IEC 62047-27:2017

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

IEC 62047-27:2017(E) specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries.
The micro-chevron-test is an experimental method to determine the fracture toughness KIC of brittle materials or bond interfaces using specifically designed test chips (micro-chevron-samples) under defined load conditions (crack opening mode I). Owing to its high precision and low variance, it is suitable for analysing the influence of different process parameters on bond strength as well as for quality assurance.

General Information

• Status: Published
• Publication Date: 19-Jan-2017
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 13.280 - Radiation protection
• ICS: 17.240 - Radiation measurements
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: SC 47F - Micro-electromechanical systems
• Current Stage: PPUB - Publication issued
• Start Date: 31-Jan-2017
• Completion Date: 20-Jan-2017

Standards Content (Sample)

IEC 62047-27 ®
Edition 1.0 2017-01
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices
Part 27: Bond strength test for glass frit bonded structures using micro-chevron-
tests (MCT)
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IEC 62047-27 ®
Edition 1.0 2017-01
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices

Part 27: Bond strength test for glass frit bonded structures using micro-chevron-

tests (MCT)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-3831-8

– 2 – IEC 62047-27:2017 © IEC 2017
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 7
3 Terms, definitions, symbols and abbreviated terms . 7
3.1 Terms and definitions . 7
3.2 Symbols and abbreviated terms . 7
4 Principle . 8
5 Test setup . 8
5.1 General . 8
5.2 Actuator . 8
5.3 Force transducers . 8
5.4 Mounting . 8
5.5 Data acquisition . 8
6 Specimens . 9
6.1 Sample design . 9
6.2 Determination and verification of the specimen geometry . 11
7 Conduction of the test . 11
8 Test parameter . 12
8.1 Test velocity . 12
8.2 Specimen alignment . 13
8.3 Environmental conditions . 13
9 Analysis and evaluation . 13
9.1 General requirements for test series . 13
9.2 Valid test . 13
9.3 Calculation of the fracture toughness of the glass frit connection . 14
9.4 Statistical evaluation . 15
10 Test report . 15
Bibliography . 16

Figure 1 – Test setup of the micro-chevron-test . 6
Figure 2 – Standard geometry design of glass frit specimen. 10
Figure 3 – Design of the load application elements . 11
Figure 4 – Permissible deviation for stud application . 12
Figure 5 – Connection of the free sample parts as a result of the application of the
applied force initiation elements . 12
Figure 6 – Exemplary measurement graph of a valid attempt . 14

Table 1 – Geometry factors in relation to substrate thickness . 14

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES

Part 27: Bond strength test for glass frit bonded
structures using micro-chevron-tests (MCT)

FOREWORD
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International Standard IEC 62047-27 has been prepared by subcommittee 47F:
Microelectromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
CDV Report on voting
47F/230A/CDV 47F/259/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – IEC 62047-27:2017 © IEC 2017
A list of all parts in the IEC 62047 series, published under the general title Semiconductor
devices – Micro-electromechanical devices, can be found on the IEC website.
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INTRODUCTION
MEMS devices, e.g. for automotive applications, have to ensure lifecycles of up to 15 years or
more. In order to guarantee functionality and reliability of the used interconnection
technologies, qualified test methods are required for evaluating the quality and strength of the
bonding interfaces. One of the preferred interconnection technologies for MEMS
encapsulation is glass frit bonding, using an additional intermediate bond layer.
The micro-chevron-test is an experimental method to determine the fracture toughness of
brittle materials or bond interfaces using specifically designed test chips (micro-chevron-
samples) under defined load conditions. It was established for characterizing the strength of
wafer bonds without additional intermediate bond layers. By analysis of test results from a
series of tests at the Fraunhofer Institute for Mechanics of Materials and the Fraunhofer
Institute for Electronic Nano Systems with different geometry and layout of the test-probes,
the micro-chevron-test was established for the bonding reliability of glass frit bonded devices
as well.
– 6 – IEC 62047-27:2017 © IEC 2017
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES

Part 27: Bond strength test for glass frit bonded
structures using micro-chevron-tests (MCT)

1 Scope
This part of IEC 62047 specifies a method for assessing the bond strength of glass frit bonded
structures using micro-chevron-tests
...