0
Version: 2.0
Release date: 29 August 2019
Page 5 USB Power Delivery Specification Revision 3.0, Version 2.0
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SIST EN IEC 62680-1-2:2021
– 6 – IEC 62680-1-2:2021 © IEC 2021
© USB 3.0 Promoter Group: 2010-2019
LIMITED COPYRIGHT LICENSE
THE USB 3.0 PROMOTERS GRANT A CONDITIONAL COPYRIGHT LICENSE UNDER THE COPYRIGHTS
EMBODIED IN THE USB POWER DELIVERY SPECIFICATION TO USE AND REPRODUCE THE
SPECIFICATION FOR THE SOLE PURPOSE OF, AND SOLELY TO THE EXTENT NECESSARY FOR,
EVALUATING WHETHER TO IMPLEMENT THE SPECIFICATION IN PRODUCTS THAT WOULD COMPLY
WITH THE SPECIFICATION. WITHOUT LIMITING THE FOREGOING, USE THE OF SPECIFICATION FOR
THE PURPOSE OF FILING OR MODIFYING ANY PATENT APPLICATION TO TARGET THE SPECIFICATION
OR USB COMPLIANT PRODUCTS IS NOT AUTHORIZED. EXCEPT FOR THIS EXPRESS COPYRIGHT LICENSE,
NO OTHER RIGHTS OR LICENSES ARE GRANTED, INCLUDING WITHOUT LIMITATION ANY PATENT
LICENSES. IN ORDER TO OBTAIN ANY ADDITIONALY INTELLECTUAL PROPERTY LICENSES OR
LICENSING COMMITMENTS ASSOCIATED WITH THE SPECIFICATION A PARTY MUST EXECUTE THE USB
3.0 ADOPTERS AGREEMENT. NOTE: BY USING THE SPECIFICATION, YOU ACCEPT THESE LICENSE
TERMS ON YOUR OWN BEHALF AND, IN THE CASE WHERE YOU ARE DOING THIS AS AN EMPLOYEE, ON
BEHALF OF YOUR EMPLOYER.
INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER, INCLUDING
ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR
PURPOSE. THE AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR
INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR IMPLEMENTATION OF
INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS SPECIFICATION TO YOU DOES NOT
PROVIDE YOU WITH ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS.
Please send comments via electronic mail to techsup@usb.org
For industry information, refer to the USB Implementers Forum web page at http://www.usb.org
USB Type-C® and USB4™ are trademarks of the Universal Serial Bus Implementers Forum (USB-IF).
Thunderbolt™ is a trademark of Intel Corporation.
You may only use the Thunderbolt™ trademark or logo in conjunction with products designed to this
specification that complete proper certification and executing a Thunderbolt™ trademark license – see
http://usb.org/compliance for further information.
All product names are trademarks, registered trademarks, or service marks of their respective owners.
Copyright © 2010-2019, USB 3.0 Promoter Group: Apple Inc., Hewlett-Packard Inc., Intel Corporation,
Microsoft Corporation, Renesas, STMicroelectronics, and Texas Instruments.
All rights reserved.
Page 6 USB Power Delivery Specification Revision 3.0, Version 2.0
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SIST EN IEC 62680-1-2:2021
IEC 62680-1-2:2021 © IEC 2021 – 7 –
© USB 3.0 Promoter Group: 2010-2019
Chairs
Alvin Cox Cabling Sub-Chair
Bob Dunstan Specification Chair/Protocol Subgroup Chair
Deric Waters PHY Chair
Ed Berrios Power Supply Chair
Rahman Ismail System Policy Chair
Richard Petrie Specification Chair/Device Policy Chair
Editors
Bob Dunstan
Richard Petrie
Contributors
Page 7 USB Power Delivery Specification Revision 3.0, Version 2.0
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SIST EN IEC 62680-1-2:2021
– 8 – IEC 62680-1-2:2021 © IEC 2021
© USB 3.0 Promoter Group: 2010-2019
Charles Wang ACON, Advanced-Connectek, Inc. Jie min Cadence Design Systems, Inc.
Conrad Choy ACON, Advanced-Connectek, Inc. Mark Summers Cadence Design Systems, Inc.
Dennis Chuang ACON, Advanced-Connectek, Inc. Michal Staworko Cadence Design Systems, Inc.
Steve Sedio ACON, Advanced-Connectek, Inc. Sathish Kumar Ganesan Cadence Design Systems, Inc.
Sunney Yang ACON, Advanced-Connectek, Inc. Alessandro Ingrassia Canova Tech
Vicky Chuang ACON, Advanced-Connectek, Inc. Andrea Colognese Canova Tech
Joseph Scanlon Advanced Micro Devices Antonio Orzelli Canova Tech
Caspar Lin Allion Labs, Inc. Davide Ghedin Canova Tech
Casper Lee Allion Labs, Inc. Matteo Casalin Canova Tech
Danny Shih Allion Labs, Inc. Michael Marioli Canova Tech
Howard Chang Allion Labs, Inc. Nicola Scantamburlo Canova Tech
Greg Stewart Analogix Semiconductor, Inc. Paolo Pilla Canova Tech
Mehran Badii Analogix Semiconductor, Inc. Yi-Feng Lin Canyon Semiconductor
Alexei Kosut Apple YuHung Lin Canyon Semiconductor
Bill Cornelius Apple David Tsai Chrontel, Inc.
Carlos Colderon Apple Anshul Gulati Cypress Semiconductor
Chris Uiterwijk Apple Anup Nayak Cypress Semiconductor
Colin Whitby-Strevens Apple Benjamin Kropf Cypress Semiconductor
Corey Axelowitz Apple Dhanraj Rajput Cypress Semiconductor
Corey Lange Apple Ganesh Subramaniam Cypress Semiconductor
Dave Conroy Apple Jagadeesan Raj Cypress Semiconductor
David Sekowski Apple Junjie cui Cypress Semiconductor
Girault Jones Apple Manu Kumar Cypress Semiconductor
James Orr Apple Muthu M Cypress Semiconductor
Jason Chung Apple Nicholas Bodnaruk Cypress Semiconductor
Jay Kim Apple Pradeep Bajpai Cypress Semiconductor
Jeff Wilcox Apple Rajaram R Cypress Semiconductor
Jennifer Tsai Apple Rama Vakkantula Cypress Semiconductor
Karl Bowers Apple Rushil Kadakia Cypress Semiconductor
Keith Porthouse Apple Simon Nguyen Cypress Semiconductor
Kevin Hsiue Apple Steven Wong Cypress Semiconductor
Matt Mora Apple Subu Sankaran Cypress Semiconductor
Paul Baker Apple Sumeet Gupta Cypress Semiconductor
Reese Schreiber Apple Tejender Sheoran Cypress Semiconductor
Ruchi Chaturvedi Apple Venkat Mandagulathar Cypress Semiconductor
Sameer Kelkar Apple Xiaofeng Shen Cypress Semiconductor
Sasha Tietz Apple Zeng Wei Cypress Semiconductor
Scott Jackson Apple Adie Tan Dell Inc.
