Packaging of components for automatic handling - Part 5: Matrix trays (IEC 60286-5:2018)

This part of IEC 60286 describes the common dimensions, tolerances and characteristics of
the tray. It includes only those dimensions that are essential for the handling of the trays for
the stated purpose and for placing or removing components from the trays.
Matrix trays are designed to facilitate the transport and handling of electronic components
during their testing, baking, transport/storage, and final mounting by automatic placement
equipment.
The generic rules for their design are given in this document. Newly developed trays that
follow these rules will not be listed individually. Only those trays that conform to the design
rules set forth herein are classified as "standard trays" and are thus preferred for use.
NOTE Matrix trays listed in Annex A that do not conform to the design rules set forth herein shall be considered
as "non-standard trays" and are not preferred for use.

Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 5: Flachmagazine (IEC 60286-5:2018)

Emballage de composants pour opérations automatisées - Partie 5: Supports matriciels (IEC 60286-5:2018)

NEW!IEC 60286-5:2018 est disponible sous forme de IEC 60286-5:2018 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.

Pakiranje komponent za avtomatsko obdelavo - 5. del: Ploščati vlagalniki (IEC 60286-5:2018)

Ta del standarda IEC 60286 opisuje običajne mere, odstopanja in značilnosti vlagalnikov. Vključuje samo tiste mere, ki so bistvene za uporabo vlagalnikov za naveden namen in za nameščanje ali odstranjevanje komponent z vlagalnikov.
Ploščati vlagalniki so zasnovani za lažji transport elektronskih komponent in ravnanje z njimi med preskušanjem, žganjem, transportom/shranjevanjem in končno namestitvijo z opremo za samodejno namestitev.
V tem dokumentu so podana splošna pravila za njihovo projektiranje. Novo razviti vlagalniki, ki so skladni s temi pravili, ne bodo navedeni posamično. Samo tisti vlagalniki, ki izpolnjujejo konstrukcijska pravila, določena v tem dokumentu, so klasificirani kot »standardni vlagalniki« in se uporabljajo prednostno.
OPOMBA: Ploščati vlagalniki, navedeni v Dodatku A, ki ne izpolnjujejo konstrukcijskih pravil, določenih v tem dokumentu, se štejejo kot »nestandardni vlagalniki« in se ne uporabljajo prednostno.

General Information

Status
Published
Publication Date
08-Jul-2018
Technical Committee
Current Stage
6060 - National Implementation/Publication (Adopted Project)
Start Date
02-Jul-2018
Due Date
06-Sep-2018
Completion Date
09-Jul-2018

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SLOVENSKI STANDARD
SIST EN IEC 60286-5:2018
01-september-2018
1DGRPHãþD
SIST EN 60286-5:2005
SIST EN 60286-5:2005/A1:2009
3DNLUDQMHNRPSRQHQW]DDYWRPDWVNRREGHODYRGHO3ORãþDWLYODJDOQLNL ,(&


Packaging of components for automatic handling - Part 5: Matrix trays (IEC 60286-

5:2018)

Gurtung und Magazinierung von Bauelementen für automatische Verarbeitung - Teil 5:

Flachmagazine (IEC 60286-5:2018)

Emballage de composants pour opérations automatisées - Partie 5: Supports matriciels

(IEC 60286-5:2018)
Ta slovenski standard je istoveten z: EN IEC 60286-5:2018
ICS:
31.020 Elektronske komponente na Electronic components in
splošno general
55.020 Pakiranje in distribucija blaga Packaging and distribution of
na splošno goods in general
SIST EN IEC 60286-5:2018 en

2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

---------------------- Page: 1 ----------------------
SIST EN IEC 60286-5:2018
---------------------- Page: 2 ----------------------
SIST EN IEC 60286-5:2018
EUROPEAN STANDARD EN IEC 60286-5
NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2018
ICS 31.020 Supersedes EN 60286-5:2004
English Version
Packaging of components for automatic handling - Part 5: Matrix
trays
(IEC 60286-5:2018)

Emballage de composants pour opérations automatisées - Gurtung und Magazinierung von Bauelementen für

Partie 5: Supports matriciels automatische Verarbeitung - Teil 5: Flachmagazine
(IEC 60286-5:2018) (IEC 60286-5:2018)

This European Standard was approved by CENELEC on 2018-05-30. CENELEC members are bound to comply with the CEN/CENELEC

Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC

Management Centre or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other language made by translation

under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the

same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,

Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,

Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,

Switzerland, Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels

© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.

