EN 61190-1-3:2007/A1:2010
(Amendment)Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Amandma A1:2010 je dodatek k standardu SIST EN 61190-1-3:2007
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc.
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten
Matériaux de fixation pour les assemblages électroniques - Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et non fluxées pour les applications de brasage électronique
Povezovalni materiali za elektronske sestave - 1-3. del: Zahteve za spajkalne zlitine ter za spajkalne žice s spajkalno tekočino in brez nje za uporabo v elektroniki - Dopolnilo A1 (IEC 61190-1-3:2007/A1:2010)
Amandma A1:2010 je dodatek k standardu SIST EN 61190-1-3:2007
Ta del IEC 61190 predpisuje zahteve in preskusne metode za spajkalne zlitine za uporabo v elektroniki, za spajkalni prah, pasto, trak in palice s spajkalno tekočino in brez nje, za uporabo v elektroniki in za “posebne” spajke za uporabo v elektroniki. Za rodovne specifikacije spajkalnih zlitin in tekočin glej ISO 9453, ISO 9454-1 in ISO 9454-2. Ta standard je dokument za nadzor kakovosti in ni namenjen temu, da bi se neposredno nanašal na obnašanje materiala v postopku proizvodnje. Posebne spajke za uporabo v elektroniki zajemajo vse spajke, ki ne ustrezajo popolnoma zahtevam standardnih spajkalnih zlitin in spajkalnih materialov, naštetih v tem dokumentu. Primeri posebnih spajk vključujejo anode, ingote, vnaprej oblikovane kose, palice s kavljem in zanko na koncu, spajkalne praške iz več zlitin itd.
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
01-december-2010
3RYH]RYDOQLPDWHULDOL]DHOHNWURQVNHVHVWDYHGHO =DKWHYH]DVSDMNDOQH]OLWLQH
WHU]DVSDMNDOQHåLFHVVSDMNDOQRWHNRþLQRLQEUH]QMH]DXSRUDERYHOHNWURQLNL
'RSROQLOR$ ,(& $
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic
grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering
applications (IEC 61190-1-3:2007/A1:2010)
Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-3: Anforderungen an
Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von
Elektronikprodukten (IEC 61190-1-3:2007/A1:2010)
Matériaux de fixation pour les assemblages électroniques - Partie 1-3: Exigences
relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et
non fluxées pour les applications de brasage électronique (CEI 61190-1-
3:2007/A1:2010)
Ta slovenski standard je istoveten z: EN 61190-1-3:2007/A1:2010
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD
EN 61190-1-3/A1
NORME EUROPÉENNE
September 2010
EUROPÄISCHE NORM
ICS 31.190
English version
Attachment materials for electronic assembly -
Part 1-3: Requirements for electronic grade solder alloys and fluxed
and non-fluxed solid solders for electronic soldering applications
(IEC 61190-1-3:2007/A1:2010)
Matériaux de fixation Verbindungsmaterialien für Baugruppen
pour les assemblages électroniques - der Elektronik -
Partie 1-3: Exigences relatives Teil 1-3: Anforderungen an Elektroniklote
aux alliages à braser de catégorie und an Festformlote
électronique et brasures solides fluxées mit oder ohne Flussmittel für das Löten
et non fluxées pour les applications von Elektronikprodukten
de brasage électronique (IEC 61190-1-3:2007/A1:2010)
(CEI 61190-1-3:2007/A1:2010)
This amendment A1 modifies the European Standard EN 61190-1-3:2007; it was approved by CENELEC on
2010-09-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which
stipulate the conditions for giving this amendment the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This amendment exists in three official versions (English, French, German). A version in any other language
made by translation under the responsibility of a CENELEC member into its own language and notified to the
Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Management Centre: Avenue Marnix 17, B - 1000 Brussels
© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61190-1-3:2007/A1:2010 E
Foreword
The text of document 91/920/FDIS, future amendment 1 to IEC 61190-1-3:2007, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as amendment A1 to EN 61190-1-3:2007 on 2010-09-01.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the amendment has to be
implemented at national level by publication of
(dop) 2011-06-01
an identical national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2013-09-01
with the amendment have to be withdrawn
__________
Endorsement notice
The text of amendment 1:2010 to the International Standard IEC 61190-1-3:2007 was approved by
CENELEC as an amendment to the European Standard without any modification.
__________
- 3 - EN 61190-1-3:2007/A1:2010
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Remove the existing reference ISO 9453 and replace it by the following new reference:
Publication Year Title EN/HD Year
ISO 9453 2006 Soft solder alloys - Chemical compositions EN ISO 9453 2006
and forms
IEC 61190-1-3 ®
Edition 2.0 2010-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AMENDMENT 1
AMENDEMENT 1
Attachment materials for electronic assembly –
Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-
fluxed solid solders for electronic soldering applications
Matériaux de fixation pour les assemblages électroniques –
Partie 1-3: Exigences relatives aux alliages à braser de catégorie électronique et
brasures solides fluxées et non fluxées pour les applications de brasage
électronique
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
J
CODE PRIX
ICS 31.190 ISBN 978-2-88910-975-3
– 2 – 61190-1-3 Amend.1 © IEC:2010
FOREWORD
This amendment has been prepared by IEC technical committee 91: Electronics assembly
technology
The text of this amendment is based on the following documents:
FDIS Report on voting
91/920/FDIS 91/925/RVD
Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.
The committee has decided that the contents of this amendment and the base publication will
remain unchanged until the stability date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________
Delete in the foreword the totality of the existing patent statements.
Add the following new page INTRODUCTION with the following text
INTRODUCTION
Attention is drawn to the possibility that some of the elements of this document may be the
subject of patent rights. IEC shall not be held responsible for identifying any or all such patent
rights.
The International Electrotechnical Commission (IEC) draws attention to the fact that it is
claimed that compliance with this document may involve the use of a patent concerning in
particular alloys compositions.
IEC takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences
under reasonable and non-discriminatory terms and conditions with applicants throughout the
world. In this respect, the statement of the holder of this patent right is registered with IEC.
Information may be obtained from:
US PAT No. 4879096
Cookson Electronics Assembly Materials
600 Route 440 Jersey City,New Jersey 07304
US PAT No. 5527628
Iowa State University Research Foundation, Inc.
310 Lab of Mechanics
Ames, Iowa 50011-2131, U.S.A.
JP PAT No. 3040929
JP PAT No. 3027441
Matsushita Electric Industrial Co., Ltd.
Matsushita IMP Building 20F 1-3-7, Shiromi, Chouh-ku, Osaka, 540-6319, Japan
61190-1-3 Amend.1 © IEC:2010 – 3 –
JP PAT No. 2805595
Mitsui Mining & Smelting Co., Ltd.
Gate City Ohsaki-West Tower 19th Fl. 1-11-1 Osaki, Shinagawa-ku, Tokyo, 141-8584, Japan
JP PAT No. 3027441
Senju Metal Industry Co., Ltd.
Senju Hashido-cho 23, Adachi-ku, Tokyo, 120-8555, Japan
NOTE Patent rights vary between country of manufacture, sale, use and final destination; suppliers or users
remain responsible for establishing the exact legal position relevant to their own situation.
Attention is drawn to the possibility that some of the elements of this document may be the
subject of patent rights other than those identified above. IEC shall not be held responsible for
identifying any or all such patent rights.
2 Normative references
Remove the existing reference ISO 9453 and replace it by the following new reference:
ISO 9453:2006, Soft solders alloys – Chemical compositions and forms
4.1 Alloy composition
Add the following note at the end of this subclause:
N0TE The alloy short name can be used as identifier of solder alloy(s)
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.