Sree Raman Apple Adolfo Montero Dell Inc.
William Ferry Apple Bruce Montag Dell Inc.
Zaki Moussaoui Apple Gary Verdun Dell Inc.
Jeff Liu ASMedia Technology Inc. Marcin Nowak Dell Inc.
Kuo Lung Li ASMedia Technology Inc. Merle Wood Dell Inc.
Ming-Wei Hsu ASMedia Technology Inc. Mohammed Hijazi Dell Inc.
PS Tseng ASMedia Technology Inc. Siddhartha Reddy Dell Inc.
Sam Tzeng ASMedia Technology Inc. Bindhu Vasu Dialog Semiconductor (UK) Ltd
Thomas Hsu ASMedia Technology Inc. Chanchal Gupta Dialog Semiconductor (UK) Ltd
Weikao Chang ASMedia Technology Inc. Dipti Baheti Dialog Semiconductor (UK) Ltd
Yang Cheng ASMedia Technology Inc. Duc Doan Dialog Semiconductor (UK) Ltd
Shawn Meng Bizlink Technology Inc. Holger Petersen Dialog Semiconductor (UK) Ltd
Bernard Shyu Bizlink Technology, Inc. Jianming Yao Dialog Semiconductor (UK) Ltd
Eric Wu Bizlink Technology, Inc. John Shi Dialog Semiconductor (UK) Ltd
Morphy Hsieh Bizlink Technology, Inc. KE Hong Dialog Semiconductor (UK) Ltd
Sean O'Neal Bizlink Technology, Inc. Kevin Mori Dialog Semiconductor (UK) Ltd
Tiffany Hsiao Bizlink Technology, Inc. Larry Ping Dialog Semiconductor (UK) Ltd
Weichung Ooi Bizlink Technology, Inc. Mengfei Liu Dialog Semiconductor (UK) Ltd
Rahul Bhushan Broadcom Corp. Scott Brown Dialog Semiconductor (UK) Ltd
Asila nahas Cadence Design Systems, Inc. Yimin Chen Dialog Semiconductor (UK) Ltd
Claire Ying Cadence Design Systems, Inc. Yong Li Dialog Semiconductor (UK) Ltd
Page 8 USB Power Delivery Specification Revision 3.0, Version 2.0
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SIST EN IEC 62680-1-2:2021
IEC 62680-1-2:2021 © IEC 2021 – 9 –
© USB 3.0 Promoter Group: 2010-2019
Dan Ellis DisplayLink (UK) Ltd. Alan Berkema Hewlett Packard
Jason Young DisplayLink (UK) Ltd. Lee Atkinson Hewlett Packard
Kevin Jacobs DisplayLink (UK) Ltd. Rahul Lakdawala Hewlett Packard
Paulo Alcobia DisplayLink (UK) Ltd. Robin Castell Hewlett Packard
Peter Burgers DisplayLink (UK) Ltd. Roger Benson Hewlett Packard
Richard Petrie DisplayLink (UK) Ltd. Ron Schooley Hewlett Packard
Abel Astley Ellisys Hideyuki HAYAFUJI Hosiden Corporation
Chuck Trefts Ellisys Keiji Mine Hosiden Corporation
Emmanuel Durin Ellisys Masaki YAMAOKA Hosiden Corporation
Mario Pasquali Ellisys Takashi MUTO Hosiden Corporation
Tim Wei Ellisys Yasunori NISHIKAWA Hosiden Corporation
Chien-Cheng Kuo Etron Technology, Inc. Kenneth Chan HP Inc.
Jack Yang Etron Technology, Inc. Lee Atkinson HP Inc.
Richard Crisp Etron Technology, Inc. Steve Chen HP Inc.
Shyanjia Chen Etron Technology, Inc. Suketu Partiwala HP Inc.
TsungTa Lu Etron Technology, Inc. Suketu Partiwala HP Inc.
Christian Klein Fairchild Semiconductor Vaibhav Malik HP Inc.
Oscar Freitas Fairchild Semiconductor Walter Fry HP Inc.
Souhib Harb Fairchild Semiconductor Bai Sean Huawei Technologies Co., Ltd.
Amanda Ying Feature Integration Technology Inc. Chunjiang Zhao Huawei Technologies Co., Ltd.
Jacky Chan Feature Integration Technology Inc. JianQuan Wu Huawei Technologies Co., Ltd.
Kenny Hsieh Feature Integration Technology Inc. Li Zongjian Huawei Technologies Co., Ltd.
KungAn Lin Feature Integration Technology Inc. Lihua Duan Huawei Technologies Co., Ltd.
Paul Yang Feature Integration Technology Inc. Min Chen Huawei Technologies Co., Ltd.
su Jaden Feature Integration Technology Inc. Wang Feng Huawei Technologies Co., Ltd.
Yu-Lin Chu Feature Integration Technology Inc. Wei Haihong Huawei Technologies Co., Ltd.