Ref. No. EN IEC 60286-5:2018 E
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SIST EN IEC 60286-5:2018
EN IEC 60286-5:2018 (E)
European foreword

The text of document 40/2556/CDV, future edition 3 of IEC 60286-5, prepared by IEC/TC 40

"Capacitors and resistors for electronic equipment" was submitted to the IEC-CENELEC parallel vote

and approved by CENELEC as EN IEC 60286-5:2018.
The following dates are fixed:
• latest date by which the document has to be (dop) 2019-02-28
implemented at national level by
publication of an identical national
standard or by endorsement
(dow) 2021-05-30
• latest date by which the national
standards conflicting with the
document have to be withdrawn
This document supersedes EN 60286-5:2004.

Attention is drawn to the possibility that some of the elements of this document may be the subject of

patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice

The text of the International Standard IEC 60286-5:2018 was approved by CENELEC as a European

Standard without any modification.
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SIST EN IEC 60286-5:2018
IEC 60286-5
Edition 3.0 2018-04
INTERNATIONAL
STANDARD
Packaging of components for automatic handling –
Part 5: Matrix trays
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.020 ISBN 978-2-8322-5617-6

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 5 ----------------------
SIST EN IEC 60286-5:2018
– 2 – IEC 60286-5:2018 © IEC 2018
CONTENTS

FOREWORD ........................................................................................................................... 5

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms, definitions and abbreviated terms ........................................................................ 7

3.1 Terms and definitions .............................................................................................. 7

3.2 Abbreviated terms ................................................................................................... 7

4 Material ........................................................................................................................... 8

4.1 Electrostatic dissipative requirements ..................................................................... 8

4.2 Effect of properties ................................................................................................. 8

4.3 Recycling and rigidity .............................................................................................. 8

5 Mechanical stability ......................................................................................................... 8

5.1 Loaded tray ............................................................................................................. 8

5.2 Empty tray .............................................................................................................. 8

5.3 Outer edges ............................................................................................................ 8

6 Tray design, dimensions and other physical properties .................................................... 8

6.1 Tray design ............................................................................................................. 8

6.1.1 Number of pockets ........................................................................................... 8

6.1.2 Orientation of pockets ...................................................................................... 8

6.1.3 Design rules for pocket density ........................................................................ 9

6.2 Overall tray dimensions ........................................................................................ 10

6.3 Cell dimensions .................................................................................................... 10

6.4 Tray vacuum pick-up sites .................................................................................... 11

6.4.1 Size ............................................................................................................... 11

6.4.2 Centre ........................................................................................................... 11

6.4.3 Perimeter ....................................................................................................... 11

6.5 Detail features ...................................................................................................... 11

6.6 Weight .................................................................................................................. 12

6.7 Movement of components ..................................................................................... 12

6.8 Dimensional information ........................................................................................ 12

7 Polarity and orientation of components in the tray ......................................................... 15

7.1 Pin one ................................................................................................................. 15

7.2 Loading ................................................................................................................. 15

8 Tray stacking ................................................................................................................. 15

8.1 Bundling ............................................................................................................... 15

8.2 Top protection ....................................................................................................... 16

8.3 Partial filling .......................................................................................................... 16

8.4 Protrusion of components ..................................................................................... 16

8.5 Stack-up ............................................................................................................... 16

