ISO 11553-1:2020
(Main)Safety of machinery - Laser processing machines - Part 1: Laser safety requirements
Safety of machinery - Laser processing machines - Part 1: Laser safety requirements
This document describes laser radiation hazards arising in laser processing machines, as defined in 3.7. It also specifies the safety requirements relating to laser radiation hazards, as well as the information to be supplied by the manufacturers of such equipment (in addition to that prescribed by IEC 60825).
Requirements dealing with noise as a hazard from laser processing machines are included in ISO 11553‑3:2013.
This document is applicable to machines using laser radiation to process materials.
It is not applicable to laser products, or equipment containing such products, which are manufactured solely and expressly for the following applications:
- photolithography;
- stereolithography;
- holography;
- medical applications (per IEC 60601-2-22);
- data storage.
General Information
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Standards Content (Sample)
INTERNATIONAL ISO
STANDARD 11553-1
Second edition
2020-04
Safety of machinery — Laser
processing machines —
Part 1:
Laser safety requirements
Sécurité des machines — Machines à laser —
Partie 1: Exigences de sécurité laser
Reference number
©
ISO 2020
© ISO 2020
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ii © ISO 2020 – All rights reserved
Contents Page
Foreword .iv
Introduction .v
1 Scope . 1
2 Normative references . 1
3 Terms and definitions . 2
4 Hazards generated by laser radiation . 5
4.1 General . 5
4.2 Laser radiation hazards/sources of laser radiation emission . 6
4.3 Laser radiation hazards induced by external effects (interferences) . 7
4.4 Characteristics of laser radiation . 7
5 Safety requirements and measures . 8
5.1 General requirements . 8
5.2 Risk assessment with regard to laser radiation hazards . 8
5.3 Implementation of risk reduction measures. 9
5.3.1 General. 9
5.3.2 Safety measures against laser radiation hazards in dependence of the locations . 9
5.3.3 Safety measures against laser radiation hazards.10
5.3.4 Engineering control measures .13
6 Verification of the safety requirements and risk reduction measures .14
7 Information for use .15
8 Labelling .16
Annex A (informative) Potential hazards .18
Bibliography .21
Foreword
ISO (the International Organization for Standardization) is a worldwide federation of national standards
bodies (ISO member bodies). The work of preparing International Standards is normally carried out
through ISO technical committees. Each member body interested in a subject for which a technical
committee has been established has the right to be represented on that committee. International
organizations, governmental and non-governmental, in liaison with ISO, also take part in the work.
ISO collaborates closely with the International Electrotechnical Commission (IEC) on all matters of
electrotechnical standardization.
The procedures used to develop this document and those intended for its further maintenance are
described in the ISO/IEC Directives, Part 1. In particular, the different approval criteria needed for the
different types of ISO documents should be noted. This document was drafted in accordance with the
editorial rules of the ISO/IEC Directives, Part 2 (see www .iso .org/ directives).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. ISO shall not be held responsible for identifying any or all such patent rights. Details of
any patent rights identified during the development of the document will be in the Introduction and/or
on the ISO list of patent declarations received (see www .iso .org/ patents).
Any trade name used in this document is information given for the convenience of users and does not
constitute an endorsement.
For an explanation of the voluntary nature of standards, the meaning of ISO specific terms and
expressions related to conformity assessment, as well as information about ISO's adherence to the
World Trade Organization (WTO) principles in the Technical Barriers to Trade (TBT) see www .iso .org/
iso/ foreword .html.
This document was prepared by Technical Committee ISO/TC 172, Optics and photonics, Subcommittee
SC 9, Laser and electro-optical systems, in collaboration with IEC/TC 76, Optical radiation safety and laser
equipment.
