IEC TR 62380:2004
(Main)Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment
Reliability data handbook - Universal model for reliability prediction of electronics components, PCBs and equipment
Provides elements to calculate the failure rate of mounted electronic components. It makes equipment reliability optimization studies easier to carry out, thanks to the introduction of influence factors.
General Information
Relations
Standards Content (Sample)
TECHNICAL IEC
REPORT TR 62380
First edition
2004-08
Reliability data handbook –
Universal model for reliability prediction
of electronics components, PCBs
and equipment
Reference number
IEC/TR 62380:2004(E)
Publication numbering
As from 1 January 1997 all IEC publications are issued with a designation in the
60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
Consolidated editions
The IEC is now publishing consolidated versions of its publications. For example,
edition numbers 1.0, 1.1 and 1.2 refer, respectively, to the base publication, the
base publication incorporating amendment 1 and the base publication incorporating
amendments 1 and 2.
Further information on IEC publications
The technical content of IEC publications is kept under constant review by the IEC,
thus ensuring that the content reflects current technology. Information relating to
this publication, including its validity, is available in the IEC Catalogue of
publications (see below) in addition to new editions, amendments and corrigenda.
Information on the subjects under consideration and work in progress undertaken
by the technical committee which has prepared this publication, as well as the list
of publications issued, is also available from the following:
• IEC Web Site (www.iec.ch)
• Catalogue of IEC publications
The on-line catalogue on the IEC web site (www.iec.ch/searchpub) enables you to
search by a variety of criteria including text searches, technical committees
and date of publication. On-line information is also available on recently issued
publications, withdrawn and replaced publications, as well as corrigenda.
• IEC Just Published
This summary of recently issued publications (www.iec.ch/online_news/ justpub)
is also available by email. Please contact the Customer Service Centre (see
below) for further information.
• Customer Service Centre
If you have any questions regarding this publication or need further assistance,
please contact the Customer Service Centre:
Email: custserv@iec.ch
Tel: +41 22 919 02 11
Fax: +41 22 919 03 00
TECHNICAL IEC
REPORT TR 62380
First edition
2004-08
Reliability data handbook –
Universal model for reliability prediction
of electronics components, PCBs
and equipment
:
” IEC 2004 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale
XC
International Electrotechnical Commission
ɆɟɠɞɭɧɚɪɨɞɧɚɹɗɥɟɤɬɪɨɬɟɯɧɢɱɟɫɤɚɹɄɨɦɢɫɫɢɹ
For price, see current catalogue
– 2 – TR 62380 ” IEC:2004(E)
CONTENTS
FOREWORD .5
INTRODUCTION . 7
1 Scope . 8
2 Normative references. 8
3 Terms and definitions. 9
4 Conditions of use . 10
4.1 Introductory remarks . 10
4.2 Assumptions adopted for TR 62380 . 11
4.3 Influencing factors. 13
4.4 How to use the data . 14
4.5 Uses and aims of a reliability prediction. 15
5 Environment influence. 16
5.1 General remarks . 16
5.2 Environment types defined . 16
5.3 Electrical environment conditions . 20
5.4 Validity model according to environment. 20
5.5 Components choice. 20
5.6 Learning during the deployment phase of new equipment . 21
5.7 Mission profile. 22
5.8 Mission profile examples . 23
6 Equipped printed circuit boards and hybrid circuits (IEC 60326) . 25
6.1 Failure rate calculation of an equipped printed circuit board . 25
6.2 Hybrid circuits . 26
7 Integrated circuits . 27
7.1 Validity domain . 27
7.2 Junction temperature evaluation of an integrated circuit . 27