8.6 Damaging of components ...................................................................................... 16

8.7 Warpage ............................................................................................................... 16

9 Missing components ...................................................................................................... 16

10 Marking ......................................................................................................................... 16

Annex A (informative) List of existing matrix trays with wide anticipated use in the

electronic industries .............................................................................................................. 17

A.1 Matrix trays (for different packages) ...................................................................... 17

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SIST EN IEC 60286-5:2018
IEC 60286-5:2018 © IEC 2018 – 3 –

A.2 Matrix trays for PGA packages .............................................................................. 25

A.2.1 Dimensional information ................................................................................ 25

A.2.2 Variation sheet PGA (pin grid array package) ................................................ 28

Annex B (normative) Measurement methodology of the tray dimensions .............................. 29

B.1 General ................................................................................................................. 29

B.2 Definition of the dimensions .................................................................................. 29

B.2.1 Outline dimensions ........................................................................................ 29

B.2.2 Tray thickness (A) .......................................................................................... 30

B.2.3 Dimensions of the stacking feature ................................................................ 31

B.2.4 Warpage ........................................................................................................ 31

B.3 Measuring instrument............................................................................................ 31

B.4 Measurement conditions ....................................................................................... 31

B.5 Measurement methodology ................................................................................... 31

B.5.1 Outline dimensions ........................................................................................ 31

B.5.2 Tray thickness (A) .......................................................................................... 32

B.5.3 Dimensions of the stacking feature ................................................................ 33

B.5.4 Warpage ........................................................................................................ 33

Annex C (normative) Matrix trays – General considerations for design (design value) .......... 34

C.1 Lateral movement of leaded devices ..................................................................... 34

C.2 Lateral movement of un-leaded devices ................................................................ 34

C.3 Lead protection ..................................................................................................... 35

Figure 1 – Sample of leaded packages ................................................................................. 11

Figure 2 – Sample of grid array packages ............................................................................. 11

Figure 3 – Tray main view ..................................................................................................... 13

Figure 4 – Tray stacking details ............................................................................................ 14

Figure 5 – Tray tolerances .................................................................................................... 14

Figure A.1 – Thin tray ........................................................................................................... 18

Figure A.2 – Thick matrix ...................................................................................................... 26

Figure B.1 – Cross-sections of the outline dimensions .......................................................... 30

Figure B.2 – Tray thickness .................................................................................................. 30

Figure B.3 – Examples of tray warpage ................................................................................. 31

Figure B.4 – Top view of a tray showing the measurement locations for the outline

dimensions ........................................................................................................................... 32

Figure B.5 – Measurement locations for tray thickness ........................................................ 32

Figure B.6 – Holding position in calliper jaws for measurement ............................................ 32

Figure B.7 – Correction of a lift of the tray at the measurement point .................................... 32

Figure B.8 – Measurement locations for the stackable design ............................................... 33

Figure B.9 – Measurement points for warpage ...................................................................... 33

Figure C.1 – Lateral movement of leaded devices A to I ....................................................... 34

Figure C.2 – Lateral movement of un-leaded devices check points A to C ............................. 34

Figure C.3 – Lateral movement of un-leaded devices check points D to F ............................. 35

Figure C.4 – Lead protection gap .......................................................................................... 35

Table 1 – P and W dimension .................................................................................................. 9

Table 2 – Height dimensions ................................................................................................. 10

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SIST EN IEC 60286-5:2018
– 4 – IEC 60286-5:2018 © IEC 2018

Table 3 – Notes related to Figures 3 and 4 ........................................................................... 15

Table A.1 – Variations .......................................................................................................... 19

Table A.2 – Notes related to Figures A.1 and A.2.................................................................. 27

Table A.3 – PGA variations ................................................................................................... 28

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SIST EN IEC 60286-5:2018
IEC 60286-5:2018 © IEC 2018 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 5: Matrix trays
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 60286-5 has been prepared by IEC technical committee 40:

Capacitors and resistors for electronic equipment.
This third edition cancels and replaces the second edition published in 2003 and
Amendment 1:2009. This edition constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:

a) The generic rules for the design of matrix trays are given in this document. Newly

developed trays which follow these rules will not be listed individually. Only those trays

which conform to the design rules set forth herein are classified as "standard trays" and

are thus preferred for use.

b) An update of the matrix trays, which do not conform to the design rules set forth herein,

are considered as "non-standard trays" and are not preferred for use, is listed in Annex A.