Yulin Lan Feature Integration Technology Inc. Robert Heaton Indie Semiconductor
AJ Yang Foxconn / Hon Hai Vincent Wang Indie Semiconductor
Bob Hall Foxconn / Hon Hai Sie Boo Chiang Infineon Technologies
Fred Fons Foxconn / Hon Hai Tue Fatt David Wee Infineon Technologies
Jie zheng Foxconn / Hon Hai Wee Tar Richard Ng Infineon Technologies
Patrick Casher Foxconn / Hon Hai Wolfgang Furtner Infineon Technologies
Steve Sedio Foxconn / Hon Hai Bob Dunstan Intel Corporation
Terry Little Foxconn / Hon Hai Brad Saunders Intel Corporation
Bob McVay Fresco Logic Inc. Chee Lim Nge Intel Corporation
Christopher Meyers Fresco Logic Inc. Christine Krause Intel Corporation
Dian Kurniawan Fresco Logic Inc. Dan Froelich Intel Corporation
Tom Burton Fresco Logic Inc. David Harriman Intel Corporation
Adam Rodriguez Google Inc. David Hines Intel Corporation
Alec Berg Google Inc. David Thompson Intel Corporation
Dave Bernard Google Inc. Guobin Liu Intel Corporation
David Schneider Google Inc. Harry Skinner Intel Corporation
Jim Guerin Google Inc. Henrik Leegaard Intel Corporation
Juan Fantin Google Inc. Jenn Chuan Cheng Intel Corporation
Ken Wu Google Inc. Jervis Lin Intel Corporation
Mark Hayter Google Inc. John Howard Intel Corporation
Nithya Jagannathan Google Inc. Karthi Vadivelu Intel Corporation
Srikanth Lakshmikanthan Google Inc. Leo Heiland Intel Corporation
Todd Broch Google Inc. Maarit Harkonen Intel Corporation
Toshak Singhal Google Inc. Nge Chee Lim Intel Corporation
Vincent Palatin Google Inc. Paul Durley Intel Corporation
Xuelin Wu Google Inc. Rahman Ismail Intel Corporation
Alan Kinningham Granite River Labs Rajaram Regupathy Intel Corporation
Balamurugan Manialagan Granite River Labs Ronald Swartz Intel Corporation
Mike Engbretson Granite River Labs Sarah Sharp Intel Corporation
Mike Wu Granite River Labs Scott Brenden Intel Corporation
Mukesh Tatiya Granite River Labs Sridharan Ranganathan Intel Corporation
Rajaraman V Granite River Labs Steve McGowan Intel Corporation
Tim Lin Granite River Labs Tim McKee Intel Corporation
Page 9 USB Power Delivery Specification Revision 3.0, Version 2.0
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– 10 – IEC 62680-1-2:2021 © IEC 2021
© USB 3.0 Promoter Group: 2010-2019
Toby Opferman Intel Corporation Mark Bohm Microchip Technology Inc.
Ziv Kabiry Intel Corporation Matthew Kalibat Microchip Technology Inc.
Jia Wei Intersil Corporation Mick Davis Microchip Technology Inc.
Al Hsiao ITE Tech. Inc. Prasanna Vengateshan Microchip Technology Inc.
Greg Song ITE Tech. Inc. Rich Wahler Microchip Technology Inc.
Richard Guo ITE Tech. Inc. Richard Petrie Microchip Technology Inc.
Victor Lin ITE Tech. Inc. Ronald Kunin Microchip Technology Inc.
Y.C. Chou ITE Tech. Inc. Shannon Cash Microchip Technology Inc.
Kenta Minejima Japan Aviation Electronics Industry LtTdh. omas Farkas Microchip Technology Inc.
(JAE)
Andrew Yang Microsoft Corporation
Mark Saubert Japan Aviation Electronics Industry Ltd.
Anthony Chen Microsoft Corporation
(JAE)
Arvind Murching Microsoft Corporation
Toshio Shimoyama Japan Aviation Electronics Industry Ltd.
Dave Perchlik Microsoft Corporation
(JAE)
David Voth Microsoft Corporation
Brian Fetz Keysight Technologies Inc.
Geoff Shew Microsoft Corporation
Jit Lim Keysight Technologies Inc.
Jayson Kastens Microsoft Corporation
Babu Mailachalam Lattice Semiconductor Corp
Kai Inha Microsoft Corporation
Gianluca Mariani Lattice Semiconductor Corp
Marwan Kadado Microsoft Corporation
Joel Coplen Lattice Semiconductor Corp
Michelle Bergeron Microsoft Corporation
Thomas Watza Lattice Semiconductor Corp
Rahul Ramadas Microsoft Corporation
Vesa Lauri Lattice Semiconductor Corp
Randy Aull Microsoft Corporation
Keneth Kim LG electronics
Shiu Ng Microsoft Corporation
Bruce Chuang Leadtrend
Timo Toivola Microsoft Corporation
Eilian Liu Leadtrend
Toby Nixon Microsoft Corporation
Daniel H Jacobs LeCroy Corporation
Vivek Gupta Microsoft Corporation
Jake Jacobs LeCroy Corporation
Yang You Microsoft Corporation
Kimberley McKay LeCroy Corporation
Adib Al Abaji Molex LLC
Mike Micheletti LeCroy Corporation
Aaron Xu Monolithic Power Systems Inc.
Roy Chestnut LeCroy Corporation
Bo Zhou Monolithic Power Systems Inc.
Tyler Joe LeCroy Corporation
Christian Sporck Monolithic Power Systems Inc.
Phil Jakes Lenovo
Di Han Monolithic Power Systems Inc.
Aaron Melgar Lion Semiconductor
Zhihong Yu Monolithic Power Systems Inc.
Chris Zhou Lion Semiconductor
Dan Wagner Motorola Mobility Inc.
Sehyung Jeon Lion Semiconductor
Ben Crowe MQP Electronics Ltd.
Wonyoung Kim Lion Semiconductor
Pat Crowe MQP Electronics Ltd.
Yongho Kim Lion Semiconductor
Sten Carlsen MQP Electronics Ltd.
Dave Thompson LSI Corporation
Kenji Oguma NEC Corporation
Alan Kinningham Luxshare-ICT
Frank Borngräber Nokia Corporation
Daniel Chen Luxshare-ICT
Kai Inha Nokia Corporation
Eric Wen Luxshare-ICT
Pekka Leinonen Nokia Corporation
James Stevens Luxshare-ICT
Richard Petrie Nokia Corporation
Josue Castillo Luxshare-ICT
Sten Carlsen Nokia Corporation
Pat Young Luxshare-ICT
Abhijeet Kulkarni NXP Semiconductors
Scott Shuey Luxshare-ICT
Ahmad Yazdi NXP Semiconductors
Chikara Kakizawa Maxim Integrated Products
Bart Vertenten NXP Semiconductors
Jacob Scott Maxim Integrated Products
Dennis Ha NXP Semiconductors
Ken Helfrich Maxim Integrated Products
Dong Nguyen NXP Semiconductors
Michael Miskho Maxim Integrated Products
Guru Prasad NXP Semiconductors
Chris Yokum MCCI Corporation
Ken Jaramillo NXP Semiconductors
Geert Knapen MCCI Corporation
Krishnan TN NXP Semiconductors
Terry Moore MCCI Corporation
Michael Joehren NXP Semiconductors
Velmurugan Selvaraj MCCI Corporation
Robert de Nie NXP Semiconductors
Satoru Kumashiro MegaChips Corporation
Rod Whitby NXP Semiconductors
Brian Marley Microchip Technology Inc.