This second edition cancels and replaces the first edition (ISO 11553-1:2005), which has been technically
revised with the following main changes:
— the terms "beam delivery systems", "beam path components", "beam shaping components", "beam
switching components" and "fibre optic cable" and "fibre connector" were added;
— the document was restructured;
— the Title was adapted;
— other hazards than laser radiation hazards are not considered in this document but are described
in Annex A;
— operating modes (automatic mode, setting mode, manual intervention mode, service mode) and the
operating mode selector switch were added;
— Clause 5 is separated in requirements regarding different locations and the different modes of
operation;
— in Clause 6 the verification procedures were described in more detail;
— Annex B was deleted.
A list of all the parts of ISO 11553 can be found on the ISO website.
Any feedback or questions on this document should be directed to the user’s national standards body. A
complete listing of these bodies can be found at www .iso .org/ members .html.
iv © ISO 2020 – All rights reserved
Introduction
The Machinery Safety Directive issued by the European Parliament and the Council of the EC outlines
essential and mandatory requirements that must be met in order to ensure that machinery is safe. In
response, CEN/CENELEC initiated a programme to produce safety standards for machines and their
applications. This document is one in that series.
It has been prepared as a harmonized standard to provide a means of conforming to the essential safety
requirements of the Machinery Directive and associated EFTA Regulations.
This document is a type B standard as stated in ISO 12100. The provisions of this document may be
supplemented or modified by a type C standard.
For machines which are covered by the scope of a type C standard and which have been designed and
built according to the provision of that standard, the provisions of that type C standard take precedence
over the provisions of this type B standard.
The purpose of this document is to prevent injuries to persons by
— listing potential laser radiation hazards generated by machines containing lasers,
— specifying safety measures and verifications necessary for reducing the risk caused by specific
hazardous conditions,
— providing references to pertinent standards, and
— specifying the information which is to be supplied to the users so that they can establish proper
procedures and precautions.
INTERNATIONAL STANDARD ISO 11553-1:2020(E)
Safety of machinery — Laser processing machines —
Part 1:
Laser safety requirements
1 Scope
This document describes laser radiation hazards arising in laser processing machines, as defined in 3.7.
It also specifies the safety requirements relating to laser radiation hazards, as well as the information
to be supplied by the manufacturers of such equipment (in addition to that prescribed by IEC 60825).
Requirements dealing with noise as a hazard from laser processing machines are included in
ISO 11553-3:2013.
This document is applicable to machines using laser radiation to process materials.
It is not applicable to laser products, or equipment containing such products, which are manufactured
solely and expressly for the following applications:
— photolithography;
— stereolithography;
— holography;
— medical applications (per IEC 60601-2-22);
— data storage.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments) applies.
ISO 3864 (all parts), Graphical symbols — Safety colours and safety signs
ISO 11145:2018, Optics and photonics — Lasers and laser-related equipment — Vocabulary and symbols
ISO 12100:2010, Safety of machinery — General principles for design — Risk assessment and risk reduction
ISO 13849-1:2015, Safety of machinery — Safety-related parts of control systems — Part 1: General
principles for design
ISO 13849-2:2012, Safety of machinery — Safety-related parts of control systems — Part 2: Validation
ISO 13850:2012, Safety of machinery — Emergency stop function — Principles for design
IEC 60204-1:2016, Safety of machinery — Electrical equipment of machines — Part 1: General requirements
IEC 60825-1:2014, Safety of laser products — Part 1: Equipment classification and requirements
IEC 60825-4:2006, Safety of laser products — Part 4: Laser guards
IEC 62061:2005, Safety of machinery — Functional safety of safety-related electrical, electronic and
programmable electronic control systems
3 Terms and definitions
For the purposes of this document, the terms and definitions given in ISO 11145:2018, ISO 12100:2010,
IEC 60825-1:2014 and IEC 60825-4:2006 and the following apply.
ISO and IEC maintain terminological databases for use in standardization at the following addresses:
— ISO Online browsing platform: available at http:// www .iso .org/ obp.
