SIST EN 62047-1:2016
(Main)Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016)
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016)
This part of IEC 62047 defines terms for micro-electromechanical devices including the
process of production of such devices.
Halbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 1: Begriffe
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 1: Termes et définitions
L'IEC 62047-1:2016 définit des termes pour les dispositifs microélectromécaniques en incluant le procédé de production de ces dispositifs.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) retrait de dix termes;
b) révision de douze termes;
c) ajout de seize nouveaux termes.
Polprevodniški elementi - Mikroelektromehanski elementi - 1. del: Izrazi in definicije (IEC 62047-1:2016)
Ta del standarda IEC 62047 opredeljuje izraze za mikroelektromehanske elemente, vključno s postopkom proizvodnje takšnih elementov.
General Information
Relations
Standards Content (Sample)
SLOVENSKI STANDARD
SIST EN 62047-1:2016
01-julij-2016
1DGRPHãþD
SIST EN 62047-1:2007
Polprevodniški elementi - Mikroelektromehanski elementi - 1. del: Izrazi in
definicije (IEC 62047-1:2016)
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
(IEC 62047-1:2016)
Ta slovenski standard je istoveten z: EN 62047-1:2016
ICS:
01.040.31 Elektronika (Slovarji) Electronics (Vocabularies)
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
SIST EN 62047-1:2016 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
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SIST EN 62047-1:2016
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SIST EN 62047-1:2016
EUROPEAN STANDARD EN 62047-1
NORME EUROPÉENNE
EUROPÄISCHE NORM
April 2016
ICS 31.080.99 Supersedes EN 62047-1:2006
English Version
Semiconductor devices - Micro-electromechanical devices - Part
1: Terms and definitions
(IEC 62047-1:2016)
Dispositifs à semi-conducteurs - Dispositifs Halbleiterbauelemente - Bauelemente der
microélectromécaniques - Partie 1: Termes et définitions Mikrosystemtechnik - Teil 1: Begriffe
(IEC 62047-1:2016) (IEC 62047-1:2016)
This European Standard was approved by CENELEC on 2016-02-10. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 62047-1:2016 E
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SIST EN 62047-1:2016
EN 62047-1:2016
European foreword
The text of document 47F/232/FDIS, future edition 2 of IEC 62047-1, prepared by SC 47F
“Microelectromechanical systems” of IEC/TC 47 “Semiconductor devices" was submitted to the
IEC-CENELEC parallel vote and approved by CENELEC as EN 62047-1:2016.
The following dates are fixed:
(dop) 2016-11-10
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2019-02-10
standards conflicting with the
document have to be withdrawn
This document supersedes EN 62047-1:2006.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC [and/or CEN] shall not be held responsible for identifying any or all such
patent rights.
Endorsement notice
The text of the International Standard IEC 62047-1:2016 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 62047-1:2005 NOTE Harmonized as EN 62047-1:2006.
2
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SIST EN 62047-1:2016
IEC 62047-1
®
Edition 2.0 2016-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –
Part 1: Terms and definitions
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 1: Termes et définitions
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-3099-2
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
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SIST EN 62047-1:2016
– 2 – IEC 62047-1:2016 © IEC 2016
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Terms and definitions . 5
2.1 General terms and definitions . 5
2.2 Terms and definitions relating to science and engineering . 6
2.3 Terms and definitions relating to materials science . 7
2.4 Terms and definitions relating to functional element . 7
2.5 Terms and definitions relating to machining technology . 12
2.6 Terms and definitions relating to bonding and assembling technology . 19
2.7 Terms and definitions relating to measurement technology . 21
2.8 Terms and definitions relating to application technology . 23
Annex A (informative) Standpoint and criteria in editing this glossary . 27
A.1 Guidelines for selecting terms . 27
A.2 Guidelines for writing the definitions . 27
A.3 Guidelines for writing the notes . 27
Annex B (informative) Clause cross-references of IEC 62047-1:2005 and IEC 62047-
1:2015 . 28
Bibliography . 32
Table B.1 – Clause cross-reference of IEC 62047-1: 2005 and IEC 62047-1:2015 . 28
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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 1: Terms and definitions
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
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other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62047-1 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
This second edition cancels and replaces the first edition published in 2005. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) removal of ten terms;
b) revision of twelve terms;
c) addition of sixteen new terms.
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The text of this standard is based on the following documents:
FDIS Report on voting
47F/232/FDIS 47F/238/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –
Part 1: Terms and definitions
1 Scope
This part of IEC 62047 defines terms for micro-electromechanical devices including the
process of production of such devices.