Vijendra Kuroodi NXP Semiconductors
Dave Perchlik Microchip Technology Inc.
Winston Langeslag NXP Semiconductors
Don Perkins Microchip Technology Inc.
Robert Heaton Obsidian Technology
Fernando Gonzalez Microchip Technology Inc.
Andrew Yoo ON Semiconductor
John Sisto Microchip Technology Inc.
Brady Maasen ON Semiconductor
Josh Averyt Microchip Technology Inc.
Bryan McCoy ON Semiconductor
Kiet Tran Microchip Technology Inc.
Page 10 USB Power Delivery Specification Revision 3.0, Version 2.0
---------------------- Page: 14 ----------------------
SIST EN IEC 62680-1-2:2021
IEC 62680-1-2:2021 © IEC 2021 – 11 –
© USB 3.0 Promoter Group: 2010-2019
Christian Klein ON Semiconductor Matti Kulmala Salcomp Plc
Cor Voorwinden ON Semiconductor Toni Lehimo Salcomp Plc
Edward Berrios ON Semiconductor Tong Kim Samsung Electronics Co. Ltd.
Michael Smith ON Semiconductor Alvin Cox Seagate Technology LLC
Oscar Freitas ON Semiconductor Emmanuel Lemay Seagate Technology LLC
Tom Duffy ON Semiconductor John Hein Seagate Technology LLC
Craig Wiley Parade Technologies Inc. Marc Noblitt Seagate Tec
...
SLOVENSKI STANDARD
oSIST prEN 62680-1-2:2020
01-september-2020
Vmesniki univerzalnega serijskega vodila za prenos podatkov in napajanje - 1-2.
del: Skupne komponente - Specifikacija za zagotavljanje napajanja prek USB
Universal serial bus interfaces for data and power - Part 1-2: Common components -
USB Power Delivery specification
Ta slovenski standard je istoveten z: prEN 62680-1-2:2020
ICS:
35.200 Vmesniška in povezovalna Interface and interconnection
oprema equipment
oSIST prEN 62680-1-2:2020 en,fr,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
---------------------- Page: 1 ----------------------
oSIST prEN 62680-1-2:2020
---------------------- Page: 2 ----------------------
oSIST prEN 62680-1-2:2020
100/3440/CDV
COMMITTEE DRAFT FOR VOTE (CDV)
PROJECT NUMBER:
IEC 62680-1-2 ED5
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2020-07-03 2020-09-25
SUPERSEDES DOCUMENTS:
100/3403/RR
IEC TA 18 : MULTIMEDIA HOME SYSTEMS AND APPLICATIONS FOR END-USER NETWORKS
SECRETARIAT: SECRETARY:
Japan Mr Keisuke Koide
OF INTEREST TO THE FOLLOWING COMMITTEES: PROPOSED HORIZONTAL STANDARD:
Other TC/SCs are requested to indicate their interest, if
any, in this CDV to the secretary.
FUNCTIONS CONCERNED:
EMC ENVIRONMENT QUALITY ASSURANCE SAFETY
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft
for Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of
which they are aware and to provide supporting documentation.
TITLE:
Universal serial bus interfaces for data and power - Part 1-2: Common components - USB
Power Delivery specification
PROPOSED STABILITY DATE: 2025
NOTE FROM TC/SC OFFICERS:
Copyright © 2020 International Electrotechnical Commission, IEC. All rights reserved. It is permitted to download this
electronic file, to make a copy and to print out the content for the sole purpose of preparing National Committee positions.
You may not copy or "mirror" the file or printed version of the document, or any part of it, for any other purpose without
permission in writing from IEC.
---------------------- Page: 3 ----------------------
oSIST prEN 62680-1-2:2020
IEC CDV 62680-1-2 Ed 5.0 © IEC
100/3440/CDV – 1 –
© USB 3.0 Promoter Group: 2010-2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER
Part 1-2: Common components – USB Power Delivery specification
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62680-1-2 has been prepared by technical area 18: Multimedia home
systems and applications for end-user networks, of IEC technical committee 100: Audio, video
and multimedia systems and equipment.
The text of this standard was prepared by the USB Implementers Forum (USB-IF). The structure
and editorial rules used in this publication reflect the practice of the organization which
submitted it.
The text of this International Standard is based on the following documents:
FDIS Report on voting
XX/XX/FDIS XX/XX/RVD
Full information on the voting for the approval of this International Standard can be found in the
report on voting indicated in the above table.
Page 1 USB Power Delivery Specification Revision 3.0, Version 2.0
---------------------- Page: 4 ----------------------
oSIST prEN 62680-1-2:2020
IEC CDV 62680-1-2 Ed 5.0 © IEC
– 2 – 100/3440/CDV
© USB 3.0 Promoter Group: 2010-2019
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
The National Committees are requested to note that for this document the stability date is .
THIS TEXT IS INCLUDED FOR THE INFORMATION OF THE NATIONAL COMMITTEES AND WILL BE DELETED AT THE
PUBLICATION STAGE.
Page 2 USB Power Delivery Specification Revision 3.0, Version 2.0
---------------------- Page: 5 ----------------------
oSIST prEN 62680-1-2:2020
IEC CDV 62680-1-2 Ed 5.0 © IEC
100/3440/CDV – 3 –
© USB 3.0 Promoter Group: 2010-2019
INTRODUCTION
The IEC 62680 series is based on a series of specifications that were originally developed by the USB
Implementers Forum (USB-IF). These specifications were submitted to the IEC under the auspices of
a special agreement between the IEC and the USB-IF.
This standard is the USB-IF publication Universal Serial Bus Power Delivery Specification Revision
3.0, Version 2.0.
The USB Implementers Forum, Inc.(USB-IF) is a non-profit corporation founded by the group of
companies that developed the Universal Serial Bus specification. The USB-IF was formed to provide a
support organization and forum for the advancement and adoption of Universal Serial Bus technology.
The Forum facilitates the development of high-quality compatible USB peripherals (devices), and
promotes the benefits of USB and the quality of products that have passed compliance testing.
ANY USB SPECIFICATIONS ARE PROVIDED TO YOU "AS IS, "WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT,
OR FITNESS FOR ANY PARTICULAR PURPOSE. THE USB IMPLEMENTERS FORUM AND THE
AUTHORS OF ANY USB SPECIFICATIONS DISCLAIM ALL LIABILITY, INCLUDING LIABILITY
FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR
IMPLEMENTATION OR INFORMATION IN THIS SPECIFICAITON.