— IEC Electropedia: available at http:// www .electropedia .org/
3.1
beam delivery system
system comprised of all components, including all optical beam components and potential beam paths
and enclosures, which when combined, transfer laser radiation emitted from the laser (according to
definition in IEC 60825-1:2014) to the workpiece. The beam delivery system can include all elements
for guiding, shaping and switching the laser beams as well as the enclosure of and support for the beam
path components
[SOURCE: IEC 60825-4:2006/AMD 2:2011, G.2.1, modified — replaced "workpiece. These components may
include" by "workpiece and where the components can include" and changed laser beam to laser beams.]
3.2
beam path component
optical component which lies on a defined beam path
Note 1 to entry: See IEC 60825-1:2014, 3.16.
EXAMPLE A beam steering mirror, a focus lens, a fibre optic cable or a fibre optic cable connector.
3.3
beam shaping component
optical component integrated in the beam path to transform the profile or cross-section of the laser
beam by means of apertures, reflective, refractive or diffractive optical components
EXAMPLE Lens or integrating optical element for hardening applications.
3.4
beam switching component
optical component or an assembly of components introduced in the beam path to direct or divert, under
external control, the beam path along (a) predetermined direction(s)
Note 1 to entry: The external control allows the beam path to be switched from one predetermined direction to
another.
3.5
fibre optic cable
optical beam guiding component that enables the transfer of laser radiation along a transparent medium
Note 1 to entry: The fibre optic cable can be equipped with sensors to monitor breakage and/or temperature.
Note 2 to entry: A fibre optic cable can have a glass or another core that carries the laser radiation and
is surrounded by cladding. The outside of the fibre is protected by cladding and can be further protected by
additional layers of other materials such as polymer or a metal to protect the fibre from mechanical deformation,
ingress of water, etc. In this document, this term also includes other forms of transmission devices such as
waveguides.
3.6
fibre connector
fibre component, that connects the fibre optic cable with other components in the beam path
Note 1 to entry: The fibre connector can be equipped with sensors to monitor its position (connected/
disconnected).
2 © ISO 2020 – All rights reserved
Note 2 to entry: Typically, fibre connectors connect the fibre with the laser and the laser processing head.
3.7
laser processing machine
machine in which (an) embedded laser(s) provide(s) sufficient energy or power to melt, evaporate, or
cause a phase transition in at least a part of the workpiece, and which is ready to use in function and safety
3.8
hazard area
danger zone
space within and/or around machinery in which a person can be exposed to a hazard
Note 1 to entry: Laser hazard area, within which the beam irradiance or radiant expose exceeds the MPE including
the possibility of accidental misdirection of the laser beam (see definition according to IEC 60825-1:2014).
3.9
process zone
area where the laser beam interacts with the material of the workpiece
3.10
location with controlled access
location where the hazard is inaccessible except to authorized persons who have received adequate
training in laser safety and servicing of the system involved
Note 1 to entry: The access to the location is controlled by authorization systems, e.g. keys, password.
Note 2 to entry: See Table 1.
EXAMPLE Service engineers that need to work in a guarded laser hazard area, or in excess of the MPE
respectively. Protective measures include, besides technical and administrative means, adequate personal
protective equipment (laser protective eyewear, protective clothing).
3.11
location with restricted access
location where the hazard is inaccessible to the public but may be accessible to other observers or other
personnel untrained in laser safety
Note 1 to entry: The location with restricted access, for which personnel are kept from being exposed to the laser
radiation hazards by guards/walls, barriers or other methods.
Note 2 to entry: See Table 1.
EXAMPLE Performing service at a laser processing machine located in a shop floor, which is the restricted
area. The laser hazard area is screened by means of vertical mobile laser guards/walls, which are labelled with
safety signs respectively. Reflected laser radiation can propagate to upper floors or scaffold platforms. Personnel
having access to the shop floor is trained in organizational measures, so that they follow the organizational
safety measures (prohibitions/warnings).
