Space product assurance - Verification and approval of automatic machine wave soldering

This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of double-sided and multilayer boards are also defined.

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Diese Norm legt Grundanforderungen an Verfahren zur Verifikation und Zulassung des Maschinenschwall-lötens für Hardware in Anwendungen in der Raumfahrt fest, unter besonderer Berücksichtigung von Fertigungsverfahren für zweiseitige Leiterplatten und Mehrschichtleiterplatten.

Assurance produits des projets spatiaux - Validation et approbation du brasage automatique a la vague

La présente norme définit les exigences de base pour la validation et l'approbation du procédé de brasage a la vague effectué par machine automatique a l'usage des véhicules spatiaux. La présente norme définit également les exigences concernant le brasage a la vague des cartes double face et multicouches.

Space product assurance - Verification and approval of automatic machine wave soldering

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9900 - Withdrawal (Adopted Project)
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2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Space product assurance - Verification and approval of automatic machine wave solderingLuft- und Raumfahrt - Raumfahrtproduktsicherung - Verifikation und Zulassung von MaschinenschwalllötverfahrenAssurance produits des projets spatiaux - Validation et approbation du brasage automatique a la vagueSpace product assurance - Verification and approval of automatic machine wave soldering49.140Vesoljski sistemi in operacijeSpace systems and operations25.160.50Trdo in mehko lotanjeBrazing and solderingICS:Ta slovenski standard je istoveten z:EN 14612:2003SIST EN 14612:2004en01-maj-2004SIST EN 14612:2004SLOVENSKI

SIST EN 14612:2004

EUROPEAN STANDARDNORME EUROPÉENNEEUROPÄISCHE NORMEN 14612August 2003ICS 25.160.50; 49.140English versionSpace product assurance - Verification and approval ofautomatic machine wave solderingAssurance produits des projets spatiaux - Validation etapprobation du brasage automatique à la vagueThis European Standard was approved by CEN on 27 June 2003.CEN members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this EuropeanStandard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such nationalstandards may be obtained on application to the Management Centre or to any CEN member.This European Standard exists in three official versions (English, French, German). A version in any other language made by translationunder the responsibility of a CEN member into its own language and notified to the Management Centre has the same status as the officialversions.CEN members are the national standards bodies of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece,Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and UnitedKingdom.EUROPEAN COMMITTEE FOR STANDARDIZATIONCOMITÉ EUROPÉEN DE NORMALISATIONEUROPÄISCHES KOMITEE FÜR NORMUNGManagement Centre: rue de Stassart, 36
B-1050 Brussels© 2003 CENAll rights of exploitation in any form and by any means reservedworldwide for CEN national Members.Ref. No. EN 14612:2003 ESIST EN 14612:2004

EN 14612:2003 (E)2ContentspageForeword.31Scope.42Normative references.43Terms, definitions and abbreviated terms.43.1Terms and definitions.43.2Abbreviated terms.54General.54.1Introduction.54.2Design.54.3Rework.55Request for verification of process.65.1General.65.2Documentation.65.3Samples.66Technology samples.66.1Configuration.66.2Accompanying data.66.3Examination.77Line audit.78Verification.78.1Planning, management and finance.78.2Description of samples.78.3Initial tests.78.4Environmental exposure.88.5Final tests.88.6Final report.89Final customer approval.89.1Notification.89.2Approval duration.99.3Renewal of final customer approval.99.4Withdrawal of final customer approval.99.5Final customer approval.9Annex A (normative)
Process requirements for wave soldering of printed circuit boards.11Annex B (informative)
Solder joint desprepancy log (Example).13Bibliography.15SIST EN 14612:2004

EN 14612:2003 (E)3ForewordThis document (EN 14612:2003) has been prepared by Technical Committee CEN/TC CST02 "Space productassurance — Verification and approval of automatic machine wave soldering", the secretariat of which is held byCMC.This European Standard shall be given the status of a national standard, either by publication of an identical text orby endorsement, at the latest by February 2004, and conflicting national standards shall be withdrawn at the latestby February 2004.It is based on a previous version1) prepared by the ECSS Product Assurance Working Group, reviewed by theECSS Technical Panel and approved by the ECSS Steering Board. The European Cooperation for SpaceStandardization (ECSS) is a cooperative effort of the European Space Agency, National Space Agencies andEuropean industry associations for the purpose of developing and maintaining common standards.Requirements in this Standard are defined in terms of what shall be accomplished, rather than in terms of how toorganize and perform the necessary work. This allows existing organizational structures and methods to be appliedwhere they are effective, and for the structures and methods to evolve as necessary without rewriting thestandards.The formulation of this Standard takes into account the existing ISO 9000 family of documents.Annex A is normative. Annex B is informative.According to the CEN/CENELEC Internal Regulations, the national standards organizations of the followingcountries are bound to implement this European Standard: Austria, Belgium, Czech Republic, Denmark, Finland,France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal,Slovakia, Spain, Sweden, Switzerland and the United Kingdom.
1)ECSS-Q-70-07A.SIST EN 14612:2004