THE PROVISION OF ANY USB SPECIFICATIONS TO YOU DOES NOT PROVIDE YOU WITH ANY
LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS.
Entering into USB Adopters Agreements may, however, allow a signing company to participate in a
reciprocal, RAND-Z licensing arrangement for compliant products. For more information, please see:
https://www.usb.org/documents
IEC DOES NOT TAKE ANY POSITION AS TO WHETHER IT IS ADVISABLE FOR YOU TO ENTER
INTO ANY USB ADOPTERS AGREEMENTS OR TO PARTICIPATE IN THE USB IMPLEMENTERS
FORUM.”
Page 3 USB Power Delivery Specification Revision 3.0, Version 2.0
---------------------- Page: 6 ----------------------
oSIST prEN 62680-1-2:2020
---------------------- Page: 7 ----------------------
oSIST prEN 62680-1-2:2020
IEC CDV 62680-1-2 Ed 5.0 © IEC
100/3440/CDV – 1 –
© USB 3.0 Promoter Group: 2010-2019
Universal Serial Bus
Power Delivery Specification
Revision: 3.0
Version: 2.0
Release date: 29 August 2019
Page 1 USB Power Delivery Specification Revision 3.0, Version 2.0
---------------------- Page: 8 ----------------------
oSIST prEN 62680-1-2:2020
IEC CDV 62680-1-2 Ed 5.0 © IEC
– 2 – 100/3440/CDV
© USB 3.0 Promoter Group: 2010-2019
LIMITED COPYRIGHT LICENSE
THE USB 3.0 PROMOTERS GRANT A CONDITIONAL COPYRIGHT LICENSE UNDER THE COPYRIGHTS
EMBODIED IN THE USB POWER DELIVERY SPECIFICATION TO USE AND REPRODUCE THE
SPECIFICATION FOR THE SOLE PURPOSE OF, AND SOLELY TO THE EXTENT NECESSARY FOR,
EVALUATING WHETHER TO IMPLEMENT THE SPECIFICATION IN PRODUCTS THAT WOULD COMPLY
WITH THE SPECIFICATION. WITHOUT LIMITING THE FOREGOING, USE THE OF SPECIFICATION FOR
THE PURPOSE OF FILING OR MODIFYING ANY PATENT APPLICATION TO TARGET THE SPECIFICATION
OR USB COMPLIANT PRODUCTS IS NOT AUTHORIZED. EXCEPT FOR THIS EXPRESS COPYRIGHT LICENSE,
NO OTHER RIGHTS OR LICENSES ARE GRANTED, INCLUDING WITHOUT LIMITATION ANY PATENT
LICENSES. IN ORDER TO OBTAIN ANY ADDITIONALY INTELLECTUAL PROPERTY LICENSES OR
LICENSING COMMITMENTS ASSOCIATED WITH THE SPECIFICATION A PARTY MUST EXECUTE THE USB
3.0 ADOPTERS AGREEMENT. NOTE: BY USING THE SPECIFICATION, YOU ACCEPT THESE LICENSE
TERMS ON YOUR OWN BEHALF AND, IN THE CASE WHERE YOU ARE DOING THIS AS AN EMPLOYEE, ON
BEHALF OF YOUR EMPLOYER.
INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER, INCLUDING
ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR
PURPOSE. THE AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR
INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR IMPLEMENTATION OF
INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS SPECIFICATION TO YOU DOES NOT
PROVIDE YOU WITH ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS.
Please send comments via electronic mail to techsup@usb.org
For industry information, refer to the USB Implementers Forum web page at http://www.usb.org
USB Type-C® and USB4™ are trademarks of the Universal Serial Bus Implementers Forum (USB-IF).
Thunderbolt™ is a trademark of Intel Corporation.
You may only use the Thunderbolt™ trademark or logo in conjunction with products designed to this
specification that complete proper certification and executing a Thunderbolt™ trademark license – see
http://usb.org/compliance for further information.
All product names are trademarks, registered trademarks, or service marks of their respective owners.
Copyright © 2010-2019, USB 3.0 Promoter Group: Apple Inc., Hewlett-Packard Inc., Intel Corporation,
Microsoft Corporation, Renesas, STMicroelectronics, and Texas Instruments.
All rights reserved.
Page 2 USB Power Delivery Specification Revision 3.0, Version 2.0
---------------------- Page: 9 ----------------------
oSIST prEN 62680-1-2:2020
IEC CDV 62680-1-2 Ed 5.0 © IEC
100/3440/CDV – 3 –
© USB 3.0 Promoter Group: 2010-2019
Chairs
Alvin Cox Cabling Sub-Chair
Bob Dunstan Specification Chair/Protocol Subgroup Chair
Deric Waters PHY Chair
Ed Berrios Power Supply Chair
Rahman Ismail System Policy Chair
Richard Petrie Specification Chair/Device Policy Chair
Editors
Bob Dunstan
Richard Petrie
Contributors
Page 3 USB Power Delivery Specification Revision 3.0, Version 2.0
---------------------- Page: 10 ----------------------
oSIST prEN 62680-1-2:2020
IEC CDV 62680-1-2 Ed 5.0 © IEC
– 4 – 100/3440/CDV
© USB 3.0 Promoter Group: 2010-2019
Charles Wang ACON, Advanced-Connectek, Inc. Weichung Ooi Bizlink Technology, Inc.
Conrad Choy ACON, Advanced-Connectek, Inc. Rahul Bhushan Broadcom Corp.
Dennis Chuang ACON, Advanced-Connectek, Inc. Asila nahas Cadence Design Systems, Inc.
Steve Sedio ACON, Advanced-Connectek, Inc. Claire Ying Cadence Design Systems, Inc.
Sunney Yang ACON, Advanced-Connectek, Inc. Jie min Cadence Design Systems, Inc.
Vicky Chuang ACON, Advanced-Connectek, Inc. Mark Summers Cadence Design Systems, Inc.
Joseph Scanlon Advanced Micro Devices Michal Staworko Cadence Design Systems, Inc.
Caspar Lin Allion Labs, Inc. Sathish Kumar Ganesan Cadence Design Systems, Inc.