2 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
2.1 General terms and definitions
2.1.1
micro-electromechanical device
microsized device, in which sensors, actuators, transducers, resonators, oscillators,
mechanical components and/or electric circuits are integrated
Note 1 to entry: Related technologies are extremely diverse from fundamental technologies such as design,
material, processing, functional element, system control, energy supply, bonding and assembly, electric circuit, and
evaluation to basic science such as micro-science and engineering as well as thermodynamics and tribology in a
micro-scale. If the devices constitute a system, it is sometimes called as MEMS which is an acronym standing for
"micro-electromechanical systems"
2.1.2
MST
microsystem technology
technology to realize microelectrical, optical and machinery systems and even their
components by using micromachining
Note 1 to entry: The term MST is mostly used in Europe.
Note 2 to entry: This note applies to the French language only.
2.1.3
micromachine
2.1.3.1
micromachine,
miniaturized device, the components of which are several millimetres or smaller in size
Note 1 to entry: Various functional device (such as a sensor that utilizes the micromachine technology) is
included.
2.1.3.2
micromachine,
microsystem that consists of an integration of micromachine devices
Note 1 to entry: A molecular machine called a nanomachine is included.
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2.2 Terms and definitions relating to science and engineering
2.2.1
micro-science and engineering
science and engineering for the microscopic world of MEMS
Note 1 to entry: When mechanical systems are miniaturized, various physical parameters change. Two cases
prevail: 1) these changes can be predicted by extrapolating the changes of the macro-world, and 2) the peculiarity
of the microscopic world becomes apparent and extrapolation is not possible. In the latter case, it is necessary to
establish new theoretical and empirical equations for the explanation of phenomena in the microscopic world.
Moreover, new methods of analysis and synthesis to deal with engineering problems must be developed. Materials
science, fluid dynamics, thermodynamics, tribology, control engineering, and kinematics can be systematized as
micro-sciences and engineering supporting micromechatronics.
2.2.2
scale effect
change in effect on the object's behaviour or properties caused by the change in the object's
dimension
Note 1 to entry: The volume of an object is proportional to the third power of its dimension, while the surface area
is proportional to the second power. As a result, the effect of surface force becomes larger than that of the body
force in the microscopic world. For example, the dominant force in the motion of a microscopic object is not the
inertial force but the electrostatic force or viscous force. Material properties of microscopic objects are also
affected by the internal material structure and surface, and, as a result, characteristic values are sometimes
different from those of bulks. Frictional properties in the microscopic world also differ from those in the
macroscopic world. Therefore, those effects must be considered carefully while designing a micromachine.
2.2.3
microtribology
tribology for the microscopic world
Note 1 to entry: Tribology deals with friction and wear in the macroscopic world. On the other hand, when the
dimensions of components such as those in micromachines become extremely small, surface force and viscous
force become dominant instead of gravity and inertial force. According to Coulomb's law of friction, frictional force
is proportional to the normal load. In the micromachine environment, because of the reaction between surface
forces, a large frictional force occurs that would be inconceivable in an ordinary scale environment. Also a very
small quantity of abrasion that would not be a problem in an ordinary scale environment can fatally damage a
micromachine. Microtribology research seeks to reduce frictional forces and to discover conditions that are free of
friction, even on an atomic level. In this research, observation is made of phenomena that occur with friction
surfaces or solid surfaces at from angstrom to nanometer resolution, and analysis of interaction on an atomic level
is performed. These approaches are expected to be applied in solving problems in tribology for the ordinary scale
environment as well as for the micromachine environment.
2.2.4
biomimetics
creating functions that imitate the motions or the mechanisms of organisms
Note 1 to entry: In devising microscopic mechanisms suitable for micromachines, the mechanisms and structures
of organisms that have survived severe natural selection may serve as good examples to imitate. One example is
the microscopic three-dimensional structures that were modelled on the exoskeletons and elastic coupling systems
of insects. In exoskeletons, a hard epidermis is coupled with an elastic body, and all movable parts use the
deformation of the elastic body to move. The use of elastic deformation would be advantageous in the microscopic
world to avoid friction. Also, the exoskeleton structure equates to a closed link mechanism in kinematics and has
the characteristic that some actuator movement can be transmitted to multiple links.
