oSIST prEN IEC 61760-1:2025

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs).

Technique du montage en surface - Partie 1: Méthode normalisée pour la spécification des composants pour montage en surface (CMS)

Tehnologija površinske montaže - 1. del: Standardna metoda za specifikacijo komponent za površinsko montažo (SMDs)

General Information

• Status: Not Published
• Public Enquiry End Date: 30-Sep-2025
• ICS: 31.190 - Electronic component assemblies
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: ITIV - Electronics assembly technology and Environmental standardization
• Current Stage: 4020 - Public enquire (PE) (Adopted Project)
• Start Date: 30-Jul-2025
• Due Date: 17-Dec-2025
• Ref Project: prEN IEC 61760-1:2025 - Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs).

Relations

• Revises: SIST EN IEC 61760-1:2022 - Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
• Effective Date: 04-Apr-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-september-2025
Tehnologija površinske montaže - 1. del: Standardna metoda za specifikacijo
komponent za površinsko montažo (SMDs)
Surface mounting technology - Part 1: Standard method for the specification of surface
mounting components (SMDs).
Technique du montage en surface - Partie 1: Méthode normalisée pour la spécification
des composants pour montage en surface (CMS)
Ta slovenski standard je istoveten z: prEN IEC 61760-1:2025
ICS:
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

91/2048/CDV
COMMITTEE DRAFT FOR VOTE (CDV)

PROJECT NUMBER:
IEC 61760-1 ED4
DATE OF CIRCULATION: CLOSING DATE FOR VOTING:
2025-07-18 2025-10-10
SUPERSEDES DOCUMENTS:
91/1970/CD, 91/2033/CC
IEC TC 91 : ELECTRONICS ASSEMBLY TECHNOLOGY
SECRETARIAT: SECRETARY:
Japan Mr Osamu IKEDA
OF INTEREST TO THE FOLLOWING COMMITTEES: HORIZONTAL FUNCTION(S):

TC 40,TC 47,TC 86
ASPECTS CONCERNED:
SUBMITTED FOR CENELEC PARALLEL VOTING NOT SUBMITTED FOR CENELEC PARALLEL VOTING
Attention IEC-CENELEC parallel voting
The attention of IEC National Committees, members of
CENELEC, is drawn to the fact that this Committee Draft
for Vote (CDV) is submitted for parallel voting.
The CENELEC members are invited to vote through the
CENELEC online voting system.
This document is still under study and subject to change. It should not be used for reference purposes.
Recipients of this document are invited to submit, with their comments, notification of any relevant patent rights of
which they are aware and to provide supporting documentation.
Recipients of this document are invited to submit, with their comments, notification of any relevant “In Some
Countries” clauses to be included should this proposal proceed. Recipients are reminded that the CDV stage is
the final stage for submitting ISC clauses. (SEE AC/22/2007 OR NEW GUIDANCE DOC).

TITLE:
Surface mounting technology - Part 1: Standard method for the specification of surface
mounting components (SMDs).
PROPOSED STABILITY DATE: 2030
NOTE FROM TC/SC OFFICERS:
download this electronic file, to make a copy and to print out the content for the sole purpose of preparing
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IEC CDV 61760-1 ED4 © IEC 2025

Link to Committee Draft for Vote (CDV) online document:
https://osd.iec.ch/#/editor/archive/1cd27be7-cf53-3e7d-e063-2b13000a52eb/en/CCDV/1

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IEC CDV 61760-1 ED4 © IEC 2025

CONTENTS
FOREWORD . 7
INTRODUCTION . 9
1 Scope . 10
2 Normative references . 10
3 Terms and definitions . 12
4 Requirements for component design and component specifications . 14
4.1 General requirement . 14
4.2 Classification of electronic assemblies . 14
4.2.1 Level A: General electronics products . 14
4.2.2 Level B: Dedicated service electronics products . 14
4.2.3 Level C: High-performance electronics products . 14
4.3 Component marking and labelling . 14
4.3.1 General . 14
4.3.2 Marking of multipin components. 14
4.3.3 Marking of components with polarity . 14
4.3.4 Durability of component marking . 15
4.4 Component outline and design . 15
4.4.1 Drawing and specification . 15
4.4.2 Termination design . 16
4.4.3 Pick-up area requirements . 16
4.4.4 Bottom surface requirements . 17
4.4.5 Requirements for terminals . 17
4.4.6 Component height . 19
4.4.7 Component weight . 20
4.4.8 Creepage and clearance distances - insulation coordination . 20
4.5 General requirements for components related to assembly technology . 21
4.5.1 Robustness of components . 21
4.5.2 Recommendation for land pattern design . 22
4.6 Cleanliness of components . 22
4.6.1 General remarks . 22
4.6.2 Particle contaminations. 22
4.6.3 Ionic contamination . 22
4.6.4 Other surface contamination . 22
4.7 Surface roughness . 23
4.8 Requirements related to packaging and transportation . 23
4.8.1 Packaging . 23
4.8.2 Labelling of product packaging . 23
4.8.3 Storage and transportation . 24
4.9 Thermal and electrical performance . 24
4.9.1 Relevant parameters . 24
4.9.2 Applicable standards . 24
4.10 Component reliability assurance . 24
4.11 Compliance information . 25
4.11.1 General . 25
4.11.2 Material declaration . 25
4.11.3 Environmental regulatory compliance . 25
4.11.4 Considerations on the materials’ supply chain . 25
IEC CDV 61760-1 ED4 © IEC 2025

5 Assembly processes . 25
5.1 General . 25
5.2 Placement or insertion . 25
5.3 Mounting . 25
5.4 Cleaning (where applicable) . 26
5.4.1 Purpose . 26
5.4.2 Cleaning methods . 26
5.4.3 Typical cleaning conditions for assemblies . 26
5.5 Post assembly processes . 27
5.6 Removal and/or replacement of SMDs . 28
5.6.1 Removal and/or replacement of soldered SMDs . 28
5.6.2 Removal and/or replacement of glued SMDs . 28
6 Soldering . 29
6.1 General . 29
6.1.1 Mounting by soldering . 29
6.1.2 Securing the component on the substrate prior to soldering . 29
6.1.3 Reflow soldering . 30
6.1.4 Wave soldering . 31
6.1.5 Other soldering methods . 31
6.2 Process conditions . 31
6.2.1 General . 31
6.2.2 Commonly used solder alloys . 32
6.2.3 Reflow soldering . 32
6.2.4 Wave soldering . 34
6.3 Requirements for components and component specifications . 34
6.3.1 General . 34
6.3.2 Requirements for temperature sensitive devices . 35
6.3.3 Solderability . 35
6.3.4 Resistance to dissolution of metallization . 36
6.3.5 Resistance to soldering heat . 36
6.3.6 Resistance to vacuum during soldering . 36
6.3.7 Resistance to cleaning media and processes . 37
6.3.8 Warpage during reflow soldering . 38
6.3.9 Rework of soldered components . 38
7 Conductive glue bonding . 39
7.1 Mounting . 39
7.2 Bonding strength test for the component glue interface test . 39
7.3 Requirements to components for conductive glue bonding . 40
7.3.1 Components for conductive glue bonding . 40
7.3.2 Cleanliness of the surface . 40
7.3.3 Terminal surface defects . 40
7.3.4 Outgassing of halogenic substances . 40
7.3.5 Coplanarity . 41
7.3.6 Stand-off . 41
7.3.7 Terminal dimensions and tolerances . 41
7.3.8 Resistance to curing heat . 42
8 Sintering . 42
8.1 General . 42
IEC CDV 61760-1 ED4
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