IEC 63055:2016

Format for LSI-Package-Board Interoperable design

IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.

General Information

• Status: Published
• Publication Date: 07-Nov-2016
• ICS: 31.180 - Printed circuits and boards
• ICS: 31.200 - Integrated circuits. Microelectronics
• ICS: 35.060 - Languages used in information technology
• Technical Committee: TC 91 - Electronics assembly technology

Relations

• Revised: IEC 63055:2023 - Format for LSI-Package-Board Interoperable design
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 63055 ®
Edition 1.0 2016-11
™
IEEE Std 2401
INTERNATIONAL
STANDARD
Format for LSI-Package-Board interoperable design

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IEC 63055 ®
Edition 1.0 2016-11
IEEE Std 2401™
INTERNATIONAL
STANDARD
Format for LSI-Package-Board interoperable design

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.180; 31.200; 35.060 ISBN 978-2-8322-3686-4

– i – IEEE Std 2401-2015
Contents
1. Overview . 1
1.1 Scope . 1
1.2 Purpose . 1
1.3 Key characteristics of the LSI-Package-Board Format . 1
1.4 Contents of this standard . 3
2. Normative references . 3
3. Definitions, acronyms, and abbreviations . 3
3.1 Definitions . 3
3.2 Acronyms and abbreviations . 6
4. Concept of the LPB Format . 8
4.1 Technical background . 8
4.2 Conventional design . 8
4.3 Common problems at the design site . 8
4.4 Concept of LPB interoperable design . 9
4.5 Value creation by LPB interoperable design . 9
4.6 LPB Format .10
4.7 Summary of LPB Format files .10
5. Language basics.16
6. Common elements in M-Format, C-Format, and R-Format .17
6.1 General .17
6.2 The

element .18
6.3 The element .19
7. M-Format.31
7.1 M-Format file structure.31
7.2 The element .31
7.3 The element .32
8. C-Format .36
8.1 C-Format file structure .36
8.2 The element .37
8.3 The element .82
9. R-Format .86
9.1 R-Format file structure .86
9.2 The element .86
9.3 The element .116
10. N-Format .122
10.1 Purpose of the N-Format file .122
10.2 How to identify the power/ground network .122
10.3 Example .122
11. G-Format .122
11.1 Language basics of G-Format .122
11.2 Structure .123

IEEE Std 2401-2015 – ii –
11.3 Header section .124
11.4 Material section .125
11.5 Layer section.126
11.6 Shape section .126
11.7 Board geometry section .131
11.8 Padstack section .133
11.9 Part section .134
11.10 Component section .135
11.11 Net attribute section .136
11.12 Netlist section .136
11.13 Via section .138
11.14 Bondwire section .139
11.15 Route section .141
Annex A (informative) Bibliography .145
Annex B (informative) Examples of utilization .146
B.1 Understanding the function of the LPB Format .146
B.2 Test bench .146
B.3 Design flow example .148
B.4 Growth of the sample files in the LPB Format .179
B.5 Simulations using the sample files in the LPB Format .182
Annex C (informative) XML Encryption .184
Annex D (informative) MD5 checksum .187
Annex E (informative) Chip-Package Interface Protocol .188
E.1 General .188
E.2 Comparison of C-Format with Chip-Package Interface Protocol .188

Annex F (informative) IEEE list of participants .194

– iii – IEEE Std 2401-2015
FORMAT FOR LSI-PACKAGE-BOARD
INTEROPERABLE DESIGN
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