2.2.5
self-organization
organization of a system without any external manipulation or control, where a nonequilibrium
structure emerges spontaneously due to the collective interactions among a number of simple
microscopic objects or phenomena
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2.2.6
electro wetting on dielectric
EWOD
wetting of a substrate controlled by the voltage between a droplet and the substrate covered
with a dielectric film
Note 1 to entry: The contact angle of a liquid droplet, typically an electrolyte, on a substrate can be electrically
controlled because the solid-liquid surface interfacial tension can be controlled with the energy stored in the
electric double layer which works as capacitor. Covering the electrode with a dielectric material of determined
thickness, the capacitance can be determined with ease. Electro wetting on dielectric is used typically in
microfluidic devices.
Note 2 to entry: This note applies to the French language only.
2.2.7
stiction
phenomenon that a moving microstructure is stuck to another structure or substrate by
adhesion forces
Note 1 to entry: When structures become smaller, stiction appears significant due to the scale effect that surface
forces predominate over body forces. Stiction frequently occurs in the MEMS fabrication process when small
structures are released during wet etching processes due to the surface tension of liquid. Representative adhesion
forces to cause stiction are van der Waals force, electrostatic force, and surface tension of liquid between
structures.
2.3 Terms and definitions relating to materials science
2.3.1
silicon-on-insulator
SOI
structure composed of an insulator and a thin layer of silicon on it
Note 1 to entry: Sapphire (as in SOS), glass (as in SOG), silicon dioxide, silicon nitride, or even an insulating
form of silicon itself is used as an insulator.
Note 2 to entry: This note applies to the French language only.
2.4 Terms and definitions relating to functional element
2.4.1
actuator,
mechanical device that converts non-kinetic energy into kinetic energy to perform mechanical
work
2.4.2
microactuator
actuator produced by micromachining
Note 1 to entry: For a micromachine to perform mechanical work, the microactuator is indispensable as a basic
component. Major examples are the electrostatic actuator prepared by silicon process, the piezoelectric actuator
that utilizes functional materials like lead zirconate titanate (PZT), the pneumatic rubber-actuator, and so on. Many
other actuators based on various energy conversion principles have been investigated and developed. However,
the energy conversion efficiency of all these actuators deteriorates as their size is reduced. Therefore, the motion
mechanisms of organisms such as the deformation of protein molecules, the flagellar movement of bacteria, and
muscle contraction are being utilized to develop special new actuators for micromachines.
Note 2 to entry: Micro-electrostatic actuators are actuated by a micro-electrostatic field, magnetic microactuators
are driven by a micromagnetic field, and piezoelectric microactuators depend on a microstress field to convey
motion and power.
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2.4.3
light-driven actuator
actuator that uses light as a control signal or an energy source or both
Note 1 to entry: Since the development of photostrictive materials, various light driven actuators have been
proposed. These actuators have simple structures and can be driven by wireless means. A motor is proposed that
utilizes the spin realignment effect, in which a magnetic material absorbs light and the resulting heat changes the
direction of magnetization reversibly. Actuators utilizing thermal expansion, and exploiting polymer photochemical
reactions, are also being studied.
2.4.4
piezoelectric actuator
actuator that uses piezoelectric material
Note 1 to entry: Piezoelectric actuators are classified into the single-plate, bimorph, and stacked types, and the
popular material is lead zirconate titanate (PZT). The features are: 1) quick response, 2) large output force per
volume, 3) ease of miniaturization because of the simple structure, 4) narrow displacement range for easier
microdisplacement control, and 5) high efficiency of energy conversion. Piezoelectric actuators are used for the
actuators for micromachines, such as ultrasonic motor, and vibrator. An applied example is a piezoelectric actuator
for a travelling mechanism which moves by the resonance vibration of a piezoelectric bimorph, and a
micropositioner piezoelectric actuator which amplifies the displacements of a stacked piezoelectric device by a
lever.
2.4.5
shape-memory alloy actuator
actuator that uses shape memory alloy
Note 1 to entry: Shape-memory alloy actuators are compact, light, and produce large forces. These actuators can
be driven repeatedly in a heat cycle or can be controlled arbitrarily by switching the electric current through the
actuator itself. Lately, attempts have been made to use the alloys to build a servosystem that has an appropriate
feedback mechanism and a cooling system, intended for applications where quick response is not necessary
Application examples under development are microgrippers for cell manipulation, microvalves for regulating very
small amounts of flow and active endoscopes for medical use.
2.4.6
sol-gel conversion actuator
actuator that uses the transition between the sol (liquid) state and the gel (solid) state
Note 1 to entry: A sol-gel conversion actuator can work in a similar way to living things. For example, if electrodes
are put on a small particle of sodium polyacrylate gel in an electrolytic solution and a voltage is applied, the
particle repeatedly changes its shape. Sol-gel conversion actuators can be connected in series, sealed in a thin
pipe and fitted with multiple legs, to make a microrobot that moves in one direction and that looks like a centipede.