3.12
location with unrestricted and uncontrolled access
location where access is not limited or controlled
Note 1 to entry: All people, including the public can have access to the location.
Note 2 to entry: See Table 1.
Note 3 to entry: If the machine is used under public access, servicing can take place by generating locations with
restricted access or locations with controlled access.
EXAMPLE Typically, these machines are exhibited or demonstrated on fairs and exhibitions. Since the public
can have access to the location, no hazards may emanate from the laser processing machine.
Table 1 — Description of locations
Location Controlled Restricted Unrestricted and uncontrolled
Authorized and trained Personnel untrained in laser
People All, including the public
in laser safety safety but not the public
3.13
automatic mode
production
operating mode, during which the machine is used as intended (normal
use), including
— loading and unloading of parts and/or materials to be processed,
— processing during which the laser beam works alone or in conjunction with other tools
Note 1 to entry: During automatic mode (normal use) safeguarding equipment is closed.
Note 2 to entry: The loading/unloading can take place fully or partly automated or manual.
3.14
setting mode
operating mode, during which laser adjustments or settings are carried
out by the operator
Note 1 to entry: This is required for changes e.g. of the workpiece, the processing movement paths or the process
parameters. During setting mode safeguarding equipment is open, but safety measures, such as significantly
reduced speed, or step-mode, reduced laser output power, allow the operator to intervene in the process.
3.15
manual intervention mode
operating mode, during which single workpieces can be laser processed
and the process can be observed by the operator
3.16
service mode
operating mode, in which the machine is operated, to carry out
corrective actions
EXAMPLE Fault diagnosis, equipment strip-down and repairing, cleaning of optical elements or adjustments
or alignment.
3.17
operating mode selector switch
switch or another selection device, which allows the use of the laser
processing machine in several control or operating modes, requiring different protective measures
and/or work procedures and which can be locked in each position
Note 1 to entry: The selection device includes but is not limited to software.
3.18
modification
change to the machine, which makes it capable of processing materials in a manner which differs from
the original design, or which makes it capable of processing materials differently from how it was
envisaged in the original design, or which affects the safety characteristics of a machine
4 © ISO 2020 – All rights reserved
3.19
subassembly
constituent part needed for proper performance of the laser processing machine
Note 1 to entry: A laser processing subassembly can be of any laser class in accordance with IEC 60825-1:2014.
3.20
workpiece
material intended to be processed by laser radiation, i.e. the target of the laser beam
3.21
maximum permissible exposure
MPE
level of laser radiation to which, under normal circumstances, persons may be exposed without
suffering adverse effects
Note 1 to entry: The MPE levels represent the maximum level to which the eye or skin can be exposed without
consequential injury immediately or after a long time and are related to the wavelength of the laser radiation,
the pulse duration or exposure duration, the tissue at risk and, for visible and near infra-red laser radiation in
the range 400 nm to 1 400 nm, the size of the retinal image. Maximum permissible exposure levels are (in the
existing state of knowledge) specified in IEC 60825-1:2014, Annex A.
Note 2 to entry: The MPE values given in IEC 60825-1:2014, Annex A are informative and are provided so that
the manufacturer can calculate the NOHD, perform a risk analysis and inform the user about safe usage of the
product. Exposure limits for the eye and the skin of employees in the workplace and the general public are in
many countries specified in national laws. These legally binding national exposure limits might differ from the
MPEs given in IEC 60825-1:2014, Annex A.
[SOURCE: IEC 60825-1:2014, 3.59, modified — in Notes to entry, included IEC 60825-1:2014 before
Annex A indication for clarity.]
3.22
nominal ocular hazard area
NOHA
area within which the beam irradiance or radiant exposure exceeds the appropriate corneal maximum
permissible exposure (MPE), including the possibility of accidental misdirection of the laser beam
Note 1 to entry: If the NOHA includes the possibility of viewing through optical aids, this is termed the
"extended NOHA".
