SIST EN 62433-3:2017

EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE) (IEC 62433-3:2017 )

This part of IEC 62433 provides a method for deriving a macro-model to allow the simulation
of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called
Integrated Circuit Emission Model – Radiated Emission, ICEM-RE. The model is intended to
be used for modelling a complete IC, with or without its associated package, a functional
block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output
pins, digital core and supply), when measured or simulated data cannot be directly imported
into simulation tools.
The proposed IC macro-model will be inserted in 3D electromagnetic simulation tools so as to:
• predict the near-radiated emissions from the IC
• evaluate the effect of the radiated emissions on neighbouring ICs, cables, transmission
lines, etc.
This part of IEC 62433 has two main parts:
• the first is the electrical description of ICEM-RE macro-model elements,
• the second part proposes a universal data exchange format called REML based on XML.
This format allows encoding the ICEM-RE in a more useable and generic form for
emission simulation.

EMV-IC-Modellierung - Teil 3: Modelle integrierter Schaltungen für die Simulation des Verhaltens bei elektromagnetischer Beeinflussung - Modellierung von abgestrahlten Aussendungen (ICEM-RE)

Modèles de circuits intégrés pour la CEM - Partie 3: Modèles de circuits intégrés pour la simulation du comportement lors de perturbations électromagnétiques - Modélisation des émissions rayonnées (ICEM-RE) (IEC 62433-3:2017 )

L'IEC 62433-3:2017 présente une méthode pour déterminer un macromodèle permettant de simuler les niveaux d'émissions rayonnées d'un circuit intégré. Ce modèle est habituellement appelé: modèle des émissions de circuits intégrés - Emissions rayonnées (ICEM-RE: Integrated Circuit Emission Model – Radiated Emission). Le modèle est destiné à être utilisé pour modéliser un circuit intégré complet, avec ou sans son boîtier, un bloc fonctionnel et un bloc à propriété intellectuelle (IP) de circuits intégrés analogiques et numériques (broches d'entrée/sortie, cœur numérique et alimentation), lorsque les données mesurées ou simulées ne peuvent pas être importées directement dans des outils de simulation.

Modeliranje integriranih vezij (IC) za elektromagnetno združljivost (EMC) - 3. del: Modeli integriranih vezij za simulacijo obnašanja glede na elektromagnetno odpornost (EMI) - Modeliranje sevanih emisij (ICEM-RE) (IEC 62433-3:2017 )

Ta del standarda IEC 62433 določa metodo za izpeljavo makro modela, ki omogoča simulacijo ravni sevanih emisij integriranega vezja (IC). Ta model običajno imenujemo model emisij integriranega vezja – sevane emisije, ICEM-RE. Model je predviden za uporabo za modeliranje celotnega integriranega vezja s povezanim paketom ali brez njega, funkcionalnega bloka in bloka intelektualne lastnine (IP) analognih in digitalnih integriranih vezij (vhodne/izhodne nožice, digitalno jedro in napajanje), kadar izmerjenih ali simuliranih podatkov ni mogoče neposredno uvoziti v simulacijska orodja.
Predlagani makro model integriranega vezja je treba vstaviti v 3D-elektromagnetna simulacijska orodja za:
• napovedovanje bližnje sevanih emisij iz integriranega vezja;
• ocenjevanje učinka sevanih emisij na sosednja integrirana vezja, kable, prenosne vode itd.
Ta del standarda IEC 62433 ima dva glavna dela:
• prvi je električni opis elementov makro modela ICEM-RE;
• drugi del pa predlaga univerzalni format za izmenjavo podatkov, ki se imenuje REML in temelji na formatu XML.
Ta format omogoča kodiranje modela ICEM-RE v uporabnejši in splošnejši obliki za simulacijo emisij.

General Information

• Status: Published
• Publication Date: 12-Jul-2017
• ICS: 31.200 - Integrated circuits. Microelectronics
• ICS: 33.100.10 - Emission
• Technical Committee: I11 - Imaginarni 11
• Current Stage: 6060 - National Implementation/Publication (Adopted Project)
• Start Date: 07-Jun-2017
• Due Date: 12-Aug-2017
• Completion Date: 13-Jul-2017
• Ref Project: EN 62433-3:2017 - EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)

Standards Content (Sample)