Casper Lee Allion Labs, Inc. Alessandro Ingrassia Canova Tech
Danny Shih Allion Labs, Inc. Andrea Colognese Canova Tech
Howard Chang Allion Labs, Inc. Antonio Orzelli Canova Tech
Greg Stewart Analogix Semiconductor, Inc. Davide Ghedin Canova Tech
Mehran Badii Analogix Semiconductor, Inc. Matteo Casalin Canova Tech
Alexei Kosut Apple Michael Marioli Canova Tech
Bill Cornelius Apple Nicola Scantamburlo Canova Tech
Carlos Colderon Apple Paolo Pilla Canova Tech
Chris Uiterwijk Apple Yi-Feng Lin Canyon Semiconductor
Colin Whitby-Strevens Apple YuHung Lin Canyon Semiconductor
Corey Axelowitz Apple David Tsai Chrontel, Inc.
Corey Lange Apple Anshul Gulati Cypress Semiconductor
Dave Conroy Apple Anup Nayak Cypress Semiconductor
David Sekowski Apple Benjamin Kropf Cypress Semiconductor
Girault Jones Apple Dhanraj Rajput Cypress Semiconductor
James Orr Apple Ganesh Subramaniam Cypress Semiconductor
Jason Chung Apple Jagadeesan Raj Cypress Semiconductor
Jay Kim Apple Junjie cui Cypress Semiconductor
Jeff Wilcox Apple Manu Kumar Cypress Semiconductor
Jennifer Tsai Apple Muthu M Cypress Semiconductor
Karl Bowers Apple Nicholas Bodnaruk Cypress Semiconductor
Keith Porthouse Apple Pradeep Bajpai Cypress Semiconductor
Kevin Hsiue Apple Rajaram R Cypress Semiconductor
Matt Mora Apple Rama Vakkantula Cypress Semiconductor
Paul Baker Apple Rushil Kadakia Cypress Semiconductor
Reese Schreiber Apple Simon Nguyen Cypress Semiconductor
Ruchi Chaturvedi Apple Steven Wong Cypress Semiconductor
Sameer Kelkar Apple Subu Sankaran Cypress Semiconductor
Sasha Tietz Apple Sumeet Gupta Cypress Semiconductor
Scott Jackson Apple Tejender Sheoran Cypress Semiconductor
Sree Raman Apple Venkat Mandagulathar Cypress Semiconductor
William Ferry Apple Xiaofeng Shen Cypress Semiconductor
Zaki Moussaoui Apple Zeng Wei Cypress Semiconductor
Jeff Liu ASMedia Technology Inc. Adie Tan Dell Inc.
Kuo Lung Li ASMedia Technology Inc. Adolfo Montero Dell Inc.
Ming-Wei Hsu ASMedia Technology Inc. Bruce Montag Dell Inc.
PS Tseng ASMedia Technology Inc. Gary Verdun Dell Inc.
Sam Tzeng ASMedia Technology Inc. Marcin Nowak Dell Inc.
Thomas Hsu ASMedia Technology Inc. Merle Wood Dell Inc.
Weikao Chang ASMedia Technology Inc. Mohammed Hijazi Dell Inc.
Yang Cheng ASMedia Technology Inc. Siddhartha Reddy Dell Inc.
Shawn Meng Bizlink Technology Inc. Bindhu Vasu Dialog Semiconductor (UK) Ltd
Bernard Shyu Bizlink Technology, Inc. Chanchal Gupta Dialog Semiconductor (UK) Ltd
Eric Wu Bizlink Technology, Inc. Dipti Baheti Dialog Semiconductor (UK) Ltd
Morphy Hsieh Bizlink Technology, Inc. Duc Doan Dialog Semiconductor (UK) Ltd
Sean O'Neal Bizlink Technology, Inc. Holger Petersen Dialog Semiconductor (UK) Ltd
Tiffany Hsiao Bizlink Technology, Inc. Jianming Yao Dialog Semiconductor (UK) Ltd
Page 4 USB Power Delivery Specification Revision 3.0, Version 2.0
---------------------- Page: 11 ----------------------
oSIST prEN 62680-1-2:2020
IEC CDV 62680-1-2 Ed 5.0 © IEC
© USB 3.0 Promoter Group: 2010-2019
John Shi Dialog Semiconductor (UK) Ltd Srikanth Lakshmikanthan Google Inc.
KE Hong Dialog Semiconductor (UK) Ltd Todd Broch Google Inc.
Kevin Mori Dialog Semiconductor (UK) Ltd Toshak Singhal Google Inc.
Larry Ping Dialog Semiconductor (UK) Ltd Vincent Palatin Google Inc.
Mengfei Liu Dialog Semiconductor (UK) Ltd Xuelin Wu Google Inc.
Scott Brown Dialog Semiconductor (UK) Ltd Alan Kinningham Granite River Labs
Yimin Chen Dialog Semiconductor (UK) Ltd Balamurugan Manialagan Granite River Labs
Yong Li Dialog Semiconductor (UK) Ltd Mike Engbretson Granite River Labs
Dan Ellis DisplayLink (UK) Ltd. Mike Wu Granite River Labs
Jason Young DisplayLink (UK) Ltd. Mukesh Tatiya Granite River Labs
Kevin Jacobs DisplayLink (UK) Ltd. Rajaraman V Granite River Labs
Paulo Alcobia DisplayLink (UK) Ltd. Tim Lin Granite River Labs
Peter Burgers DisplayLink (UK) Ltd. Alan Berkema Hewlett Packard
Richard Petrie DisplayLink (UK) Ltd. Lee Atkinson Hewlett Packard
Abel Astley Ellisys Rahul Lakdawala Hewlett Packard
Chuck Trefts Ellisys Robin Castell Hewlett Packard
Emmanuel Durin Ellisys Roger Benson Hewlett Packard
Mario Pasquali Ellisys Ron Schooley Hewlett Packard
Tim Wei Ellisys Hideyuki HAYAFUJI Hosiden Corporation
Chien-Cheng Kuo Etron Technology, Inc. Keiji Mine Hosiden Corporation
Jack Yang Etron Technology, Inc. Masaki YAMAOKA Hosiden Corporation
Richard Crisp Etron Technology, Inc. Takashi MUTO Hosiden Corporation
Shyanjia Chen Etron Technology, Inc. Yasunori NISHIKAWA Hosiden Corporation
TsungTa Lu Etron Technology, Inc. Kenneth Chan HP Inc.
Christian Klein Fairchild Semiconductor Lee Atkinson HP Inc.
Oscar Freitas Fairchild Semiconductor Steve Chen HP Inc.
Souhib Harb Fairchild Semiconductor Suketu Partiwala HP Inc.
Amanda Ying Feature Integration Technology Inc. Suketu Partiwala HP Inc.