[SOURCE: IEC 60825-1:2014, 3.64]
3.23
foreseeable exposure limit
FEL
maximum laser exposure on the front surface of the laser guard, within the maintenance inspection
interval, assessed under normal and reasonably foreseeable fault conditions
[SOURCE: IEC 60825-4:2006, 3.4]
4 Hazards generated by laser radiation
4.1 General
A number of different hazards can emanate from a laser processing machine. This document is
(exclusively) addressed to the specific hazards resulting from laser radiation arising in laser processing
machines.
Secondary hazards, which are caused by laser beam/material interaction, such as the generation of
hazardous substances (fumes, vapours, gases), fire/explosion risks or the generation of secondary
radiation, e.g. UV-radiation or ionizing radiation, are not considered in this document.
Other hazards which can emanate from a laser processing machine are given in Annex A.
Particular hazards are also covered by harmonized standards (examples):
For noise reduction and noise measurement methods for laser processing machines and hand-held
processing devices and associated auxiliary equipment (accuracy grade 2) see ISO 11553-3:2013,
Annex A.
For assessment and reduction of risks arising from radiation (laser and ionizing radiation excluded)
emitted by machinery see EN 12198-1 to EN 12198-3.
For the evaluation of the emission of airborne hazardous substances, generated during laser
material processing (such as particulate and gaseous substances; e.g. fumes, vapours, gases) see
EN 1093 (all parts).
For reduction of risks to health resulting from hazardous substances emitted by machinery see
ISO 14123-1 and ISO 14123-2.
4.2 Laser radiation hazards/sources of laser radiation emission
Laser radiation hazards can originate from a direct laser beam or a reflected/scattered laser beam. The
normal use as well as malfunctions/reasonably foreseeable fault conditions have to be considered.
Possible emission sources of a direct beam are:
a) aperture of an embedded laser source,
b) beam delivery system within a laser processing machine,
c) laser beam emitted from the processing head (to the workpiece),
d) laser beam emitted from a scanning unit (to the workpiece).
Possible emission sources of a reflected beam are:
— elements (with reflective surface) within the beam delivery system of the laser processing machine,
— the workpiece holder (if the workpiece is missing),
— elements in the processing zone,
— elements inside the housing of a machine (e.g. handling system, suction pipes, parts of guards),
— the workpiece, processed by the laser processing machine.
The optical properties (e.g. surface roughness and reflectivity) of the material exposed to the laser
beam decisively determine the kind of reflection (direct/specular reflection or scattered reflection) and
thus the risk level. This has impact on both the foreseeable exposure limit (FEL) at the inner surface of
a machine enclosure/guard or the resulting irradiance or the radiant exposure at a machine workplace
or at a certain distance to the machine.
Inadequate design or malfunctions of laser components and machinery equipment can also be the
reason for laser radiation hazards/emission (or a misguided laser beam):
— damaged optical fibre cable,
— damaged passive optical elements (e.g. mirrors, lenses),
— misaligned beam path (inadequate optical elements, incorrectly positioned),
— not properly working active beam guiding and shaping elements,
— not properly working handling system or robot positioning of the laser processing head,
6 © ISO 2020 – All rights reserved
— gaps in the enclosure/guard of a laser processing machine, through which laser radiation can
propagate,
— damage of protective enclosure/guards/screens.
NOTE Information on reasonably foreseeable fault conditions related to beam guidance is given in
IEC 60825-4:2006, Annex B.
Inadequate design of safety functions, and safety related parts of control systems (SRP/CS) respectively,
for the safe isolation or deactivation of the laser beam (e.g. by shutters, relays controlling power supply to
the laser) can cause severe laser radiation risks. In the following, safety functions are exemplarily given:
— emergency stop;
— opening of maintenance covers or doors for workpiece input and output with access to laser
radiation;
— opening of doors to enter laser cabins with access to the laser hazard area;
— disassembling (manually) of fibre connectors with access to the direct laser beam;
— active control of guards and windows with regard to damage by laser radiation.
