EN 61190-1-3:2007

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an amendment to Table B.1 concerning lead-free solder alloys.

Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten

Matériaux de fixation pour les assemblages électroniques - Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et non fluxées pour les applications de brasage électronique

La CEI 61190-1-3:2007 prescrit les exigences et méthodes d'essai pour les alliages à braser de catégorie électronique, les brasures en baguette, en ruban et en poudre fluxées et non fluxées, et les pâtes à braser, pour les applications de brasage électronique et pour les brasures de catégorie électronique "spéciales". Pour les spécifications génériques relatives aux alliages et aux flux à braser, voir l'ISO 9453, l'ISO 9454-1 et l'ISO 9454-2. La présente norme est un document de contrôle de la qualité et n'a pas pour objet de s'intéresser directement à la performance du matériau au cours du procédé de fabrication. Les modifications principales par rapport à la première édition concernent une définition de l'alliage à braser sans plomb et un amendement au Tableau B.1 concernant les alliages à braser sans plomb.

Povezovalni materiali za elektronske sestave - 1-3. del: Zahteve za spajkalne zlitine ter za spajkalne žice s spajkalno tekočino in brez nje za uporabo v elektroniki (IEC 61190-1-3:2007)

Ta del IEC 61190 predpisuje zahteve in preskusne metode za spajkalne zlitine za uporabo v elektroniki, za spajkalni prah, pasto, trak in palice s spajkalno tekočino in brez nje, za uporabo v elektroniki in za “posebne” spajke za uporabo v elektroniki. Za rodovne specifikacije spajkalnih zlitin in tekočin glej ISO 9453, ISO 9454-1 in ISO 9454-2. Ta standard je dokument za nadzor kakovosti in ni namenjen temu, da bi se neposredno nanašal na obnašanje materiala v postopku proizvodnje. Posebne spajke za uporabo v elektroniki zajemajo vse spajke, ki ne ustrezajo popolnoma zahtevam standardnih spajkalnih zlitin in spajkalnih materialov, naštetih v tem dokumentu. Primeri posebnih spajk vključujejo anode, ingote, vnaprej oblikovane kose, palice s kavljem in zanko na koncu, spajkalne praške iz več zlitin itd.

General Information

• Status: Withdrawn
• Publication Date: 27-Jun-2007
• Withdrawal Date: 30-Apr-2010
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 17-Jan-2021
• Completion Date: 17-Jan-2021
• Ref Project: SIST EN 61190-1-3:2007 - Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Relations

• Replaces: EN 61190-1-3:2002 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
• Effective Date: 29-Jan-2023
• Replaced By: EN IEC 61190-1-3:2018 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
• Effective Date: 07-Apr-2015
• Amended By: EN 61190-1-3:2007/A1:2010 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
• Effective Date: 29-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 61190-1-3:2007
01-oktober-2007
1DGRPHãþD
SIST EN 61190-1-3:2003
3RYH]RYDOQLPDWHULDOL]DHOHNWURQVNHVHVWDYHGHO=DKWHYH]DVSDMNDOQH]OLWLQH
WHU]DVSDMNDOQHåLFHVVSDMNDOQRWHNRþLQRLQEUH]QMH]DXSRUDERYHOHNWURQLNL,(&

Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications
Verbindungsmaterialien für Baugruppen der Elektronik -- Teil 1-3: Anforderungen an
Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von
Elektronikprodukten
Matériaux de fixation pour les assemblages électroniques -- Partie 1-3: Exigences
relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et
non-fluxées pour les applications de brasage électronique
Ta slovenski standard je istoveten z: EN 61190-1-3:2007
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
SIST EN 61190-1-3:2007 en,de
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 61190-1-3:2007

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SIST EN 61190-1-3:2007


EUROPEAN STANDARD
EN 61190-1-3

NORME EUROPÉENNE
June 2007
EUROPÄISCHE NORM

ICS 31.190 Supersedes EN 61190-1-3:2002


English version


Attachment materials for electronic assembly -
Part 1-3: Requirements for electronic grade solder alloys
and fluxed and non-fluxed solid solders
for electronic soldering applications
(IEC 61190-1-3:2007)


Matériaux de fixation  Verbindungsmaterialien
pour les assemblages électroniques - für Baugruppen der Elektronik -
Partie 1-3: Exigences relatives Teil 1-3: Anforderungen
aux alliages à braser de catégorie an Elektroniklote und an Festformlote
électronique et brasures solides mit oder ohne Flussmittel
fluxées et non-fluxées pour les für das Löten von Elektronikprodukten
applications de brasage électronique (IEC 61190-1-3:2007)
(CEI 61190-1-3:2007)




This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels


© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-3:2007 E

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SIST EN 61190-1-3:2007
EN 61190-1-3:2007 - 2 -
Foreword
The text of document 91/647/FDIS, future edition 2 of IEC 61190-1-3, prepared by IEC TC 91, Electronics
assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC
as EN 61190-1-3 on 2007-05-01.
This European Standard supersedes EN 61190-1-3:2002.
The main changes with regard to EN 61190-1-3:2002 concern a definition of lead-free solder alloy and an
amendment to Table B.1 concerning lead-free solder alloys.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2008-02-01
national standard or by endorsement
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2010-05-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61190-1-3:2007 was approved by CENELEC as a European
Standard without any modification.
__________

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SIST EN 61190-1-3:2007
- 3 - EN 61190-1-3:2007
Annex ZA
(normative)

Normative references to international publications
with their c
...