Jacky Chan Feature Integration Technology Inc. Vaibhav Malik HP Inc.
Kenny Hsieh Feature Integration Technology Inc. Walter Fry HP Inc.
KungAn Lin Feature Integration Technology Inc. Bai Sean Huawei Technologies Co., Ltd.
Paul Yang Feature Integration Technology Inc. Chunjiang Zhao Huawei Technologies Co., Ltd.
su Jaden Feature Integration Technology Inc. JianQuan Wu Huawei Technologies Co., Ltd.
Yu-Lin Chu Feature Integration Technology Inc. Li Zongjian Huawei Technologies Co., Ltd.
Yulin Lan Feature Integration Technology Inc. Lihua Duan Huawei Technologies Co., Ltd.
AJ Yang Foxconn / Hon Hai Min Chen Huawei Technologies Co., Ltd.
Bob Hall Foxconn / Hon Hai Wang Feng Huawei Technologies Co., Ltd.
Fred Fons Foxconn / Hon Hai Wei Haihong Huawei Technologies Co., Ltd.
Jie zheng Foxconn / Hon Hai Robert Heaton Indie Semiconductor
Patrick Casher Foxconn / Hon Hai Vincent Wang Indie Semiconductor
Steve Sedio Foxconn / Hon Hai Sie Boo Chiang Infineon Technologies
Terry Little Foxconn / Hon Hai Tue Fatt David Wee Infineon Technologies
Bob McVay Fresco Logic Inc. Wee Tar Richard Ng Infineon Technologies
Christopher Meyers Fresco Logic Inc. Wolfgang Furtner Infineon Technologies
Dian Kurniawan Fresco Logic Inc. Bob Dunstan Intel Corporation
Tom Burton Fresco Logic Inc. Brad Saunders Intel Corporation
Adam Rodriguez Google Inc. Chee Lim Nge Intel Corporation
Alec Berg Google Inc. Christine Krause Intel Corporation
Dave Bernard Google Inc. Dan Froelich Intel Corporation
David Schneider Google Inc. David Harriman Intel Corporation
Jim Guerin Google Inc. David Hines Intel Corporation
Juan Fantin Google Inc. David Thompson Intel Corporation
Ken Wu Google Inc. Guobin Liu Intel Corporation
Mark Hayter Google Inc. Harry Skinner Intel Corporation
Nithya Jagannathan Google Inc. Henrik Leegaard Intel Corporation
Page 5 USB Power Delivery Specification Revision 3.0, Version 2.0
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oSIST prEN 62680-1-2:2020
IEC CDV 62680-1-2 Ed 5.0 © IEC
– 6 – 100/3440/CDV
© USB 3.0 Promoter Group: 2010-2019
Jenn Chuan Cheng Intel Corporation Eric Wen Luxshare-ICT
Jervis Lin Intel Corporation James Stevens Luxshare-ICT
John Howard Intel Corporation Josue Castillo Luxshare-ICT
Karthi Vadivelu Intel Corporation Pat Young Luxshare-ICT
Leo Heiland Intel Corporation Scott Shuey Luxshare-ICT
Maarit Harkonen Intel Corporation Chikara Kakizawa Maxim Integrated Products
Nge Chee Lim Intel Corporation Jacob Scott Maxim Integrated Products
Paul Durley Intel Corporation Ken Helfrich Maxim Integrated Products
Rahman Ismail Intel Corporation Michael Miskho Maxim Integrated Products
Rajaram Regupathy Intel Corporation Chris Yokum MCCI Corporation
Ronald Swartz Intel Corporation Geert Knapen MCCI Corporation
Sarah Sharp Intel Corporation Terry Moore MCCI Corporation
Scott Brenden Intel Corporation Velmurugan Selvaraj MCCI Corporation
Sridharan Ranganathan Intel Corporation Satoru Kumashiro MegaChips Corporation
Steve McGowan Intel Corporation Brian Marley Microchip Technology Inc.
Tim McKee Intel Corporation Dave Perchlik Microchip Technology Inc.
Toby Opferman Intel Corporation Don Perkins Microchip Technology Inc.
Ziv Kabiry Intel Corporation Fernando Gonzalez Microchip Technology Inc.
Jia Wei Intersil Corporation John Sisto Microchip Technology Inc.
Al Hsiao ITE Tech. Inc. Josh Averyt Microchip Technology Inc.
Greg Song ITE Tech. Inc. Kiet Tran Microchip Technology Inc.
Richard Guo ITE Tech. Inc. Mark Bohm Microchip Technology Inc.
Victor Lin ITE Tech. Inc. Matthew Kalibat Microchip Technology Inc.
Y.C. Chou ITE Tech. Inc. Mick Davis Microchip Technology Inc.
Kenta Minejima Japan Aviation Electronics Industry Ltd. Prasanna Vengateshan Microchip Technology Inc.
(JAE)
Rich Wahler Microchip Technology Inc.
Mark Saubert Japan Aviation Electronics Industry Ltd.
Richard Petrie Microchip Technology Inc.
(JAE)
Ronald Kunin Microchip Technology Inc.
Toshio Shimoyama Japan Aviation Electronics Industry Ltd.
Shannon Cash Microchip Technology Inc.
(JAE)
Thomas Farkas Microchip Technology Inc.
Brian Fetz Keysight Technologies Inc.
Andrew Yang Microsoft Corporation
Jit Lim Keysight Technologies Inc.
Anthony Chen Microsoft Corporation
Babu Mailachalam Lattice Semiconductor Corp
Arvind Murching Microsoft Corporation
Gianluca Mariani Lattice Semiconductor Corp
Dave Perchlik Microsoft Corporation
Joel Coplen Lattice Semiconductor Corp
David Voth Microsoft Corporation
Thomas Watza Lattice Semiconductor Corp
Geoff Shew Microsoft Corporation
Vesa Lauri Lattice Semiconductor Corp
Jayson Kastens Microsoft Corporation
Keneth Kim LG electronics
Kai Inha Microsoft Corporation
Bruce Chuang Leadtrend
Marwan Kadado Microsoft Corporation
Eilian Liu Leadtrend
Michelle Bergeron Microsoft Corporation
Daniel H Jacobs LeCroy Corporation
Rahul Ramadas Microsoft Corporation
Jake Jacobs LeCroy Corporation
Randy Aull Microsoft Corporation
Kimberley McKay LeCroy Corporation
Shiu Ng Microsoft Corporation
Mike Micheletti LeCroy Corporation
Timo Toivola Microsoft Corporation
Roy Chestnut LeCroy Corporation
Toby Nixon Microsoft Corporation
Tyler Joe LeCroy Corporation
Vivek Gupta Microsoft Corporation
Phil Jakes Lenovo
Yang You Microsoft Corporation
Aaron Melgar Lion Semiconductor
Adib Al Abaji Molex LLC
Chris Zhou Lion Semiconductor
Aaron Xu Monolithic Power Systems Inc.