EN 14612:2003 (E)4IntroductionWave soldering is regarded as a critical process that will find limited application during the assembly of componentson to printed circuit boards (PCBs) intended for spacecraft. The preferred procedure is by manual soldering to therequirements of ECSS-Q-70-08. Generally the small number of identically designed circuits does not warrant thesetting up of unique machine parameters for each individual layout.1 ScopeThis specification defines the basic requirements for the verification and approval of automatic machine wavesoldering for use in spacecraft hardware. The process requirements for wave soldering of double-sided andmultilayer boards are also defined.2 Normative referencesThis European Standard incorporates by dated or undated reference, provisions from other publications. Thesenormative references are cited at the appropriate places in the text, and the publications are listed hereafter. Fordated references, subsequent amendments to or revisions of any of these publications apply to this EuropeanStandard only when incorporated in it by amendment or revision. For undated references the latest edition of thepublication referred to applies (including amendments).EN 13701:2001, Space systems — Glossary of terms.ECSS-Q-70-08, Space product assurance - The manual soldering of high-reliability electrical connections.ECSS-Q-70-10, Space product assurance - Qualification of printed circuit boards.3 Terms, definitions and abbreviated terms3.1 Terms and definitionsFor the purposes of this European Standard, the terms and definitions given in EN 13701:2001 and the followingapply.3.1.1ionisable contaminantprocess residues such as flux activators, fingerprints, etching and plating salts, that exist as ions and whendissolved, increase electrical conductivity3.1.2machine oilliquid compounds formulated for use as oil in wave-soldering equipmentNOTEThey serve primarily to provide a barrier between the atmosphere and molten solder, thereby reducing the oxidation(drossing) of the solder. Certain oils also reduce the surface tension of molten solder, thereby enhancing the wettingcharacteristics of the solder3.1.3measlingcondition existing in the base laminate of a printed circuit board in the form of discrete white spots or “crosses”below the surface of the base laminate, reflecting a separation of fibres in the glass cloth at the weave intersectionSIST EN 14612:2004

EN 14612:2003 (E)53.1.4wave solderingprocess wherein printed circuit boards are brought in contact with a gently overflowing wave of liquid solder whichis circulated by a pump in an appropriately designed solder pot reservoirNOTEThe prime functions of the molten wave are to serve as a heat source and heat-transfer medium and to supplysolder to the joint area.3.1.5wave-soldering equipmentsystems that achieve wave soldering and which consist of stations for fluxing, preheating, and soldering by meansof a conveyerNOTECleaning is usually offered as an option. Normally, additional cleaning is necessary in order to meet cleanlinessstandards.3.2 Abbreviated termsThe following abbreviated terms are defined and used with this standard.AbbreviationMeaningPCBPrinted Circuit BoardPIDProcess Identification Document4 General4.1 IntroductionWhen wave soldering is identified as a suitable alternative to manual soldering for use in the customer’s projects, itwill be essential to follow the steps outlined in this document before the final customer’s approval is granted. Thesequence of main events is shown in Figure 1. Each step shall be fully completed and the details recorded, so thata dossier is compiled for each manufacturer’s assembly line. All dossiers are kept updated by the final customerand serve as a reference for the final customer’s Project Engineers.A general qualification is not granted for wave soldering. Wave soldering lines that were previously verified (seealso clause 5) may be also approved for use on named projects, but this shall depend entirely on the specificproject requirements. Project process approval shall be obtained, as for all materials and critical processes, seeECSS-Q-70.4.2 DesignDesigners of printed circuit boards shall be familiar with design parameters that are necessary for the wave-soldering process. Circuit tracks that are spaced close together should be oriented in line with the pass direction toavoid solder bridging. Large heat sink areas should be avoided; these will include ground planes and large leadsclosely connected to massive metal parts.4.3 ReworkSpace-quality requirements of solder joints (see ECSS-Q-70-08) shall be met without more than 5 % rework oneach wave soldered circuit.NOTEDeficient wave-soldered connections are caused most frequently by the movement of component leads duringsolidification, the presence of solder alloy within stress relief bends and the entrapment of machine oils and solder

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