IEC 61189-3-913:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

IEC 61189-3-913:2016 specifies the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs. The test applies to printed circuit boards for high-brightness LEDs with surface mounted LEDs or with device embedded LEDs in electronic control devices (ECDs). This first edition cancels and replaces the first edition of IEC PAS 61189-3-913 published in 2011. This edition constitutes a technical revision. This edition focused only on the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs.

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 3-913: Méthodes d'essais pour la conductivité thermique des circuits imprimés pour les LED à forte luminosité

L'IEC 61189-3-913:2016 spécifie les méthodes d'essai relatives à la conductivité thermique spécifique aux circuits imprimés des LED à forte luminosité. L'essai est applicable aux circuits imprimés pour les LED à forte luminosité, les LED pour montage en surface ou les LED intégrées à un appareil dans des dispositifs de commande électroniques (ECD, Electronic Control Device). Cette première édition annule et remplace la première édition de l'IEC PAS 61189-3-913 parue en 2011. Cette édition constitue une révision technique. Cette édition est consacrée uniquement aux méthodes d essai relatives à la conductivité thermique spécifique aux circuits imprimés des LED à forte luminosité.

Aluminium-magnesium-silicon alloy wire for overhead line conductors

General Information

• Status: Published
• Publication Date: 04-Jan-2016
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 29.060.10 - Wires
• ICS: 29.240.20 - Power transmission and distribution lines
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 10 - TC 91/WG 10
• Current Stage: PPUB - Publication issued
• Start Date: 15-Jan-2016
• Completion Date: 05-Jan-2016
• Ref Project: SIST IEC 60104:1999 - Aluminium-magnesium-silicon alloy wire for overhead line conductors

Relations

• Replaces: IEC PAS 61189-3-913:2011 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test methods for interconnection structures (printed boards) - Electronic circuit board for high-brightness LEDs
• Effective Date: 05-Sep-2023

Standards Content (Sample)

SLOVENSKI STANDARD
01-november-1999
Aluminium-magnesium-silicon alloy wire for overhead line conductors
Aluminium-magnesium-silicon alloy wire for overhead line conductors
Fils en alliage d'aluminium-magnésium-silicium pour conducteurs de lignes aériennes
Ta slovenski standard je istoveten z: IEC 60104
ICS:
29.060.10 Žice Wires
29.240.20 Daljnovodi Power transmission and
distribution lines
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

NORME CEI
INTERNATIONALE IEC
INTERNATIONAL
Deuxième édition
STAN DARD
Second edition
1987-12
Fils en alliage d'aluminium-magnésium-silicium
pour conducteurs de lignes aériennes
Aluminium-magnesium-silicon alloy wire
for overhead line conductors
© IEC 1987
Droits de reproduction réservés —
Copyright - all rights reserved
Aucune partie de
cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in
utilisée quelque
sous forme que ce soit et par aucun any form or by any means, electronic or mechanical,
procédé, électronique ou mécanique, y compris la photo- including photocopying and microfilm, without permission in
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104 © IEC 1987 –3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
ALUMINIUM-MAGNESIUM-SILICON ALLOY WIRE
FOR OVERHEAD LINE CONDUCTORS
FOREWORD
1) The formal decisions or agreements of the I E C on technical matters, prepared by Technical Committees on which all the
National Committees having a special interest therein are represented, express, as nearly as possible, an international
consensus of opinion on the subjects dealt with.
2)
They have the form of recommendations for international use and they are accepted by the National Committees in that sense.
3) fi
In order to promote international uni cation, the I E C expresses the wish that all National Committees should adopt the text
of the I E C recommendation for their national rules in so far as national conditions will permit. Any divergence between the
I E C recommendation and the corresponding national rules should, as far as possible, be clearly indicated in the latter.
PREFACE
This standard has been prepared by I E C Technical Committee No. 7 : Bare Aluminium Conductors.
This second edition of I E C Publication 104 replaces the first edition, which was issued in 1958.
This standard replaces Clauses 3, 5, 6 and 13, and the requirements of Clauses 4 and 12 and Sub-
clause 8.1 of I E C Publication 208 (1966) : Aluminium Alloy Stranded Conductors (Aluminium-
Magnesium-Silicon Type). It also replaces Clauses 3, 6, 15, Sub-clause 7.1 and the requirements of
Clause 5, Sub-clauses 9.1, 13.2 and 13.3 of IEC Publication 210 (1966) : Aluminium Alloy
Conductors, Steel-reinforced.
The text of this standard is based on the following documents:
Six Months' Rule Report on Voting
7(CO)420 7(CO)423
Further information can be found in the Report on Voting indicated in the table above.
The following !EC publication is quoted in this standard:
Publication No. 468 (1974): Method of Measurement of Resistivity of Metallic Materials.
Other publications quoted:
ISO Standard 6892 (1984) : Metallic Materials – Tensile Testing.
ISO Standard 7802 (1983): Metallic Materials – Wire-Wrapping Test.