Sehyung Jeon Lion Semiconductor
Bo Zhou Monolithic Power Systems Inc.
Wonyoung Kim Lion Semiconductor
Christian Sporck Monolithic Power Systems Inc.
Yongho Kim Lion Semiconductor
Di Han Monolithic Power Systems Inc.
Dave Thompson LSI Corporation
Zhihong Yu Monolithic Power Systems Inc.
Alan Kinningham Luxshare-ICT
Dan Wagner Motorola Mobility Inc.
Daniel Chen Luxshare-ICT
Ben Crowe MQP Electronics Ltd.
Page 6 USB Power Delivery Specification Revision 3.0, Version 2.0
---------------------- Page: 13 ----------------------
oSIST prEN 62680-1-2:2020
IEC CDV 62680-1-2 Ed 5.0 © IEC
© USB 3.0 Promoter Group: 2010-2019
Pat Crowe MQP Electronics Ltd. Atsushi Mitamura Renesas Electronics Corp.
Sten Carlsen MQP Electronics Ltd. Bob Dunstan Renesas Electronics Corp.
Kenji Oguma NEC Corporation Brian Allen Renesas Electronics Corp.
Frank Borngräber Nokia Corporation Dan Aoki Renesas Electronics Corp.
Kai Inha Nokia Corporation Hajime Nozaki Renesas Electronics Corp.
Pekka Leinonen Nokia Corporation John Carpenter Renesas Electronics Corp.
Richard Petrie Nokia Corporation Kiichi Muto Renesas Electronics Corp.
Sten Carlsen Nokia Corporation Masami Katagiri Renesas Electronics Corp.
Abhijeet Kulkarni NXP Semiconductors Nobuo Furuya Renesas Electronics Corp.
Ahmad Yazdi NXP Semiconductors Patrick Yu Renesas Electronics Corp.
Bart Vertenten NXP Semiconductors Peter Teng Renesas Electronics Corp.
Dennis Ha NXP Semiconductors Philip Leung Renesas Electronics Corp.
Dong Nguyen NXP Semiconductors Steve Roux Renesas Electronics Corp.
Guru Prasad NXP Semiconductors Tetsu Sato Renesas Electronics Corp.
Ken Jaramillo NXP Semiconductors Toshifumi Yamaoka Renesas Electronics Corp.
Krishnan TN NXP Semiconductors Chunan Kuo Richtek Technology Corporation
Michael Joehren NXP Semiconductors Heinz Wei Richtek Technology Corporation
Robert de Nie NXP Semiconductors TZUHSIEN CHUANG Richtek Technology Corporation
Rod Whitby NXP Semiconductors Tatsuya Irisawa Ricoh Company Ltd.
Vijendra Kuroodi NXP Semiconductors Akihiro Ono Rohm Co. Ltd.
Winston Langeslag NXP Semiconductors Chris Lin Rohm Co. Ltd.
Robert Heaton Obsidian Technology Hidenori Nishimoto Rohm Co. Ltd.
Andrew Yoo ON Semiconductor Kris Bahar Rohm Co. Ltd.
Brady Maasen ON Semiconductor Manabu Miyata Rohm Co. Ltd.
Bryan McCoy ON Semiconductor Ruben Balbuena Rohm Co. Ltd.
Christian Klein ON Semiconductor Takashi Sato Rohm Co. Ltd.
Cor Voorwinden ON Semiconductor Vijendra Kuroodi Rohm Co. Ltd.
Edward Berrios ON Semiconductor Yusuke Kondo Rohm Co. Ltd.
Michael Smith ON Semiconductor Kazuomi Nagai ROHM Co., Ltd.
Oscar Freitas ON Semiconductor Matti Kulmala Salcomp Plc
Tom Duffy ON Semiconductor Toni Lehimo Salcomp Plc
Craig Wiley Parade Technologies Inc. Tong Kim Samsung Electronics Co. Ltd.
Aditya Kulkarni Power Integrations Alvin Cox Seagate Technology LLC
Amruta Patra Power Integrations Emmanuel Lemay Seagate Technology LLC
Rahul Joshi Power Integrations John Hein Seagate Technology LLC
Ricardo Pregiteer Power Integrations Marc Noblitt Seagate Technology LLC
Shruti Anand Power Integrations Michael Morgan Seagate Technology LLC
Amit gupta Qualcomm, Inc Ronald Rueckert Seagate Technology LLC
George Paparrizos Qualcomm, Inc Tony Priborsky Seagate Technology LLC
Giovanni Garcea Qualcomm, Inc Chin Chang Semtech Corporation
Jack Pham Qualcomm, Inc Tom Farkas Semtech Corporation
James Goel Qualcomm, Inc Ning Dai Silergy Corp.
Joshua Warner Qualcomm, Inc Wanfeng Zhang Silergy Corp.
Karyn Vuong Qualcomm, Inc Kafai Leung Silicon Laboratories, Inc.
Lalan Mishra Qualcomm, Inc Kok Hong Soh Silicon Laboratories, Inc.
Vamsi Samavedam Qualcomm, Inc Sorin Badiu Silicon Laboratories, Inc.
Vatsal Patel Qualcomm, Inc Steven Ghang Silicon Laboratories, Inc.
Chris Sporck Qualcomm, Inc. Abhishek Sardeshpande SiliConch Systems Private Limited
Craig Aiken Qualcomm, Inc. Aniket Mathad SiliConch Systems Private Limited
Narendra Mehta Qualcomm, Inc. Chandana N SiliConch Systems Private Limited
Terry Remple Qualcomm, Inc. Jaswanth Ammineni SiliConch Systems Private Limited
Will Kun Qualcomm, Inc. Jinisha Patel SiliConch Systems Private Limited
Yoram Rimoni Qualcomm, Inc. Kaustubh Kumar SiliConch Systems Private Limited
Fan-Hau Hsu Realtek Semiconductor Corp. Nitish Nitish SiliConch Systems Private Limited
Tsung-Peng Chuang Realtek Semiconductor Corp. Pavitra Balasubramanian SiliConch Systems Private Limited
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