SLOVENSKI STANDARD
SIST EN 62433-3:2017
01-september-2017
Modeliranje integriranih vezij (IC) za elektromagnetno združljivost (EMC) - 3. del:
Modeli integriranih vezij za simulacijo obnašanja glede na elektromagnetno
odpornost (EMI) - Modeliranje sevanih emisij (ICEM-RE) (IEC 62433-3:2017 )
EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation -
Radiated emissions modelling (ICEM-RE) (IEC 62433-3:2017 )
Modèles de circuits intégrés pour la CEM - Partie 3: Modèles de circuits intégrés pour la
simulation du comportement lors de perturbations électromagnétiques - Modélisation des
émissions rayonnées (ICEM-RE) (IEC 62433-3:2017 )
Ta slovenski standard je istoveten z: EN 62433-3:2017
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
33.100.10 Emisija Emission
SIST EN 62433-3:2017 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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SIST EN 62433-3:2017

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SIST EN 62433-3:2017


EUROPEAN STANDARD EN 62433-3

NORME EUROPÉENNE

EUROPÄISCHE NORM
June 2017
ICS 33.100.10; 31.200

English Version
EMC IC modelling - Part 3: Models of Integrated Circuits for EMI
behavioural simulation - Radiated emissions modelling (ICEM-
RE)
(IEC 62433-3:2017)
Modèles de circuits intégrés pour la CEM - Partie 3: EMV-IC-Modellierung - Teil 3: Modelle integrierter
Modèles de circuits intégrés pour la simulation du Schaltungen für die Simulation des Verhaltens bei
comportement lors de perturbations électromagnétiques - elektromagnetischer Beeinflussung - Modellierung von
Modélisation des émissions rayonnées (ICEM-RE) abgestrahlten Aussendungen (ICEM-RE)
(IEC 62433-3:2017) (IEC 62433-3:2017)
This European Standard was approved by CENELEC on 2017-03-03. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.



European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
 Ref. No. EN 62433-3:2017 E

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SIST EN 62433-3:2017
EN 62433-3:2017
European foreword
The text of document 47A/1000/FDIS, future edition 1 of IEC 62433-3, prepared by SC 47A
"Integrated circuits" of IEC/TC 47 "Semiconductor devices" was submitted to the IEC-CENELEC
parallel vote and approved by CENELEC as EN 62433-3:2017.

The following dates are fixed:
(dop) 2017-12-03
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2020-03-03
standards conflicting with the
document have to be withdrawn

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 62433-3:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
1)
ISO 8879:1986 NOTE Harmonized as EN 28879:1990


1) Withdrawn publication
2

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SIST EN 62433-3:2017
EN 62433-3:2017

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.

NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 61967-1 -  Integrated circuits - Measurement of EN 61967-1 -
electromagnetic emissions, 150 kHz to 1
GHz -- Part 1: General conditions and
definitions
IEC 62433-2 -  EMC IC modelling - Part 2: Models of FprEN 62433-2 -
integrated circuits for EMI behavioural
simulation - Conducted emissions
modelling (ICEM-CE)
IEC/TS 61967-3 -  Integrated circuits - Measurement of - -
electromagnetic emissions - Part 3:
Measurement of radiated emissions -
Surface scan method
IEC/TS 62433- -  EMC IC modelling - Part 1: General - -
1:2011 modelling framework
ANSI INCITS 4 -  Information Systems - Coded Character - -
Sets - 7-Bit American National Standard
Code for Information Interchange (7-Bit
ASCII)

3

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SIST EN 62433-3:2017

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SIST EN 62433-3:2017




IEC 62433-3

®


Edition 1.0 2017-01




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE
colour

inside










EMC IC modelling –

Part 3: Models of integrated circuits for EMI behavioural simulation – Radiated

emissions modelling (ICEM-RE)




Modèles de circuits intégrés pour la CEM –

Partie 3: Modèles de circuits intégrés pour la simulation du comportement lors


de perturbations électromagnétiques – Modélisation des émissions rayonnées

(ICEM-RE)












INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




31.200; 33.100.10 ISBN 978-2-8322-3878-3



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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SIST EN 62433-3:2017
– 2 – IEC 62433-3:2017  IEC 2017
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions, abbreviations and conventions . 9
3.1 Terms and definitions . 9
3.2 Abbreviations . 10
3.3 Conventions . 10
4 Philosophy . 10
5 ICEM-RE macro-model description . 11
5.1 General . 11
5.2 PDN description . 12
5.3 IA description . 16
5.4 Electromagnetic field calculation and simulation . 16
6 REML format . 17
6.1 General . 17
6.2 REML structure . 18
6.3 Global keywords . 19
6.4 Header section . 19
6.5 Frequency definitions . 20
6.6 Coordinate system definition . 20
6.7 Reference definition . 21
6.8 Validity section . 21
6.8.1 General . 21
6.8.2 Attribute definitions . 22
6.9 PDN . 24
6.9.1 General . 24
6.9.2 Attribute definitions . 25
6.9.3 PDN of a single-frequency ICEM-RE . 26
6.9.4 PDN for multi-frequency ICEM-RE . 29
6.10 IA . 32
6.10.1 General . 32
6.10.2 Attribute definitions . 33
6.10.3 IA of a single-frequency ICEM-RE . 34
6.10.4 IA for multi-frequency ICEM-RE . 37
7 Extraction . 38
7.1 General . 38
7.2 Environmental extraction constraints . 39
7.3 Obtaining model parameters from near-field data . 39
7.3.1 General . 39
7.3.2 PDN . 40
7.3.3 IA . 42
7.4 Extraction based on ICEM-CE simulation . 45
7.4.1 General . 45
7.4.2 PDN . 45
7.4.3 IA . 46
8 Validation . 46

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SIST EN 62433-3:2017
IEC 62433-3:2017  IEC 2017 – 3 –
Annex A (normative) Preliminary definitions for XML representation . 48
A.1 XML basics . 48
A.1.1 XML declaration . 48
A.1.2 Basic elements . 48
A.1.3 Root element . 48
A.1.4 Comments . 48
A.1.5 Line terminations . 49
A.1.6 Element hierarchy . 49
A.1.7 Element attributes . 49
A.2 Keyword requirements . 49
A.2.1 General . 49
A.2.2 Keyword characters . 49
A.2.3 Keyword syntax . 50
A.2.4 File structure . 50
A.2.5 Values . 52
Annex B (informative) Electromagnetic fields radiated by an elementary electric and
magnetic dipole . 55
B.1 Electric dipole . 55
B.2 Magnetic dipole. 57
Annex C (informative) Example files . 60
C.1 Minimum default ICEM-RE file . 60
C.2 Microcontroller example in REML format . 61
Annex D (normative) REML valid keywords and usage . 63
D.1 Root element keywords . 63
D.2 File header keywords . 64
D.3 Validity section keywords . 65
D.4 Global keywords . 65
D.5 Pdn section keywords . 66
D.6 Ia section keywords . 67
Annex E (informative) ICEM-RE extraction methods . 69
E.1 General . 69
E.2 ICEM-RE Modelling methods . 69
E.2.1 Model . 69
Hman
E.2.2 Model . 69
H
E.2.3 Model . 71
EM_Inv
E.2.4 Model . 72
EM_Iter
E.2.5 Model . 72
EM_TD
E.2.6 Model selection guide . 73
E.3 ICEM-RE modelling environment from near-field data . 73
E.3.1 General . 73
E.3.2 Modelling design-flow . 74
E.3.3 ICEM-RE importation into 3D electromagnetic tools . 75
E.4 ICEM-RE modelling from ICEM-CE . 76
Annex F (informative) ICEM-RE model validation examples . 78
F.1 General . 78
F.2 Validation on a microcontroller . 78
F.2.1 General . 78
F.2.2 Details of the microcontroller . 78

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SIST EN 62433-3:2017
– 4 – IEC 62433-3:2017  IEC 2017
F.2.3 Case 1: Choosing manual model Model . 78
Hman
F.2.4 Case 2: Choosing one of the automatic magnetic field models . 79
F.3 Validation on an oscillator circuit . 81
F.4 Example of validation on passive devices . 84
F.5 Examples of validation on active devices . 85
F.5.1 Extraction from near-field measurements . 85
F.5.2 Extraction from ICEM-CE model . 85
Annex G (informative) ICEM-RE macro-model usage examples . 86
G.1 General . 86
G.2 Methodology for exploiting ICEM-RE macro-model . 86
Bibliography . 88

