EN 60068-2-54:2006

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

Umweltprüfungen - Teil 2-54: Prüfungen - Prüfung Ta: Prüfung der Lötbarkeit elektronischer Bauelemente mit der Benetzungswaage

Essais d'environnement - Partie 2-54: Essais - Essai Ta: Essai de brasabilité des composants électroniques par la méthode de la balance de mouillage

La CEI 60068-2-54:2006 décrit l'essai Ta qui consiste en la méthode de la balance de mouillage de bain de soudure applicable qui permet de déterminer la soudabilité des terminaisons de composants de toute forme. Elle est particulièrement adaptée aux essais de référence et aux composants qui ne peuvent pas être soumis à essai quantitativement par d'autres méthodes. Pour des dispositifs de montage en surface (SMD), il convient d'appliquer la CEI 60068-2-69 si cela est approprié. La présente norme fournit les procédures normalisées pour les alliages à braser contenant du plomb (Pb) et pour les alliages à braser sans plomb. Cette seconde édition annule et remplace la première édition publiée en 1985 et constitue une révision technique. Les principales modifications techniques apportées par rapport à l'édition précédente concernent: - l'addition de l'alliage à braser sans plomb (voir l'Article 7, Matériaux); - l'inversion des courbes force-temps pour se conformer à la CEI 60068-2-69 (voir la Figure 2 et la Figure B.1); - la modification de l'exigence d'essai pour la progression du mouillage (voir l'Article 9).

Okoljski preskusi - 2-54. del: Preskusi - Preskus Ta: Preskušanje spajkljivosti elektronskih komponent z metodo za določanje omočljivosti (IEC 60068-2-54:2006)

General Information

• Status: Withdrawn
• Publication Date: 06-Aug-2006
• Withdrawal Date: 30-Jun-2009
• ICS: 19.040 - Environmental testing
• ICS: 31.020 - Electronic components in general
• Technical Committee: CLC/SR 91 - Electronics assembly technology
• Drafting Committee: IEC/TC 91 - IEC_TC_91
• Parallel Committee: IEC/TC 91 - IEC_TC_91
• Current Stage: 9960 - Withdrawal effective - Withdrawal
• Start Date: 11-Apr-2020
• Completion Date: 11-Apr-2020
• Ref Project: SIST EN 60068-2-54:2006 - Environmental testing -- Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

Relations

• Replaces: HD 323.2.54 S1:1987 - Basic environmental testing procedures - Part 2: Tests - Test Ta: Soldering - Solderability testing by the wetting balance method
• Effective Date: 29-Jan-2023
• Replaced By: EN 60068-2-69:2017 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
• Effective Date: 06-Jun-2017

Standards Content (Sample)

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EUROPEAN STANDARD
EN 60068-2-54
NORME EUROPÉENNE
August 2006
EUROPÄISCHE NORM
ICS 19.040; 31.020 Supersedes HD 323.2.54 S1:1987

English version
Environmental testing
Part 2-54: Tests -
Test Ta: Solderability testing of electronic components
by the wetting balance method
(IEC 60068-2-54:2006)
Essais d'environnement  Umweltprüfungen
Partie 2-54 : Essais - Teil 2-54: Prüfungen -
Essai Ta : Essai de brasabilité des Prüfung Ta: Prüfung der Lötbarkeit
composants électroniques par elektronischer Bauelemente
la méthode de la balance de mouillage mit der Benetzungswaage
(CEI 60068-2-54:2006) (IEC 60068-2-54:2006)

This European Standard was approved by CENELEC on 2006-07-01. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain,
Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2006 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60068-2-54:2006 E
Foreword
The text of document 91/576/FDIS, future edition 2 of IEC 60068-2-54, prepared by IEC TC 91,
Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60068-2-54 on 2006-07-01.
This European Standard supersedes HD 323.2.54 S1:1987.
The major technical changes with regard to HD 323.2.54 S1:1987 concern:
– the addition of lead free solder alloy (see Clause 7, Materials);
– reversal of force-time curves to align with EN 60068-2-69 (see Figure 2 and Figure B.1);
– modification to the test requirement for progress of wetting (see Clause 9).
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2007-04-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2009-07-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60068-2-54:2006 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-44 NOTE  Harmonized as EN 60068-2-44:1995 (not modified).
IEC 60068-2-58 NOTE  Harmonized as EN 60068-2-58:2004 (not modified).
IEC 60068-2-69 NOTE  Harmonized as EN 60068-2-69:1996 (not modified).
IEC 61190-1-1 NOTE  Harmonized as EN 61190-1-1:2002 (not modified).
IEC 61190-1-3 NOTE  Harmonized as EN 61190-1-3:2002 (not modified).
__________
- 3 - EN 60068-2-54:2006
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year

1)
IEC 60068-1 1988 Environmental testing EN 60068-1 1994
Part 1: General and guidance
2)
IEC 60068-2-20 1979 Environmental testing HD 323.2.20 S3 1988
Part 2: Tests - Test T: Soldering

3) 4)
IEC 61190-1-3 - Attachment materials for electronic assembly EN 61190-1-3 2002
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solders for electronic soldering applications

1)
EN 60068-1 includes corrigendum October 1988 + A1:1992 to IEC 60068.
2)
HD 323.2.20 S3 includes A2:1987 to IEC 60068-2-20.
3)
Undated reference.
4)
Valid edition at date of issue.

INTERNATIONAL IEC
STANDARD 60068-2-54
Second edition
2006-04
Environmental testing –
Part 2-54:
Tests – Test Ta: Solderability testing of
electronic components by the wetting
balance method
 IEC 2006  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale R
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 60068-2-54  IEC:2006(E)
CONTENTS
FOREWORD.3

1 Scope.5
2 Normative references.5
3 Terms and definitions .5
4 General description of the test .5
5 Description of the test apparatus.6
5.1 Test system.6
5.2 Solder bath.6
6 Preconditioning.6
6.1 Preparation of specimens .6
6.2 Ageing.6
7 Materials .7
7.1 Solder .7
7.2 Flux.7
8 Procedure.7
8.1 Test temperature .7
8.2 Fluxing .7
8.3 Flux drying.8
8.4 Test.8
9 Presentation of results .8
9.1 Form of chart-recorder trace .8
9.2 Points of significance.9
9.3 Reference wetting force .9
9.4 Test requirements.10
10 Information to be given in the relevant specification.10

Annex A (normative) Equipment specification .11
Annex B (informative) Guide to the use of the wetting balance for solderability testing .12

Bibliography .18

Figure 1 – Test arrangement .6
Figure 2 – Wetting conditions .9
Figure B.1 – Representative force-time curves .15

Table 1 – Time sequence of the test.8

60068-2-54  IEC:2006(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
ENVIRONMENTAL TESTING –
Part 2-54: Tests – Test Ta: Solderability testing
of electronic components by the wetting balance method

FOREWORD
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all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60068-2-54 has been prepared by IEC technical committee 91:
Electronics assembly technology.
This second edition cancels and replaces the first edition, published in 1985 and constitutes a
technical revision.
The major technical changes with regard to the previous edition concern:
– the addition of lead free solder alloy (see Clause 7, Materials);
– reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1);
– modification to the test requirement for progress of wetting (see Clause 9).

– 4 – 60068-2-54  IEC:2006(E)
The text of this standard is based on the following documents:
FDIS Report on voting
91/576/FDIS 91/587/RVD
Full information on the voting for the approval of this standard can be found in
...