EN 16602-70-11:2015
(Main)Space product assurance - Procurement of printed circuit boards
Space product assurance - Procurement of printed circuit boards
This Standard defines the requirements imposed on the customer, the supplier and the qualified PCB manufacturer for PCB procurement. The requirements of clause 7 apply to both qualification and procurement of finished PCBs and do not include the manufacturing tolerances. This Standard is applicable for the following type of boards: - Rigid PCBs (single-sided, double-sided, multilayer, sequential multilayer and PCBs with metal core) - Flexible PCBs (single-sided and double-sided) - Rigid-flex PCBs (multilayer and sequential multilayer) - High frequency PCBs - Special PCBs. PCBs are used for the mounting of components in order to produce PCB assemblies performing complex electrical functions. The PCBs are subjected to thermo-mechanical stresses during their assembly such as mounting of components by soldering, rework and repair under normal terrestrial conditions. In addition the assembled PCB is subjected to the environment imposed by launch and space flights. Therefore the qualification of a PCB supplier to ECSS-Q-ST-70-10 is of extreme importance before the procurement of PCB for space usage. This standard may be tailored for the specific characteristics and constraints of a space project in conformance with ECSS-S-ST-00.
Raumfahrtproduktsicherung - Beschaffung von Leiterplatten
Assurance produit des projets spatiaux - Approvisionnement des circuits imprimés
Zagotavljanje varnih proizvodov v vesoljski tehniki - Nabava plošč tiskanih vezij
Ta standard določa zahteve, ki veljajo za odjemalca, dobavitelja in kvalificiranega proizvajalca plošč tiskanih vezij za nabavo plošč tiskanih vezij. Zahteve iz točke 7 se uporabljajo za kvalifikacijo in nabavo dokončanih plošč tiskanih vezij ter ne zajemajo proizvodnih odstopanj. Ta standard se uporablja za naslednje vrste plošč: – toge plošče tiskanih vezij (enostranske, dvostranske, večslojne, zaporedne večslojne in plošče tiskanih vezij s kovinsko sredico); – gibljive plošče tiskanih vezij (enostranske in dvostranske); – toge-gibljive plošče tiskanih vezij (večslojne in zaporedne večslojne); – visokofrekvenčne plošče tiskanih vezij; – posebne plošče tiskanih vezij. Plošče tiskanih vezij se uporabljajo za nameščanje komponent za izdelavo sestavov plošč tiskanih vezij, ki izvajajo kompleksne električne funkcije. Plošče tiskanih vezij so med sestavljanjem podvržene toplotno-mehanskim obremenitvam, kot je nameščanje komponent s spajkanjem, predelavo in popravilom pod normalnimi zemeljskimi pogoji. Poleg tega pa so sestavljene plošče tiskanih vezij podvržene okolju, ki ga povzročijo izstrelitev in vesoljski poleti. Zato je kvalifikacija dobavitelja plošč tiskanih vezij v skladu s standardom ECSS-Q-ST-70-10 izredno pomembna pred nabavo plošč tiskanih vezij za uporabo v vesolju. Ta standard se lahko prilagodi posameznim lastnostim in omejitvam vesoljskega projekta v skladu s standardom ECSS-S-ST-00.
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Standards Content (Sample)
SLOVENSKI STANDARD
01-april-2015
=DJRWDYOMDQMHYDUQLKSURL]YRGRYYYHVROMVNLWHKQLNL1DEDYDSORãþWLVNDQLKYH]LM
Space product assurance - Procurement of printed circuit boards
Raumfahrtproduktsicherung - Beschaffung von Leiterplatten
Assurance produit des projets spatiaux - Approvisionnement des circuits imprimés
Ta slovenski standard je istoveten z: EN 16602-70-11:2015
ICS:
31.180 7LVNDQDYH]MD 7,9 LQWLVNDQH Printed circuits and boards
SORãþH
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD
EN 16602-70-11
NORME EUROPÉENNE
EUROPÄISCHE NORM
January 2015
ICS 31.180; 49.140
English version
Space product assurance - Procurement of printed circuit
boards
Assurance produit des projets spatiaux - Raumfahrtproduktsicherung - Beschaffung von Leiterplatten
Approvisionnement des circuits imprimés
This European Standard was approved by CEN on 11 October 2014.
CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2015 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16602-70-11:2015 E
worldwide for CEN national Members and for CENELEC
Members.
