CLC/TR 62258-3:2007

Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage

Supersedes ES 59008-4-2:2000

Halbleiter-Chip-Erzeugnisse - Teil 3: Empfehlungen für die Praxis bei Handhabung, Verpackung und Lagerung

Izdelki s polprevodniškimi čipi - 3. del: Priporočila za dobro prakso pri ravnanju z njimi, pakiranju in skladiščenju (IEC/TR 62258-3:2005)

General Information

• Status: Withdrawn
• Publication Date: 08-Feb-2007
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: CLC/SR 47 - Semiconductor devices
• Drafting Committee: IEC/TC 47 - IEC_TC_47
• Parallel Committee: IEC/TC 47 - IEC_TC_47
• Ref Project: SIST-TP CLC/TR 62258-3:2008 - Semiconductor die products -- Part 3: Recommendations for good practice in handling, packing and storage

Standards Content (Sample)

SLOVENSKI STANDARD
01-januar-2008
1DGRPHãþD
SIST-TS ES 59008-4-2:2007
,]GHONLVSROSUHYRGQLãNLPLþLSLGHO3ULSRURþLOD]DGREURSUDNVRSULUDYQDQMX]
QMLPLSDNLUDQMXLQVNODGLãþHQMX,(&75
Semiconductor die products - Part 3: Recommendations for good practice in handling,
packing and storage (IEC/TR 62258-3:2005)
Halbleiter-Chip-Erzeugnisse - Teil 3: Empfehlungen für die Praxis bei Handhabung,
Verpackung und Lagerung (IEC/TR 62258-3:2005)
Ta slovenski standard je istoveten z: CLC/TR 62258-3:2007
ICS:
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

TECHNICAL REPORT
CLC/TR 62258-3
RAPPORT TECHNIQUE
February 2007
TECHNISCHER BERICHT
ICS 31.080.99 Supersedes ES 59008-4-2:2000

English version
Semiconductor die products –
Part 3: Recommendations for good practice in handling,
packing and storage
(IEC/TR 62258-3:2005)
Halbleiter-Chip-Erzeugnisse –
Teil 3: Empfehlungen für die Praxis
bei Handhabung,
Verpackung und Lagerung
(IEC/TR 62258-3:2005)
This Technical Report was approved by CENELEC on 2006-12-12.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. CLC/TR 62258-3:2007 E

Foreword
The text of the Technical Report IEC/TR 62258-3:2005, prepared by IEC TC 47, Semiconductor devices,
was submitted to vote and was approved by CENELEC as CLC/TR 62258-3 on 2006-12-12.
This Technical Report supersedes ES 59008-4-2:2000.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the Technical Report IEC/TR 62258-3:2005 was approved by CENELEC as a Technical Report
without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 62258-2 NOTE Harmonized as EN 62258-2:2005 (not modified).
__________
- 3 - CLC/TR 62258-3:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
IEC 60050 Series International Electrotechnical Vocabulary - -
(IEV)
1) 2)
IEC 60286-3 Packaging of components for automatic EN 60286-3
- 1998
handling -
Part 3: Packaging of surface mount
components on continuous tapes
IEC 61340-5-1 1998 Electrostatics –
+ corr. February 1999 Part 5-1: Protection of electronic devices EN 61340-5-1 2001
from electrostatic phenomena - General + corr. April 2001
requirements
IEC 61340-5-2 1999 Electrostatics – EN 61340-5-2 2001
Part 5-2: Protection of electronic devices + corr. August 2001
from electrostatic phenomena - User
guide
1) 2)
IEC 62258-1 Semiconductor die products – EN 62258-1
- 2005
Part 1: Requirements for procurement and

use
1) 2)
ISO 14644-1 - Cleanrooms and associated controlled EN ISO 14644-1 1999
environments –
Part 1: Classification of air cleanliness

1)
Undated reference.
2)
Valid edition at date of issue.

TECHNICAL IEC
REPORT TR 62258-3
First edition
2005-06
Semiconductor die products –
Part 3:
Recommendations for good practice
in handling, packing and storage

 IEC 2005  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale X

International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – TR 62258-3  IEC:2005(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope and object.7
2 Normative references .7
3 Terms and definitions .8
4 Handling – Good practice .8
4.1 General .8
4.2 Working environmental controls.8
4.3 General handling precautions.8
4.4 Cleanroom good practice.8
5 Process handling issues .12
5.1 Wafer sawing .12
5.2 Die sorting.13
6 Die and wafer transport and storage media .16
6.1 Wafer carriers and cassettes .16
6.2 In-process carriers and transport systems .17
6.3 Packing for shipment of unsawn wafers.17
6.4 Packing for shipment of sawn wafers.18
6.5 Packing for shipment of single wafers .21
6.6 Packing for shipment of die using trays .21
6.7 Packing for shipment of die using tape-and-reel .25
6.8 Secondary packing for shipment.27
7 Storage good practice .28
7.1 Die and wafer storage .28
7.2 Short-term storage environment and conditions.28
7.3 Storage time limitations .28
7.4 Sawn wafer on wafer frame or ring .29
7.5 Die products in the production area .29
7.6 Die in tape-and-reel.29
7.7 Dry-packed die products.29
8 Traceability good practice.29
8.1 General .29
8.2 Wafer traceability .29
8.3 Die products traceability.29
8.4 Wafer and die back side marking.30
9 Guidelines for long-term storage (die banking) of bare die and wafers.30
9.1 General .30
9.2 Preparing for storage.30
9.3 Damage to die products during long-term storage .31
9.4 Long-term storage environment .31
9.5 Recommended inert atmosphere purity .32
9.6 Chemical contamination .32
9.7 Electrical effects.33

TR 62258-3  IEC:2005(E) – 3 –
9.8 Protection from radiation.33
9.9 Periodic qualification of stored die products .33
10 Good practice for automated handling during assembly .34
10.1 Removal of die from shipping media.34
10.2 Equipment out of service .34

Annex A (informative) Planning checklist .35
Annex B (informative) Material specifications.41

Bibliography .44

Figure 1 – Bevel cut for bare die and flip-chip products.12
Figure 2 – Die eject needle .15
Figure 3 – Wafer jar structure.18
Figure 4 – Film frame.19
Figure 5 – Grip ring.20
Figure 6 – Single waffle pack .22
Figure 7 – Stacked waffle packs.23
Figure 8 – Vacuum-release trays.24
Figure 9 – Corner relief in the cavity of a chip tray.25
Figure 10 – Tape-and-reel packing structure .27
Figure 11 – Packaging material for shipment .27

Table 1 – Example die eject marks.15
Table A.1 – Planning checklist .35

– 4 – TR 62258-3  IEC:2005(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DIE PRODUCTS –
Part 3: Recommendations for good practice
in handling, packing and storage

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that se
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