7.3 The reliability model . 30
8 Diodes and thyristors, transistors, optocouplers (IEC 60747-xx) . 36
8.1 Evaluating the junction temperature of diodes and transistors . 36
8.2 Low power diodes . 38
8.3 Power diodes . 40
8.4 Low power transistors . 42
8.5 Power transistors . 44
8.6 Optocouplers . 46
9 Optoelectronics. 49
9.1 Light emitting diodes diode modules (IEC 60747-12-2, IEC 62007). 49
9.2 Laser diodes modules - Failure rate. 52
9.3 Photodiodes and receiver modules for telecommunications (IEC 60747-12). 53
9.4 Passive optic components . 54
9.5 Miscellaneous optic components . 54
10 Capacitors and thermistors (ntc). 55
10.1 Fixed plastic, paper, dielectric capacitors - Radio interference suppression
capacitors (plastic, paper) . 55
TR 62380 ” IEC:2004(E) – 3 –
10.2 Fixed ceramic dielectric capacitors – Defined temperature coefficient – Class I
(IEC 60384) . 56
10.3 Fixed ceramic dielectric capacitors – Non defined temperature coefficient – Class
II – Radio interference suppression capacitors (Ceramic, class II) . 57
10.4 Tantalum capacitors, solid electrolyte (IEC 60384). 58
10.5 Aluminum, non-solid electrolyte capacitors - Life expectancy . 59
10.6 Aluminum electrolytic capacitor, solid electrolyte . 61
10.7 Aluminum electrolytic capacitor, polymer electrolyte (IEC 60384) . 62
10.8 Variable ceramic capacitors, disks (Dielectric ceramic) (IEC 60384) . 63
10.9 Thermistors with negative temperature coefficient (NTC) (IEC 60539) . 64
11 Resistors and potentiometers (IEC 60115). 65
11.1 Fixed, low dissipation film resistors – High stability (rs), general purpose (rc),
“minimelf” . 65
11.2 Hot molded carbon composition, fixed resistors (IEC 60115) . 66
11.3 Fixed, high dissipation film resistors (IEC 60115). 67
11.4 Low dissipation wirewound resistors (IEC 60115). 68
11.5 High dissipation wirewound resistors (IEC 60115). 69
11.6 Fixed, low dissipation surface mounting resistors and resistive array (IEC 60115) 70
11.7 Non wirewound cermet potentiometer (one or several turn) (IEC 60393). 71
12 Inductors and transformers (IEC 61248) . 73
13 Microwave passive components, piezoelectric components and surface acoustic wave
filters (IEC 61261, IEC 61019, IEC 60368). 74
13.1 Microwave passive components . 74
13.2 Piezoelectric components. 74
13.3 Surface acoustic wave filters . 74
14 Relays . 75
14.1 Evaluating voltage and current (vt, it) in transient conditions . 75
14.2 Mercury wetted reed relays, low power (IEC 60255). 78
14.3 Dry reed relays (IEC 60255) . 80
14.4 Electromechanical relays, miniature or card – European type, thermal relays
(power up to 500 W) (IEC 60255) . 82
14.5 Industrial relays, high voltage vacuum relays, power mercury wetted relays (IEC
60255) . 84
15 Switches and keyboards (IEC 60948) . 86
16 Connectors . 87
16.1 Circular, rectangular. 87
16.2 Coaxial connectors. 87
16.3 Connectors for PCBs and related sockets . 87
17 Displays, solid state lamps . 88
17.1 Displays (IEC 61747) . 88
17.2 Solid state lamps (IEC 60747) . 88
18 Protection devices (IEC 60099, IEC 60269, IEC 60738, IEC 61051) . 89
18.1 Thermistors (PTC). 89
18.2 Varistors . 89
18.3 Fuses . 89
18.4 Arrestors. 89
19 Energy devices, thermal management devices, disk drive . 90
19.1 Primary batteries. 90
19.2 Secondary batteries . 90
– 4 – TR 62380 ” IEC:2004(E)
19.3 Fans . 90
19.4 Thermoelectric coolers . 90
19.5 Disk drive . 90
19.6 Converters (IEC 60146). 90
Table 1 – Mission profiles for spatial. 10
Table 2 – Mission profiles for military. 10
Table 3 – Description and typical applications of the commonest types of environment . 17
Table 4 – Mechanical conditions according to the environment: characteristic shocks and
vibrations. . 18
Table 5 – Mechanically active substances. 19
Table 6 – Ch
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.