4.3 Laser radiation hazards induced by external effects (interferences)
Power conditions and the environment in which the laser processing machine operates may cause the
machine to malfunction, thus giving rise to hazardous conditions related to laser radiation and/or
making it necessary for someone to intervene within hazard zones.
Environmental interferences include
— temperature,
— humidity,
— external shock/vibration,
— vapours, dust or gases from the environment,
— electromagnetic/radio frequency interference,
— source voltage interruption/fluctuation, and
— insufficient hardware/software compatibility and integrity of machine parts.
EXAMPLE Environmental conditions can cause adverse impacts on the laser beam characteristics, which
can deteriorate absorption efficiency; shock/vibration can cause misalignment of optical elements and thus the
laser beam.
4.4 Characteristics of laser radiation
The hazards related to laser radiation depend on the characteristics of the radiation.
For a hazard analysis and a risk assessment, the laser radiation emitted from a laser processing machine
is characterized by including but not limited to the following:
— wavelength;
— operating mode (cw, pulsed);
— beam profile (mode, energy distribution);
— beam quality codes: BPP, M , K;
— polarization;
— foreseeable exposure limit (FEL) at the inner side of an enclosure/guard;
— irradiance/radiant exposure at a machine workplace or specified distance to the laser machine;
— maximum exposure time.
5 Safety requirements and measures
5.1 General requirements
The extent to which hazards are covered is indicated in the Scope.
Manufacturers shall ensure the safety of laser processing machines by
a) hazard identification and risk assessment,
b) implementation of safety measures to minimize risks by laser radiation,
c) verification of the safety measures, and
d) provision of appropriate information for the user.
Based on the risk assessment (see 5.2), appropriate safety measures against laser radiation shall be
incorporated into the laser processing machine by design and manufacture.
5.2 Risk assessment with regard to laser radiation hazards
The accessibility to hazardous laser radiation decisively depends on the status of a laser machine.
Therefore, a risk assessment with regard to laser radiation hazards shall be performed:
— for the whole life cycle of the machine, as applicable, (for examples see ISO 12100:2010);
— for all operating modes (The operating modes described in Clause 3 are only examples. The operating
modes of the machine incl. terminology and content should be defined by the risk assessment of the
manufacturer.);
— after each modification of the machine by the person or organization responsible for the
modification; and
— for each reasonably foreseeable misuse/operation not included by the intended use.
A risk assessment includes but is not limited to:
a) hazards caused by the direct or reflected laser beam;
b) hazard zones, particularly those associated with
1) the laser or the laser system,
2) the laser beam path/beam delivery system,
3) the process zone,
4) the laser hazard area, and
5) the area in which laser radiation can dazzle people;
c) "interferences” listed in 4.3.
8 © ISO 2020 – All rights reserved
The results of the risk assessment shall be duly documented. See ISO 12100:2010 for principles for risk
assessment.
5.3 Implementation of risk reduction measures
5.3.1 General
Safety measures against laser radiation hazards shall be incorporated in the machine by design and
manufacture as specified in 5.3.2 to 5.3.4. Safety measures against laser hazards shall follow the
priority principle according to ISO 12100:2010.
5.3.2 Safety measures against laser radiation hazards in dependence of the locations
NOTE In the following, requirements for safety measures against laser radiation hazards are given in
dependence of the location, where the laser processing machine operates.
5.3.2.1 Safety measures at locations with unrestricted and uncontrolled access
For laser processing machines operating in locations with unrestricted and uncontrolled access, the
possibility of people being exposed to hazardous levels of laser radiation exceeding the accessible
emission limit (AEL) for Class 1 according to IEC 60825-1:2014 shall be eliminated during all operating
modes (production and any other operating mode).
To satisfy these requirements, the following conditions shall be met:
— Unauthorized human access to a hazard zone shall be prevented solely by engineering safety
measures as s
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