Table of contents
Foreword . 4
1 Scope . 5
2 Normative references . 6
3 Terms, definitions and abbreviated terms . 7
3.1 Terms from other standards . 7
3.2 Terms specific to the present standard . 7
3.3 Abbreviated terms. 10
4 Principles . 11
5 Requirements . 12
5.1 Procurement of PCBs . 12
5.1.1 General . 12
5.1.2 Design and layout . 12
5.2 Base materials . 13
5.2.1 Base laminate materials . 13
5.2.2 Basic metallic layer . 14
5.2.3 Plated metallic layers and finishes . 14
5.2.4 Special materials . 15
5.3 PCB delivery . 16
5.3.1 Marking . 16
5.3.2 Associated test coupons . 16
5.3.3 Outgoing inspection and PCB manufacturer data package . 17
5.4 Packaging . 17
5.4.1 Handling and storage . 17
5.4.2 Packaging . 17
5.5 Supplier acceptance of PCBs . 18
5.5.1 Supplier acceptance inspection . 18
5.5.2 Electrical test . 18
6 Inspection of PCBs . 19
6.1 General . 19
6.2 Visual inspection and non-destructive test . 19
6.2.1 Verification of marking . 19
6.2.2 Visual aspects . 19
6.2.3 External dimensions . 22
6.2.4 Warp . 23
6.2.5 Twist . 23
6.3 Microsection inspection criteria . 24
6.3.1 General . 24
6.3.2 Thickness of metal-plating . 25
6.3.3 Aspect of plated-through holes . 27
7 Requirements for PCBs . 30
7.1 Rigid single-sided and double-sided PCBs . 30
7.2 Rigid single-sided and double-sided PCBs for high frequency application . 32
7.3 Flexible PCBs . 35
7.4 Rigid-flex PCBs . 36
7.5 Rigid multilayer PCBs . 37
7.6 Sequential rigid multilayer PCBs . 39
Annex A (normative) PCB Certificate of conformance (CoC) – DRD . 43
Bibliography . 45
Figures
Figure 6-1: Arbitrary defects on conductors . 22
Figure 6-2: Arbitrary defects on spacing between conductors. 22
Figure 6-3: Misalignment of cover layer (for flexible PCBs) . 22
Figure 6-4: Warp . 23
Figure 6-5: Twist. 24
Figure 6-6: Dimensional parameters to be measured . 24
Figure 6-7: Microsection of a PTH . 26
Figure 6-8: Undercut for PCBs with fused SnPb finish . 27
Figure 6-9: Undercut for PCBs with Au/Ni or Au finish . 27
Figure 6-10: Overhang for PCBs with Au/Ni or Au finish . 27
Figure 6-11: Microsection in PTH: Possible defects . 28
Figure 6-12: Microsection of PTH: Possible defects . 29
Figure 6-13: Voids in resin inside buried vias . 29
Figure A-1 : Example of a PCB CoC . 44
Foreword
This document (EN 16602-70-11:2015) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN.
This standard (EN 16602-70-11:2015) originates from ECSS-Q-ST-70-11C.
This European Standard shall be given the status of a national standard, either
by publication of an identical text or by endorsement, at the latest by July 2015,
and conflicting national standards shall be withdrawn at the latest by July 2015.
Attention is drawn to the possibility that some of the elements of this document
may be the subject of patent rights. CEN [and/or CENELEC] shall not be held
responsible for identifying any or all such patent rights.
This document has been prepared under a mandate given to CEN by the
European Commission and the European Free Trade Association.
This document has been developed to cover specifically space systems and has
therefore precedence over any EN covering the same scope but with a wider
domain of applicability (e.g. : aerospace).
According to the CEN-CENELEC Internal Regulations, the national standards
organizations of the following countries are bound to implement this European
Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France,
Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,
Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United
Kingdom.
Scope
This Standard defines the requirements imposed on the customer, the supplier
and the qualified PCB manufacturer for PCB procurement.
The requirements of clause 7 apply to both qualification and procurement of
finished PCBs and do not include the manufacturing tolerances.
This Standard is applicable for the following type of boards:
• Rigid PCBs (single-sided, double-sided, multilayer, sequential multilayer
and PCBs with metal core)
• Flexible PCBs (single-sided and double-sided)
• Rigid-flex PCBs (multilayer and sequential multilayer)
• High frequency PCBs
• Special PCBs.
PCBs are used for the mounting of components in order to produce PCB
assemblies performing complex electrical functions. The PCBs are subjected to
thermo-mechanical stresses during their assembly such as mounting of
components by soldering, rework and repair under normal terrestrial
conditions. In addition the assembled PCB is subjected to the environment
imposed by launch and space flights. Therefore the qualification of a PCB
supplier to ECSS-Q-ST-70-10 is of extreme importance before the procurement
of PCB for space usage.
This standard may be tailored for the specific characteristics and constraints of a
space project in conformance with ECSS-S-ST-00.
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references, subsequent amendments to, or revision of any of these publications
do not apply. However, parties to agreements based on this ECSS Standard are
encouraged to investigate the possibility of applying the more recent editions of
the normative documents indicated below. For undated references, the latest
edition of the publication referred to applies.
EN reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS system — Glossary of terms
EN 16602-70 ECSS-Q-ST-70 Space product assurance — Material, mechanical
parts and processes
EN 16602-70-02 ECSS-Q-ST-70-02 Space product assurance — Thermal vacuum
outgassing test for the screening of space materials
EN 16602-70-07 ECSS-Q-ST-70-07 Space product assurance — Verification and
approval of automatic machine wave soldering
EN 16602-70-08 ECSS-Q-ST-70-08 Space product assurance — Manual soldering of
high-reliability electrical connections
EN 16602-70-10 ECSS-Q-ST-70-10 Space product assurance — Qualification of printed
circuit boards
EN 16602-70-28 ECSS-Q-ST-70-28 Space product assurance — Repair and modification
of printed circuit board assemblies for space use
EN 16602-70-38 ECSS-Q-ST-70-38 Space product assurance — High-reliability soldering
for surface-mount and mixed technology
printed-circuit boards
IEC 60249 (1993-05) Base materials for printed circuits
IEC 60326-2-am 1 Printed boards.
...
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