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SIST EN IEC 60286-5:2018
– 6 – IEC 60286-5:2018 © IEC 2018
The text of this International Standard is based on the following documents:
CDV Report on voting
40/2556/CDV 40/2597/RVC

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 60286 series, published under the general title Packaging of

components for automatic handling, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
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SIST EN IEC 60286-5:2018
IEC 60286-5:2018 © IEC 2018 – 7 –
PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING –
Part 5: Matrix trays
1 Scope

This part of IEC 60286 describes the common dimensions, tolerances and characteristics of

the tray. It includes only those dimensions that are essential for the handling of the trays for

the stated purpose and for placing or removing components from the trays.

Matrix trays are designed to facilitate the transport and handling of electronic components

during their testing, baking, transport/storage, and final mounting by automatic placement

equipment.

The generic rules for their design are given in this document. Newly developed trays that

follow these rules will not be listed individually. Only those trays that conform to the design

rules set forth herein are classified as "standard trays" and are thus preferred for use.

NOTE Matrix trays listed in Annex A that do not conform to the design rules set forth herein shall be considered

as "non-standard trays" and are not preferred for use.
2 Normative references
There are no normative references in this document.
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
No terms and definitions are listed in this document.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.2 Abbreviated terms
The following are the abbreviated terms used in Table A.1 and Table A.3.
ball grid array (ball grid array type package) BGA
ceramic quad flat package (ceramic quad flat type package) CQFP
metric quad flat package (metric quad flat type package) MQFP
plastic leaded chip carrier (plastic leaded type chip carrier) PLCC
plastic quad flat package (plastic quad flat type package) PQFP
thin quad flat package (thin quad flat type package) TQFP
small outline j-leaded package (small outline j-leaded type package) SOJ
type 1 thin small outline package (thin small outline type package1) TSOP (I)
type 2 thin small outline package (thin small outline type package2) TSOP (II)
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SIST EN IEC 60286-5:2018
– 8 – IEC 60286-5:2018 © IEC 2018
4 Material
4.1 Electrostatic dissipative requirements

Trays shall be moulded from material that meets the ESD dissipative requirements with

surface resistance equal to or greater than 1,0 x 10 ohms/square but less than
−11
1,0 x 10 ohms/square.
4.2 Effect of properties

The tray material shall not adversely affect the mechanical, electrical characteristics,

solder-ability, or marking of the component during or after transport, baking or storage in the

tray.
4.3 Recycling and rigidity

The tray material shall be reusable or recyclable and shall be rigid enough to avoid damage to

the components during handling, loading, baking, testing, shipping and placement operations.

There should be space for a recycle logo and material code or material declaration close to

'Detail B'.
5 Mechanical stability
5.1 Loaded tray

Mechanical stability of loaded trays shall be such that the components are adequately

retained, without lead/terminal damage, and can be easily removed from the tray.
5.2 Empty tray

The empty tray shall withstand normal environmental conditions (including component baking

temperatures, if required) without distorting, warping, expanding, shrinking or any other

physical change outside the specified dimensions of the trays.
5.3 Outer edges

The outer edges of the tray shall be of sufficient thickness and strength to allow mechanical

positioning and clamping.
6 Tray design, dimensions and other physical properties
6.1 Tray design
6.1.1 Number of pockets

All new tray proposals should maximize the number of pockets in each tray-family variation

without violating the pocket-density design rules specified in 6.1.3.
6.1.2 Orientation of pockets

