EN 60068-2-58:1999

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

Umweltprüfungen - Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit, Widerstandsfähigkeit gegenüber Auflösen der Metallisierung und Lötwärmebeständigkeit bei oberflächenmontierbaren Bauelemente (SMD)

Essais d'environnement - Partie 2-58: Essais - Essai Td: Méthodes d'essai de la soudabilité, de la résistance de la métallisation à la dissolution et de la résistance à la chaleur de soudage des composants pour montage en surface (CMS)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

General Information

• Status: Withdrawn
• Publication Date: 31-Mar-1999
• Withdrawal Date: 31-Dec-2001
• ICS: 19.040 - Environmental testing
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 01-Sep-2007
• Completion Date: 01-Sep-2007
• Ref Project: SIST EN 60068-2-58:2001 - Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Relations

• Replaced By: EN 60068-2-58:2004 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
• Effective Date: 28-Jan-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-marec-2001
1DGRPHãþD
SIST EN 60068-2-58:2005
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability,
resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
Environmental testing -- Part 2-58: Tests - Test Td: Test methods for solderability,
resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMD)
Umweltprüfungen -- Teil 2-58: Prüfungen - Prüfung Td: Prüfverfahren für Lötbarkeit,
Widerstandsfähigkeit gegenüber Auflösen der Metallisierung und Lötwärmebeständigkeit
bei oberflächenmontierbaren Bauelemente (SMD)
Essais d'environnement -- Partie 2-58: Essais - Essai Td: Méthodes d'essai de la
soudabilité, de la résistance de la métallisation à la dissolution et de la résistance à la
chaleur de soudage des composants pour montage en surface (CMS)
Ta slovenski standard je istoveten z: EN 60068-2-58:1999
ICS:
19.040 Preskušanje v zvezi z Environmental testing
okoljem
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovolje
...