SIST-TS ES 59008-4-3:2007
(Main)Data requirements for semiconductor die -- Part 4-3: Specific requirements and recommendations - Thermal
Data requirements for semiconductor die -- Part 4-3: Specific requirements and recommendations - Thermal
The series of European Specification specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged seminconductor die. This Specification also gives recommendations for general industry good practice in the use of bare die, with or without connection structures, and minimally packaged die. ES 59008-4-3 specifies requirements relating specifically to operational thermal conditions of unpackaged and minimally packaged semiconductor die.
Zahtevani podatki za polprevodniška integrirana vezja - 4-3. del: Specifične zahteve in priporočila -Termični pogoji
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Standards Content (Sample)
SLOVENSKI STANDARD
SIST-TS ES 59008-4-3:2007
01-januar-2007
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Data requirements for semiconductor die -- Part 4-3: Specific requirements and
recommendations - Thermal
Ta slovenski standard je istoveten z: ES 59008-4-3:1999
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST-TS ES 59008-4-3:2007 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST-TS ES 59008-4-3:2007
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