104 © I E C – 5
ALUMINIUM-MAGNESIUM-SILICON ALLOY WIRE
FOR OVERHEAD LINE CONDUCTORS
1. Scope
This standard is applicable to aluminium-magnesium-silicon alloy wires of two types having
different mechanical and electrical properties for the manufacture of stranded conductors for
overhead power transmission purposes. It specifies the mechanical and electrical properties of
wires in the diameter range 1.50 mm to 4.50 mm.
The two types are designated Type A and Type B respectively.
Values for alumini
...

IEC 61189-3-913 ®
Edition 1.0 2016-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 3-913: Test method for thermal conductivity of printed circuit boards for
high-brightness LEDs
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres
structures d'interconnexion et ensembles –
Partie 3-913: Méthodes d'essai pour la conductivité thermique des circuits
imprimés pour les LED à forte luminosité

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IEC 61189-3-913 ®
Edition 1.0 2016-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –
Part 3-913: Test method for thermal conductivity of printed circuit boards for

high-brightness LEDs
Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres

structures d'interconnexion et ensembles –

Partie 3-913: Méthodes d'essai pour la conductivité thermique des circuits

imprimés pour les LED à forte luminosité

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-3104-3

– 2 – IEC 61189-3-913:2016 © IEC 2016
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Pre–conditioning . 6
5 Test methods . 6
5.1 General . 6
5.2 Thermal conductivity . 6
5.2.1 Measurement of thermal resistance on the plane . 6
5.2.2 Measurement of thermal resistance across the thickness . 8
Annex A (normative) Boards and panels . 13
A.1 Panel and board sizes . 13
A.1.1 Board size . 13
A.1.2 Allowance of dimensions . 13
A.1.3 Perforation and slit . 14
A.1.4 V-cut. 14
A.2 Total board thickness . 15
A.3 Holes . 16
A.3.1 Insertion holes and vias . 16
A.3.2 Datum hole . 19
A.3.3 Assembly hole (through-hole without wall plating) . 19
A.4 Conductor . 19
A.4.1 Width of conductor pattern and its allowance . 19
A.4.2 Distance between conductors and its allowance . 20
A.4.3 Thickness of the insulating layer . 21
A.5 Printed contact . 21
A.5.1 Allowance of the distance between the centers of two adjacent printed
contacts . 21
A.5.2 Allowance of the terminal width of printed contacts . 22
A.5.3 Shift of the center of printed contacts on the front and back sides of a
board . 22
A.6 Land pattern . 23
A.6.1 Allowance of the distance between the centers of two lands . 23
A.6.2 Allowance of a land width . 23
A.6.3 Land diameter and its allowance for BGA/CSP . 24
A.7 Fiducial mark and mark for component positioning . 25
A.7.1 Typical form and size of the fiducial mark . 25
A.7.2 Dimensional allowance of fiducial mark and component positioning mark . 26
A.7.3 Position allowance of the component positioning mark. 26
A.8 Interlayer connection – Copper plating . 26
Annex B (normative) Equilibrium test . 27
Bibliography . 28

Figure 1 – Illustration of an apparatus for the thermal conductivity test . 10
Figure 2 – Surface layer specimen pattern for thermal conductivity test . 11
Figure 3 – Test equipment for thermal resistance to the thickness direction . 12

Figure A.1 – Board arrangement in a panel . 13
Figure A.2 – Distances from the datum point to perforation and slit . 14
Figure A.3 – Distance from the datum point to the V-cut . 15
Figure A.4 – Allowance of position off-set of V-cuts on front and back surfaces . 15
Figure A.5 – PWB board with symbol mark, solder resist, copper foil and plating . 16
Figure A.6 – Positions of component insertion holes . 17
Figure A.7 – Distance between the wall of a hole and the board edge . 18
Figure A.8 – Wall of a hole and the minimum designed spacing to the inner conductor . 19
Figure A.9 – Width of finished conductor . 20
Figure A.10 – Distance between conductor and board edge . 21
Figure A.11 – Thickness of the insulating layer . 21
Figure A.12 – Distance between centers of terminals of printed contacts . 22
Figure A.13 – Terminal width of a printed contact . 22
Figure A.14 – Shift of the center of printed contacts on front and back sides of a board . 23
Figure A.15 – Land pattern . 23
Figure A.16 – Land width of a land pattern . 24
Figure A.17 – Land diameter of BGA/CSP formed of a conductor only . 24
Figure A.18 – Land diameter (d) of BGA/CSP formed at the opening of solder resist . 25
Figure A.19 – Examples of fiducial mark and component positioning mark . 26

Table 1 – Applied power (P) that corresponds to a range of thermal resistance
on the plane .
...