Figure 1 – General ICEM-RE model structure. 12
Figure 2 – Geometrical representation of the ICEM-RE PDN . 13
Figure 3 – Representation of an elementary dipole in the ICEM-RE PDN . 13
Figure 4 – An elementary current loop of radius “a” in 3D space . 14
Figure 5 – Duality theorem between a current loop and a magnetic dipole . 14
Figure 6 – Example of referential points to describe the geometry . 15
Figure 7 – PDN definition at three different frequencies . 16
Figure 8 – REML inheritance hierarchy . 18
Figure 9 – Format for defining PDN vector data in an external file . 28
Figure 10 – Format for defining IA vector data in an external file . 36
Figure 11 – Electromagnetic field measurement . 39
Figure 12 – B field in nT measured at 3 mm above the microprocessor at 80 MHz. 40
z
Figure 13 – Example of electromagnetic field emitted by an elementary current line . 41
Figure 14 – Manual current mapping . 41
Figure 15 – Model representation with N automatically detected dipoles . 42
Figure 16 – Comparison between the modelled and measured EM fields at 2 mm
above an oscillator . 44
Figure 17 – A simple ICEM-CE PDN representing the package and the internal
network impedance between the power rails . 45
Figure 18 – Reconstructing the geometry of the package model (ICEM-RE PDN) from
IBIS and its link with the electrical model (ICEM-CE PDN) . 46
Figure 19 – Graphical representation of the example validation procedure . 47
Figure A.1 – Multiple XML files . 51
Figure A.2 – XML files with data files (*.dat) . 51
Figure A.3 – XML files with additional files . 52
Figure B.1 – An elementary current line in space . 55
Figure B.2 – Elementary magnetic dipole in space . 57
Figure C.1 – Microcontroller used for illustration . 61
Figure C.2 – Data file representing the PDN information of the microcontroller . 62
Figure C.3 – Data file representing the IA information of the microcontroller . 62
Figure E.1 – Manually defined electric dipole array in Model . 69
Hman
Figure E.2 – Electric and magnetic dipole array in Model . 71
EM_Inv
Figure E.3 – Example of an ICEM-RE modelling environment . 74

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SIST EN 62433-3:2017
IEC 62433-3:2017  IEC 2017 – 5 –
Figure E.4 – ICEM-RE modelling design-flow . 75
Figure E.5 – Example of an imported ICEM-RE PDN and IA in a 3D simulation tool . 76
Figure E.6 – Design-flow to obtain ICEM-RE from ICEM-CE model . 77
Figure F.1 – Microcontroller circuit used for model validation . 78
Figure F.2 – Manual dipoles representing the PDN of the microcontroller . 79
Figure F.3 – Comparison between the modelled and measured fields at 4 mm above
the microcontroller using Model . 79
Hman
Figure F.4 – Validation of Model on the microcontroller . 80
H
Figure F.5 – Detection of dipoles representing the microcontroller using Model . 80
EM_Iter
Figure F.6 – Validation of Model on the microcontroller . 81
EM_Iter
Figure F.7 – Oscillator circuit used for model validation . 81
Figure F.8 – Schematic of the oscillator used for validation . 82
Figure F.9 – Validation of the magnetic field predicted with Model and
EM_Inv
Model on the oscillator at 10 mm height . 83
EM_Iter
Figure F.10 – Validation of the electric field predicted with Model and
EM_Inv
Model on the oscillator at 10 mm height . 83
EM_Iter
Figure F.11 – Modelled maximum total magnetic field as a function of height (z) above
the oscillator compared with measurements . 84
Figure G.1 – Typical EMC issues at equipment and system level covered by ICEM-RE . 87

Table 1 – PDN format . 15
Table 2 – Definition of the Validity section . 22
Table 3 – Definition of the Submodel section of the Pdn element . 25
Table 4 – Definition of the Vector keyword in the Pdn section . 25
Table 5 – Valid fields of the Submodel keyword for single-frequency PDN . 27
Table 6 – Conditions for correct annotation of single-frequency PDN by the REM
parser . 27
Table 7 – Valid fields of the Vector keyword for single-frequency PDN . 27
Table 8 – Valid file extensions in the Pdn section . 29
Table 9 – Conditions for correct annotation of multi-frequency PDN by the REM parser . 30
Table 10 – Definition of the Submodel section of the Ia element . 32
Table 11 – Definition of the Vector keyword in the Ia section . 33
Table 12 – Valid fields of the Submodel keyword for single-frequency IA . 34
Table 13 – Conditions for correct annotation of single-frequency IA by the REM parser . 34
Table 14 – Valid fields of the Vector keyword for single-frequency IA . 35
Table 15 – Accepted file extensions in the Ia section . 37
Table 16 – Conditions for correct annotation of multi-frequency IA by the REM parser . 37
Table A.1 – Valid logarithmic units . 53
Table E.1 – ICEM-RE model selection guide . 73
Table F.1 – ICEM-RE model validation on passive structures. 85

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SIST EN 62433-3:2017
– 6 – IEC 62433-3:2017  IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

EMC IC MODELLING –

Part 3: Models of integrated circuits for EMI behavioural simulation –
Radiated emissions modelling (ICEM-RE)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an inter
...