When designing a tray for a rectangular package, the longest dimension (D) of the package is

oriented parallel to the length of the tray to maximize tray pocket density.
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SIST EN IEC 60286-5:2018
IEC 60286-5:2018 © IEC 2018 – 9 –
6.1.3 Design rules for pocket density
6.1.3.1 Formulas
DT is D + strengthening pocket rib width W
max
ET is E " + strengthening pocket rib width W
max
M is (135,9 mm − M3(N1 − 1))/2
M1 is (315,0 mm − M2(N2 − 1))/2
M2 is [(315,0 mm − 2P mm) − W(N2 − 1)]/N2 + W
M3 is [(135,9 mm − 2P mm) − W(N1 − 1)]/N1 + W
N1 is (135,9 mm − 2P mm)/ET (rounded down to a whole number)
N2 is (315,0 mm − 2P mm)/DT (rounded down to a whole number)

NOTE 1 After the maximum matrix has been established by the above calculation using a minimum W value, N1

and N2 may not have resulted in even numbers and may therefore have been rounded down to the nearest whole

number. This means we may have fractions of millimetres extra that should be added back to M2 and M3 to

maximize the pitch between the pockets while minimizing the edge of the tray to the centre line of the first pocket

M and M1.

NOTE 2 For component sizes < (7 × 7) mm high density can cause difficulties for inspection and risks for handling.

NOTE 3 See Annex C for further information about tray design considerations.
The dimensions P and W are given in Table 1.
Table 1 – P and W dimension
Dimension Thin tray Thick tray
Normal stacking tray Low stacking tray
mm mm
P 3,2 5,0 5,0
2,0 2,5 2,0
6.1.3.2 Constituents of the design rules, formulas and drawings
D is determined by appropriate specification
max
DT is the max. length D + strengthening pocket rib width W
E is determined by appropriate specification
max
ET is the max. width E + strengthening pocket rib width W
M is the edge of the tray width to the centre line of the first pocket
M1 is the edge of the tray length to the centre line of the first pocket
M2 is the pitch of the tray pocket in the tray length
M3 is the pitch of the tray pocket in the tray width
N is the package pin counts supported
N1 is the number of columns in the tray
N2 is the number of rows in the tray
N3 is the total number of pockets in the tray (N1 × N2 = N3)
N4 is the package type accommodated
N5 is the end vacuum pick-up area(s)
N6 is the centre vacuum pick-up area(s)
P is the edge of the tray to the edge of the pocket
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SIST EN IEC 60286-5:2018
– 10 – IEC 60286-5:2018 © IEC 2018
W is the strengthening pocket rib width

NOTE The tray manufacturer or tray user will determine W from the latest manufacturing capabilities and design

feature needs at the time of the new tray-family design.

W should not exceed the target value of Table 1 in order to achieve the maximum tray density

unless required by application.
6.2 Overall tray dimensions

Overall tray dimensions shall be 322,6 mm in length and 135,9 mm in width. Overall height A,

stacking step height A1 and edge height A2 are given in Table 2.
Table 2 – Height dimensions
Dimension Thin tray Thick tray
Normal stacking tray Low stacking tray mm
mm mm
A 7,62 7,62 12,19
A1 6,35 5,62 10,16
A2 1,27 typically 2,00 typically 2,03 typically

Measurement methodology of the tray outline dimensions, height, stacking feature dimensions

and warpage is described in Annex B.
6.3 Cell dimensions

Cell dimensions are derived from package dimensions. The information given in this section is

intended for reference only. Package types shown in Figures 1 and 2 are not intended in any

way to limit types of present or future designs that may require matrix trays.

D and E dimensions represent the largest overall features of a package (lead/terminal or

body).
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SIST EN IEC 60286-5:2018
IEC 60286-5:2018 © IEC 2018 – 11 –
QUAD SIDED
PACKAGE
QUAD
DUAL SIDED PA
...

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