Another application being conceived is a crawler microrobot that automatically moves through a thin pipe.
2.4.7
electrostatic actuator
actuator that uses electrostatic force
Note 1 to entry: Since the electrostatic actuator has a simple structure and its output force per weight is
increased as the size is reduced, much research is ongoing to apply these characteristics to the actuators of
micromachines. Application examples developed so far on an experimental basis include a wobble motor and a film
electrostatic actuator.
2.4.8
comb-drive actuator
electrostatic actuator, consisting of a series of parallel fingers, fixed in position, engaged and
interleaved with a second, movable set of fingers
Note 1 to entry: The application of an electrostatic charge to the first set of fingers attracts the fingers of the
second set, such that they become more fully engaged in the interdigit spaces of the first set. Then the static
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charge is removed and drained, and the second set of fingers is returned to its home position by micromachined
spring tension.
2.4.9
wobble motor
harmonic electrostatic motors
variable-gap electrostatic motor that generates a rolling motion of the rotor on an eccentric
stator without slip
Note 1 to entry: Wobble motors consist of a rotor, a stator with electrodes for the generation of electrostatic force,
and an insulation film on the rotor or stator surface. The rotor rotates in a reverse direction to the revolution.
The rotation speed, V , is given as V = V × (L – L )/ L , where V is the revolution speed, L is the
rot rot rev stat rot rot rev stat
stator circumference, and L is the rotor circumference.
rot
Characteristics of the wobble motor include 1) the ability to easily provide low speed and high torque when the
rotor circumference is very close to the stator circumference, 2) no problems of friction or wear because there are
no sliding parts, 3) the possibility to be fabricated using diverse materials, and 4) an easily increasable aspect ratio.
On the other hand, the revolution of the rotor can cause unnecessary vibration. Production examples include a
wobble motor that supports a rotor by a flexible coupling, and a wobble motor fabricated by the integrated circuit
process and whose rotor rolls at the fulcrum.
2.4.10
microsensor
device, produced for example by micromachining, and which is used for measuring a physical
or chemical quantity by converting it to an electric output
Note 1 to entry: In micromachines, the first field to be developed and realized was that of the microsensor.
Microsensors include mechanical quantity sensors (measuring pressure, acceleration, tactile senses, displacement,
etc.), chemical quantity sensors (measuring ions, oxygen, etc.), electric quantity sensors (measuring magnetism,
current, etc.), biosensors, and optical sensors. In many microsensors, the detecting section containing the
mechanism is integrated with the electronic circuits. The advantages of microsensors are: 1) minimal
environmental disruption, 2) the ability to measure local states of small areas, 3) the integration with circuits, and
4) minimal operating power.
2.4.11
biosensor
sensor that uses organic substances in the device, that is intended for measurement of
organism-related subsystems, or that mimics an organism
Note 1 to entry: A typical biosensor consists of a biologically originated specific material such as an enzyme or an
antibody that identifies the object of measurement and the device that measures a physical or chemical quantity
change related to the identifying reaction. A semiconductor sensor or any of various types of electrode (e.g. ISFET,
micro-oxygen electrode, and fluorescence detection optical sensor) prepared by silicon micromachining technology
can be used as this device. Biosensors are used for blood analysis systems, glucose sensors, microrobots, and so
on.
2.4.12
integrated microprobe
one-piece probe combining a microprobe and a signal processing circuit
Note 1 to entry: The smaller the sensitive part of the sensor, 1) the less interference to the measuring object, 2)
the higher the signal-to-noise ratio in the measurement, and 3) the more small-area local data can be obtained. An
integrated microprobe is a device consisting of a microprobe prepared by micromachining silicon to an ultra-
microscopic needle and incorporating a signal processing circuit. Integrated microprobes made by machining
silicon needles to a diameter of from several nanometers to several micrometers and combining them with an
impedance conversion circuit, etc., are in actual use as microscopic electrodes for organisms, scanning tunneling
microscopes (STMs), and atomic force microscopes (AFMs).
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2.4.13
ISFET
ion-sensitive field-effect transistor
semiconductor sensor integrating an ion-sensitive electrode with a field-effect transistor (FET)
Note 1 to entry: In the ion-sensitive electrode section, the membrane voltage changes according to fluctuations in
pH or carbon dioxide partial pressure in the blood, for example. As the voltage amplifier, the ISFET uses a FET, a
transistor controlling the conductance of the current path (channels) formed by the majority carriers using an
electric field perpendicular to the carrier flow. The ISFET is based on silicon
...
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